| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 03/05/2009 | US20090057713 Semiconductor device with a semiconductor body |
| 03/05/2009 | US20090057710 Insulated Gate Bipolar Transistor and Method for Manufacturing the Same |
| 03/05/2009 | US20090057708 LED Light Source Having Improved Resistance to Thermal Cycling |
| 03/05/2009 | US20090057705 Semiconductor Element Mounting Substrate, Semiconductor Device Using the Same, and Method for Manufacturing Semiconductor Element Mounting Substrate |
| 03/05/2009 | US20090057703 Semiconductor light emitting device and method of fabricating thereof |
| 03/05/2009 | US20090057692 Semiconductor light emitting device and method for manufacturing the same |
| 03/05/2009 | US20090057691 Semiconductor light emitting device and method of manufacturing the same |
| 03/05/2009 | US20090057690 Wafer level phosphor coating technique for warm light emitting diodes |
| 03/05/2009 | US20090057688 Optical semiconductor device and manufacturing method therefor |
| 03/05/2009 | US20090057687 Light emitting diode module |
| 03/05/2009 | US20090057686 Semiconductor device and electric power converter, drive inverter, general-purpose inverter and super-power high-frequency communication equipment using the semiconductor device |
| 03/05/2009 | US20090057684 Nitride semiconductor device and method for producing nitride semiconductor device |
| 03/05/2009 | US20090057682 Active matrix substrate, display device, television receiver, manufacturing method of active matrix substrate, forming method of gate insulating film |
| 03/05/2009 | US20090057681 Thin-film device, method for manufacturing thin-film device, and display |
| 03/05/2009 | US20090057679 Thin film transistor and manufacturing method thereof |
| 03/05/2009 | US20090057678 Method of Forming an Integrated Circuit and Integrated Circuit |
| 03/05/2009 | US20090057677 Ferroelectric device and method for fabricating the same |
| 03/05/2009 | US20090057676 Thin film semiconductor device |
| 03/05/2009 | US20090057675 Display device and electronic appliance including the display device |
| 03/05/2009 | US20090057674 Thin film transistor, light-emitting display device having the same and associated methods |
| 03/05/2009 | US20090057672 Display device and manufacturing method of the same |
| 03/05/2009 | US20090057671 Thin-film transistor substrate, method of manufacturing same and display apparatus having same |
| 03/05/2009 | US20090057670 Semiconductor Device and Process for Production Thereof |
| 03/05/2009 | US20090057668 Display Element and Method of Manufacturing the Same |
| 03/05/2009 | US20090057667 Display device and method for fabricating the same |
| 03/05/2009 | US20090057666 Pixel structure and fabricating method thereof |
| 03/05/2009 | US20090057663 Oxide thin film transistor and method of manufacturing the same |
| 03/05/2009 | US20090057662 Nanoparticle Semiconductor Device and Method for Fabricating |
| 03/05/2009 | US20090057661 Method for Chemical Mechanical Planarization of Chalcogenide Materials |
| 03/05/2009 | US20090057660 Method of fabricating substrateless thin film field-effect devices and an organic thin film transistor obtainable by the method |
| 03/05/2009 | US20090057658 Organic thin film transistor substrate and method of manufacturing the same |
| 03/05/2009 | US20090057655 Organic thin film transistor comprising gate electrode of nanocrystalline conductive carbon layer, fabrication method thereof, and organic semiconductor device comprising the same |
| 03/05/2009 | US20090057653 Methods for site-selective growth of horizontal nanowires, nanowires grown by the methods and nanodevices comprising the nanowires |
| 03/05/2009 | US20090057651 Gated Quantum Resonant Tunneling Diode Using CMOS Transistor with Modified Pocket and LDD Implants |
| 03/05/2009 | US20090057649 organic semiconductor layer comprises heterocyclic compound containing nitrogen atom formed by condensation between five member rings each having nitrogen atom at their condensation sites or between five member ring and six member ring each having nitrogen atom at their condensation sites; fast response |
| 03/05/2009 | US20090057648 High Hole Mobility P-Channel Ge Transistor Structure on Si Substrate |
| 03/05/2009 | US20090057646 Optical semiconductor device and method for manufacturing the same |
| 03/05/2009 | US20090057642 Memory Device |
| 03/05/2009 | US20090057556 Method and apparatus of an inspection system using an electron beam |
| 03/05/2009 | US20090057414 Method of Producing a Contactless Microelectronic Device, Such as for an Electronic Passport |
