Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2009
02/17/2009US7491605 Zero cost non-volatile memory cell with write and erase features
02/17/2009US7491604 Trench memory with monolithic conducting material and methods for forming same
02/17/2009US7491603 Transistors of semiconductor device having channel region in a channel-portion hole and methods of forming the same
02/17/2009US7491602 Structures and methods for improved capacitor cells in integrated circuits
02/17/2009US7491601 Methods of forming electronic devices including electrodes with insulating spacers thereon
02/17/2009US7491600 Nanocrystal bitcell process integration for high density application
02/17/2009US7491599 Gated diode nonvolatile memory process
02/17/2009US7491598 CMOS circuits including a passive element having a low end resistance
02/17/2009US7491597 Flash memory device capable of erasing flash blocks in SOI substrate based on back-bias, method for manufacturing the same, and flash block erasion method and structure thereof
02/17/2009US7491596 Fabrication method of CMOS image sensor integrated with 1-T SRAM
02/17/2009US7491595 Creating high voltage FETs with low voltage process
02/17/2009US7491594 Methods of generating planar double gate transistor shapes
02/17/2009US7491592 Thin film transistor device with high symmetry
02/17/2009US7491591 Thin film transistor having LDD structure
02/17/2009US7491590 Method for manufacturing thin film transistor in display device
02/17/2009US7491589 Back gate FinFET SRAM
02/17/2009US7491588 Method and structure for buried circuits and devices
02/17/2009US7491587 Method for making a semiconductor device having a semiconductor-on-insulator (SOI) configuration and including a superlattice on a thin semiconductor layer
02/17/2009US7491586 Semiconductor device with leakage implant and method of fabrication
02/17/2009US7491584 ESD protection device in high voltage and manufacturing method for the same
02/17/2009US7491583 Power module fabrication method and structure thereof
02/17/2009US7491582 Method for manufacturing semiconductor device and semiconductor device
02/17/2009US7491581 Dicing technique for flip-chip USP wafers
02/17/2009US7491580 Method of manufacturing electro-optical device
02/17/2009US7491579 Composable system-in-package integrated circuits and process of composing the same
02/17/2009US7491578 Method of forming crack trapping and arrest in thin film structures
02/17/2009US7491577 Method and apparatus for providing thermal management on high-power integrated circuit devices
02/17/2009US7491576 Yield-enhancing methods of providing a family of scaled integrated circuits
02/17/2009US7491575 Fabricating zinc oxide semiconductor using hydrolysis
02/17/2009US7491574 Reducing oxidation of phase change memory electrodes
02/17/2009US7491573 Phase change materials for applications that require fast switching and high endurance
02/17/2009US7491572 Method for fabricating an image sensor mounted by mass reflow
02/17/2009US7491571 Method of manufacturing an image sensor having microlenses formed under high pressure
02/17/2009US7491569 Method for manufacturing a patterned bottom electrode in a piezoelectric device
02/17/2009US7491568 Wafer level package and method for making the same
02/17/2009US7491567 MEMS device packaging methods
02/17/2009US7491566 Method of forming a device by removing a conductive layer of a wafer
02/17/2009US7491565 III-nitride light emitting devices fabricated by substrate removal
02/17/2009US7491564 Flip-chip nitride light emitting device and method of manufacturing thereof
02/17/2009US7491563 Nitridation of STI fill oxide to prevent the loss of STI fill oxide during manufacturing process
02/17/2009US7491562 Light emitting device and manufacturing method thereof
02/17/2009US7491561 Pixel sensor having doped isolation structure sidewall
02/17/2009US7491560 Fabricating method of flat panel display device
02/17/2009US7491559 Low-temperature polysilicon display and method for fabricating same
02/17/2009US7491557 Thin film etching method and method of fabricating liquid crystal display device using the same
02/17/2009US7491556 Efficient method of forming and assembling a microelectronic chip including solder bumps
02/17/2009US7491555 Method and semiconductor structure for monitoring the fabrication of interconnect structures and contacts in a semiconductor device
02/17/2009US7491473 Photo mask and method for controlling the same
02/17/2009US7491432 Ceramic substrate, one side thereof having wafer-retaining face having resistive heating element provided either superficially or interiorly in the substrate and a recess formed in wafer-retaining face with room to carry semiconductor manufacturing wafer
02/17/2009US7491427 Polyimidesiloxane solution composition
02/17/2009US7491422 Direct-write nanolithography method of transporting ink with an elastomeric polymer coated nanoscopic tip to form a structure having internal hollows on a substrate
