Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2009
02/26/2009US20090050933 Semiconductor light-receiving device and method for manufacturing the same
02/26/2009US20090050932 Semiconductor device and the method of manufacturing the same
02/26/2009US20090050929 Semiconductor substrate with nitride-based buffer layer for epitaxy of semiconductor opto-electronic device and fabrication thereof
02/26/2009US20090050928 Zinc-blende nitride semiconductor free-standing substrate, method for fabricating same, and light-emitting device employing same
02/26/2009US20090050925 Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
02/26/2009US20090050915 Group III-V nitride semiconductor substrate and method for producing same
02/26/2009US20090050913 Method for achieving low defect density algan single crystal boules
02/26/2009US20090050909 Light-emitting diode apparatus and manufacturing method thereof
02/26/2009US20090050903 Selective wet etching of gold-tin based solder
02/26/2009US20090050902 Semiconductor device having silicon carbide and conductive pathway interface
02/26/2009US20090050901 Glass-ceramic-based semiconductor-on-insulator structures and method for making the same
02/26/2009US20090050898 Silicon carbide semiconductor device and method for producing the same
02/26/2009US20090050897 Substrate, method of polishing the same, and polishing apparatus
02/26/2009US20090050896 Display device
02/26/2009US20090050895 Semiconductor manufacturing method, semiconductor manufacturing apparatus, and display unit
02/26/2009US20090050894 Thin film transistor, method of fabricating the same, organic light emitting diode display device haing the tft, and method of fabricating the oled display device
02/26/2009US20090050893 Thin film transistor, method of fabricating the same, and organic light emitting diode display device including the same
02/26/2009US20090050890 Contact structure
02/26/2009US20090050888 Semiconductor device and manufacturing method thereof
02/26/2009US20090050887 Chip on film (cof) package having test pad for testing electrical function of chip and method for manufacturing same
02/26/2009US20090050885 Semiconductor wafers and methods of fabricating semiconductor devices
02/26/2009US20090050884 Thin film transistors using thin film semiconductor materials
02/26/2009US20090050881 Photoelectric conversion element, method for producing photoelectric conversion element, and solid-state imaging device
02/26/2009US20090050876 Transparent Nanowire Transistors and Methods for Fabricating Same
02/26/2009US20090050872 Process for manufacturing a copper compatible chalcogenide phase change memory element and corresponding phase change memory element
02/26/2009US20090050871 Semiconductor device and process for producing the same
02/26/2009US20090050870 Integrated circuit including memory element with spatially stable material
02/26/2009US20090050867 Feature formed beneath an existing material during fabrication of a semiconductor device and electronic systems comprising the semiconductor device
02/26/2009US20090050518 Wafer container with cushion sheets
02/26/2009US20090050475 Hafnium Alloy Target and Process for Producing the Same
02/26/2009US20090050352 Substrate structures for flexible electronic devices and fabrication methods thereof
02/26/2009US20090050272 Deposition ring and cover ring to extend process components life and performance for process chambers
02/26/2009US20090050271 Mask trimming
02/26/2009US20090050270 Sensors for dynamically detecting substrate breakage and misalignment of a moving substrate
02/26/2009US20090050210 Methods for Operating Liquid Chemical Delivery Systems Having Recycling Elements
02/26/2009US20090050208 Method and structures for controlling the group iiia material profile through a group ibiiiavia compound layer
02/26/2009US20090050205 Method of optimizing the band edge positions of the conduction band and the valence band of a semiconductor material for use in photoactive devices
02/26/2009US20090050198 Solar-Cell Marking Method and Solar Cell
02/26/2009US20090050056 Substrate processing apparatus and semiconductor manufacturing method thereof