| 03/05/2009 | US20090057266 Line edge roughness control |
| 03/05/2009 | US20090057143 Film-depositing target and preparation of phase shift mask blank |
| 03/05/2009 | US20090057142 Hafnium Alloy Target and Process for Producing the Same |
| 03/05/2009 | US20090056878 Transfer apparatus |
| 03/05/2009 | US20090056807 Solar cell and fabricating process thereof |
| 03/05/2009 | US20090056800 Surface Passivation of Silicon Based Wafers |
| 03/05/2009 | US20090056799 Photovoltaic cells with selectively patterned transparent conductive coatings, and associated methods |
| 03/05/2009 | US20090056798 Thick Film Pastes For Fire Through Applications In Solar Cells |
| 03/05/2009 | US20090056626 Apparatus for cyclical depositing of thin films |
| 03/05/2009 | US20090056513 Cleaving Wafers from Silicon Crystals |
| 03/05/2009 | US20090056463 Semiconductor Pressure Sensor and Method for Manufacturing Semiconductor Pressure Sensor |
| 03/05/2009 | US20090056441 Process condition measuring device |
| 03/05/2009 | US20090056428 Cantilever probe and applications of the same |
| 03/05/2009 | US20090056113 Strap assembly comprising functional block deposited therein and method of making same |
| 03/05/2009 | US20090056112 Electrostatic chuck member, method of manufacturing the same, and electrostatic chuck device |
| 03/05/2009 | US20090056102 Method for fabricating semiconductor device |
| 03/05/2009 | US20090056092 Method of forming isolation layer in semiconductor device |
| 03/05/2009 | DE202006020613U1 Einrichtung zum Positionieren und Lageerhalten von dünnen Substraten am geschnittenen Substralblock Means for positioning and location obtaining thin substrates on the cut Substralblock |
| 03/05/2009 | DE19630150B4 Verfahren zum Entwerfen einer Halbleitervorrichtung A method of designing a semiconductor device |
| 03/05/2009 | DE112005002428T5 Doppelgate- und Trigate-Transistoren mit unabhängigem Zugriff in demselben Prozeßfluß Doppelgate- and tri-gate transistors with independent access to the same process flow |
| 03/05/2009 | DE112004002702B4 Verfahren zum Herstellen einer Halbleiterbaugruppe und Matrixbaugruppe A method of manufacturing a semiconductor package and matrix assembly |
| 03/05/2009 | DE112004002017B4 Verfahren zum epitaktischen Abscheiden von Source/Drain von MOSFETs A method for epitaxial deposition of the source / drain of MOSFET |
| 03/05/2009 | DE10339283B9 Verfahren zum Entwurf von integrierten Schaltkreisen mit Ersatz-Logikgattern A method of designing integrated circuits with spare logic gates |
| 03/05/2009 | DE10323013B4 Verfahren zur Herstellung eines Halbleiterbauelementes mit PMOS- und NMOS-Transistor A process for producing a semiconductor device with PMOS and NMOS transistor |
| 03/05/2009 | DE10234155B4 Preßgespritztes Leistungsbauelement Preßgespritztes power device |
| 03/05/2009 | DE102008044754A1 Flüssigkeitsbearbeitungsvorrichtung, Flüssigkeitsbearbeitungsverfahren und Speichermedium Liquid processing apparatus, liquid processing method and storage medium |
| 03/05/2009 | DE102008044753A1 Substratbearbeitungsvorrichtung und Verfahren Substrate processing apparatus and method |
| 03/05/2009 | DE102008039882A1 LCD-Treiber-IC und Verfahren zu dessen Herstellung LCD driver IC and process for its preparation |
| 03/05/2009 | DE102008039845A1 Halbleiterbauelement mit einem Halbleiterkörper A semiconductor device comprising a semiconductor body |
| 03/05/2009 | DE102008039706A1 Halbleiterbauelement Semiconductor device |
| 03/05/2009 | DE102008039266A1 Halbleiterfabrik Semiconductor factory |
| 03/05/2009 | DE102008034164A1 Halbleitermodul Semiconductor module |
| 03/05/2009 | DE102007053600A1 Verfahren zur Herstellung eines Metalls direkt auf einer leitenden Barrierenschicht durch elektrochemische Abscheidung unter Anwendung einer sauerstoffarmen Umgebung A process for the production of a metal directly onto a conductive barrier layer by electrochemical deposition using a low oxygen environment |
| 03/05/2009 | DE102007041926A1 Method for electrical insulation of unpackaged electronic construction element, particularly high power element or semiconductor high power element, involves fastening or electrical contacting of connection surface on lower surface |
| 03/05/2009 | DE102007041921A1 Verfahren zur Herstellung und Kontaktierung von elektronischen Bauelementen mittels einer Substratplatte, insbesondere DCB-Keramik-Substratplatte A process for preparing and contacting of electronic components by means of a substrate plate, in particular DCB-ceramic substrate board |