02/17/2009US7491344 Method for etching an object using a plasma and an object etched by a plasma
02/17/2009US7491342 Bonded semiconductor substrate manufacturing method thereof
02/17/2009US7491308 Method of making rolling electrical contact to wafer front surface
02/17/2009US7491292 Apparatus for catching byproducts in semiconductor device fabrication equipment
02/17/2009US7491291 Apparatus for trapping residual products in semiconductor device fabrication equipment
02/17/2009US7491290 Comprising first curing agent, formed by silane coupling agent and electrically conductive particles mixed with epoxy resin to produce first adhesive material, second curing agent, formed of metal chelate or metal alcoholate and electrically conductive particles mixed with second epoxy resin
02/17/2009US7491288 Method of cutting laminate with laser and laminate
02/17/2009US7491286 Spin or immersion coating; semiconductors, insulators, and superconductors; optics, magnetism
02/17/2009US7491252 Tantalum barrier removal solution
02/17/2009US7491246 Capacitor electrodes produced with atomic layer deposition for use in implantable medical devices
02/17/2009US7491118 Chemical mechanical polishing apparatus and methods using a polishing surface with non-uniform rigidity
02/17/2009US7491117 Substrate holding apparatus
02/17/2009US7490652 Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components
02/17/2009US7490650 Workpiece processing device
02/17/2009US7490637 Transportable container including an internal environment monitor
02/12/2009WO2009021207A2 Apparatus and method for wafer edge exclusion measurement
02/12/2009WO2009021202A2 Apparatus and method for wafer edge defects detection
02/12/2009WO2009021201A1 Planar nonpolar m-plane group iii-nitride films grown on miscut substrates
02/12/2009WO2009021187A2 Method for forming self-aligned wells to support tight spacing
02/12/2009WO2009021091A1 Corrugated interfaces for multilayered interconnects
02/12/2009WO2009021005A1 Compositions and methods for substantially equalizing rates at which material is removed over an area of a structure or film that includes recesses or crevices
02/12/2009WO2009020807A1 Semiconductor memory device with bit line trench
02/12/2009WO2009020804A1 Method of depositing electrically conductive material onto a substrate
02/12/2009WO2009020799A1 Reduced metal etch rates using stripper solutions containing metal salts
02/12/2009WO2009020773A2 Semiconductor structures including tight pitch contacts and methods to form same
02/12/2009WO2009020755A2 Intermetallic conductors
02/12/2009WO2009020713A1 Stress relief of a semiconductor device
02/12/2009WO2009020678A2 Method using low temperature wafer bonding to fabricate transistors with heterojunctions of si(ge) to iii-n materials
02/12/2009WO2009020662A1 Apparatus and method for modifying optical material properties
02/12/2009WO2009020625A1 Copper polishing slurry
02/12/2009WO2009020572A2 Stack packages using reconstituted wafers
02/12/2009WO2009020524A1 Rinsing methodologies for barrier plate and venturi containment systems in tools used to process microelectronic workpieces with one or more treatment fluids, and related apparatuses
02/12/2009WO2009020512A1 Integrated circuit fabrication process using a compression cap layer in forming a silicide with minimal post-laser annealing dopant deactivation
02/12/2009WO2009020511A1 Integrated circuit fabrication process for a high melting temperature silicide with minimal post-laser annealing dopant deactivation
02/12/2009WO2009020510A1 Integrated circuit fabrication process with minimal post-laser annealing dopant deactivation
02/12/2009WO2009020467A1 Near chip scale package integration process
02/12/2009WO2009020456A1 Automatic wafer edge inspection and review system
02/12/2009WO2009020433A1 A semiconductor arrangement and a method for manufacturing the same
02/12/2009WO2009020372A1 Apparatus and method for sensing leakage current of battery
02/12/2009WO2009020367A1 Apparatus and method for sensing battery cell voltage using isolation capacitor
02/12/2009WO2009020245A2 Method of segmenting semiconductor wafer
02/12/2009WO2009020243A1 Wafer frame
02/12/2009WO2009020241A1 Semiconductor device and manufacturing method thereof
02/12/2009WO2009020235A1 Group iii nitride semiconductor epitaxial substrate
02/12/2009WO2009020228A1 Nonvolatile semiconductor storage device
02/12/2009WO2009020208A1 Radial multipolar type layout lens, and charged particle optical system device using the lens
02/12/2009WO2009020188A1 Process for producing semiconductor fine particles and the fine particles
02/12/2009WO2009020183A1 Semiconductor element and method for production of semiconductor element
02/12/2009WO2009020168A1 Display device and electronic device having the display device, and method for manufacturing thereof