02/26/2009US20090049911 Integrated micro electro-mechanical system and manufacturing method thereof
02/26/2009US20090049683 Apparatus and method for manufacturing printed circuit board
02/26/2009DE202007018660U1 Hochtemperaturlöten High temperature brazing
02/26/2009DE19982566B4 Einrichtung und Verfahren zum Bearbeiten eines Substrats Apparatus and method for processing a substrate
02/26/2009DE19964580B4 Verfahren zum Überprüfen eines Objektbelichtungsmusters A method for checking an object exposure pattern
02/26/2009DE112007000868T5 Zeitgerichteter gleitender Mittelwertfilter Time Directional moving average filter
02/26/2009DE112006003839T5 Verfahren zur Herstellung eines dünnen Halbleiter-Chips A process for producing a thin semiconductor chips
02/26/2009DE112006003485T5 Vorrichtung zum Herstellen einer Halbleiterdünnschicht An apparatus for manufacturing a semiconductor thin film
02/26/2009DE112006001279T5 Mehrschichtensubstrat eines Nitridhalbleiters der Gruppe 3-5, Verfahren zur Herstellung eines freitragenden Substrats eines Nitridhalbleiters der Gruppe 3-5 und Halbleiterelement Multi-layer substrate of a nitride semiconductor of Group 3-5, method for producing a self-supporting substrate of a nitride semiconductor of the Group 3-5 and semiconductor element
02/26/2009DE112004002401B4 Herstellung abrupter Übergänge in Bauelementen unter Anwendung des "Dotierstoffschneepflugeffektes" ("Dopant Snowplow Effect") beim Silizidwachstum Producing abrupt transitions in devices using the "Dotierstoffschneepflugeffektes" ("dopant Snowplow Effect") when Silizidwachstum
02/26/2009DE10349087B4 Verfahren zur Herstellung von Halbton-Phasenverschiebungsmasken-Rohlingen A process for the production of halftone phase shift mask blanks
02/26/2009DE102008039068A1 Halbleitervorrichtung Semiconductor device
02/26/2009DE102008039058A1 Halbleiterwafer für Halbleiterbauelemente und Verfahren zur Herstellung derselben Semiconductor wafer for semiconductor devices and methods of making the same
02/26/2009DE102008038752A1 NOR-Flash-Speicherbauteil und Verfahren zum Herstellen desselben Thereof NOR flash memory device and method for producing
02/26/2009DE102008038454A1 Integrierter Schaltkreis mit einem ersten Kanal und einem zweiten Kanal An integrated circuit having a first channel and a second channel
02/26/2009DE102008037835A1 Elektronische Komponente mit Pufferschicht Electronic component with buffer layer
02/26/2009DE102008036112A1 Leistungshalbleitermodul The power semiconductor module
02/26/2009DE102008034574A1 Integrierte Schaltung mit einem Halbleitersubstrat mit einer Barrierenschicht An integrated circuit comprising a semiconductor substrate with a barrier layer
02/26/2009DE102008034387A1 Wafer-Ebenen-Packungsstruktur mit Aufbau-Schichten Wafer-level package structure with build-layers
02/26/2009DE102008033683A1 Integrierte Speicherschaltung mit Speicherzellen auf benachbarten Sockeln mit unterschiedlichen Höhen und Herstellungsverfahren dafür An integrated circuit memory with memory cells on adjacent headers with different heights and producing method thereof
02/26/2009DE102008033353A1 Integrierte Schaltung, die ein unter Druck eingefülltes, seine Resistivität änderndes Material aufweist Integrated circuit comprising a under pressure is completed, its resistivity change material
02/26/2009DE102008033234A1 Feldeffekttransistor Field-effect transistor
02/26/2009DE102008032953A1 Integrierte Schaltung, Schaltungssystem und Herstellungsverfahren An integrated circuit, circuit system and production method
02/26/2009DE102008032395A1 Halbleiterbauelement Semiconductor device
02/26/2009DE102008030348A1 Chipstapelstruktur und Verfahren zu ihrer Herstellung Stack structure and process for their preparation
02/26/2009DE102008029866A1 Laterales DMOS-Bauelement und Verfahren zu seiner Herstellung Lateral DMOS device and process for its preparation
02/26/2009DE102008029194A1 Verfahren zum Ausbilden einer Metallelektrode eines Systems in einem Gehäuse A method of forming a metal electrode of a system in a housing
02/26/2009DE102007047933B3 Semiconductor wafer surface e.g. front side or rear side, inspecting method for detecting defects on wafer surface, involves processing parameter or type of image receiving for area fixed on surface with detection sensitivity of area
02/26/2009DE102007039916A1 Aufbau- und Verbindungstechnik von Modulen mittels dreidimensional geformter Leadframes Packaging technology of modules using three-dimensional molded leadframe
02/26/2009DE102007039021A1 Verfahren zum reproduzierbaren Bestimmen von Objekteigenschaften Reproducible method for determining object properties
02/26/2009DE102007030284A1 Verfahren zum Verpacken von Halbleiter-Bauelementen und verfahrensgemäß hergestellten Erzeugnis A method of packaging semiconductor components and product prepared according to the method
02/26/2009DE102007025947B4 Integrierter kapazitiver Sensor Integrated capacitive sensor
02/26/2009DE102006033870B4 Elektronisches Bauteil mit mehreren Substraten sowie ein Verfahren zur Herstellung desselben The same electronic component having a plurality of substrates, and a process for preparing
02/26/2009DE102006023879B4 Verfahren zum Häusen eines Bildsensors und ein gehäuster Bildsensor A method of packaging a image sensor and a housed image sensor
02/26/2009DE102004054818B4 Verfahren zum reversiblen Oxidationsschutz von Mikro-Bauelementen A method for reversible oxidation protection of micro-components
02/26/2009DE102004004885B4 Magnetspeicher Magnetic memory
02/26/2009DE10165034B4 Halbton-Phasenverschiebungsmaske und -maskenrohling Halftone phase shift mask and -maskenrohling
02/26/2009DE10164943B4 Halbleitervorrichtung, umfassend als Zwischenschicht-Isolationsfilm einen Film mit niedriger Dielektrizitätskonstante A semiconductor device comprising, as an interlayer insulation film a low dielectric constant film
02/26/2009DE10126734B4 Umverdrahtungsverfahren und damit hergestelltes Bauelement Umverdrahtungsverfahren and thus component produced
02/26/2009DE10119766B4 RF Plasma Reaktor RF plasma reactor
02/26/2009DE10082309B4 Phasenschieberfilm, Phasenschiebermaskenrohling, Phasenschiebermaske, Herstellungsverfahren für dieselben sowie Belichtungsverfahren Phase shifting film phase shift mask blank, phase shift mask manufacturing method for the same and exposure method
02/25/2009EP2028691A2 Sacrificial structures for crack propagation confinement in a substrate comprising a plurality of ICs
02/25/2009EP2028690A2 Electromagnetic noise suppressor, semiconductor device using the same, and method of manufacturing the same
02/25/2009EP2028687A1 Thin film transistor, method of fabricating the same, and organic light emitting diode display device including the same
02/25/2009EP2028686A1 Method for electrodepositing a metal, especially copper, and use of said method
02/25/2009EP2028685A1 Manufacturing method for SSOI substrate
02/25/2009EP2028684A2 Semiconductor integrated circuit device and method of manufacturing the same
02/25/2009EP2028683A1 Coating liquid for gate insulating film, gate insulating film and organic transistor
02/25/2009EP2028682A1 Ideal oxygen precipitating silicon wafers and oxygen out-diffusion-less process thereof
02/25/2009EP2028681A1 Reflective mask blank for euv lithography
02/25/2009EP2028666A1 High-capacitance density thin-film dielectrics having columnar grains formed on base-metal foils
02/25/2009EP2028578A2 Cooling system, exposure apparatus having the same, and device manufacturing method
02/25/2009EP2028547A1 Lithographic apparatus and device manufacturing method
02/25/2009EP2028543A2 Method of fabricating an integrated circuit using two mask layers
02/25/2009EP2028522A1 Optical element and optical device
02/25/2009EP2028378A2 Mechanism for varying the end of stroke position of a cylinder and substrate processing apparatus including same
02/25/2009EP2028262A2 Improved alkaline chemistry for post-cmp cleaning
02/25/2009EP2028215A1 Silicon compound, ultraviolet absorbent, method for manufacturing multilayer wiring device and multilayer wiring device
02/25/2009EP2027970A1 Polishing composition and polishing method
02/25/2009EP2027966A1 Sample traveling stage with flexure mechanism module to absorb the deformation of the slide
02/25/2009EP2027948A1 Method for producing a flat section, in particular a cooling body for semiconductor elements or similar components, and section for same