| 03/05/2009 | DE102007041911A1 Device for replacement of electronic components from film, particularly from un-packed semiconductor chips of cohesive mounting film, has base element, where multiple recesses are formed at front side of base element |
| 03/05/2009 | DE102007041885A1 Verfahren zum Zerteilen eines Halbleitersubstrats und Verfahren zum Herstellen einer Halbleiterschaltungsanordnung A method for dividing a semiconductor substrate and method for fabricating a semiconductor circuit arrangement |
| 03/05/2009 | DE102007041407A1 Verfahren zur Herstellung einer Halbleiteranordnung, Verwendung einer Grabenstruktur und Halbleiteranordnung A method of manufacturing a semiconductor device using a semiconductor device structure, and grave |
| 03/05/2009 | DE102007041332A1 Transferchuck zur Übertragung, insbesondere von Wafern Chuck transfer for transmission, in particular wafers |
| 03/05/2009 | DE102007041229A1 Schaltungsanordnung und ein Verfahren zum Verkapseln derselben Circuit arrangement and a method for encapsulating the same |
| 03/05/2009 | DE102007041210A1 Verspannungsübertragung in einem Zwischenschichtdielektrikum durch Vorsehen einer verspannten dielektrischen Schicht über einem verspannungsneutralen dielektrischen Material in einem Halbleiterbauelement Tension transmission in an interlayer by providing a stressed dielectric layer over a stress-neutral dielectric material in a semiconductor device |
| 03/05/2009 | DE102007041209A1 Polierkopf, der Zonenkontrolle verwendet Polishing head zone control used |
| 03/05/2009 | DE102007041207A1 CMOS-Bauelement mit Gateisolationsschichten mit unterschiedlicher Art und Dicke und Verfahren zur Herstellung CMOS device with gate insulation layers having different types and thickness, and process for preparing |
| 03/05/2009 | DE102007041206A1 Verfahren zum selbstjustierten Entfernen eines Gatedielektrikums mit großem ε über einem STI-Gebiet A method of removing a self-aligned gate dielectric with large ε over a STI region |
| 03/05/2009 | DE102007040851A1 Verfahren zum Reinigen von polykristallinem Silicium Method for cleaning polycrystalline silicon |
| 03/05/2009 | DE102007040833A1 Elastic contact bump's metallic layer manufacturing method for integrated circuit e.g. LCD display, involves forming elevations on surface, and applying photoresist on surface so that photoresistive structure is formed between elevations |
| 03/05/2009 | DE102007040385A1 Method for manufacturing silicon wafers, involves cutting rectangular and silicon block with side surface, where side surfaces of silicon block are smoothed and polished parallel to edge of silicon wafer before cutting |
| 03/05/2009 | DE102007036147A1 Verfahren zum Herstellen eines Halbleiterkörpers mit einer Rekombinationszone, Halbleiterbauelement mit einer Rekombinationszone und Verfahren zum Herstellen eines solchen Halbleiterbauelements A method of manufacturing a semiconductor body with a recombination zone, semiconductor device with a recombination and method for manufacturing such a semiconductor device |
| 03/05/2009 | DE102007022748B4 Verfahren zur Strukturierung eines Materials und strukturiertes Material Method for structuring a material and structured material |
| 03/05/2009 | DE102006006561B4 Flip-Chip-Modul und Verfahren zum Austauschen eines Halbleiterchips eines Flip-Chip-Moduls Flip-chip module and method for replacing a semiconductor chip of a flip-chip module |
| 03/05/2009 | DE102004029436B4 Verfahren zum Herstellen eines Festkörperelektrolytmaterialbereichs A method for producing a solid electrolyte material region |
| 03/05/2009 | DE102004013626B4 Verfahren und Vorrichtung zur Abscheidung dünner Schichten Method and device for depositing thin layers |
| 03/05/2009 | DE10196596B4 Verfahren zur Herstellung einer Kristallschicht in einer Verbindungshalbleiter-Mehrschichtsstruktur A process for producing a crystal layer in a compound semiconductor multilayer structure |
| 03/04/2009 | EP2031654A2 Method for manufacturing a structure for epitaxy with no exclusion zone |
| 03/04/2009 | EP2031653A2 Semiconductor device having multiple element formation regions and manufacturing method thereof |
| 03/04/2009 | EP2031652A2 Method for manufacturing a semiconductor assembly, utilisation and semiconductor assembly |
| 03/04/2009 | EP2031651A2 Container changing system and container changing method |
| 03/04/2009 | EP2031650A2 Method for inductive measurement of a layer resistance of a dosing layer in a multi-crystalline semiconductor wafer |
| 03/04/2009 | EP2031649A2 Manufacture method for ZnO-containing compound semiconductor layer |
| 03/04/2009 | EP2031648A2 Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides |