Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2009
03/24/2009US7508608 Lithographically fabricated holographic optical identification element
03/24/2009US7508581 Catadioptric projection system for 157 nm lithography
03/24/2009US7508580 8-mirror microlithography projection objective
03/24/2009US7508570 Gray level method for slim-based optical lithography
03/24/2009US7508531 System and method for measuring germanium concentration for manufacturing control of BiCMOS films
03/24/2009US7508432 CCD with improved substrate voltage setting circuit
03/24/2009US7508251 Semiconductor integrated circuit apparatus
03/24/2009US7508234 Optically reconfigurable gate array write state inspection method, write state inspection device, and optically reconfigurable gate array
03/24/2009US7508220 Detection assembly and lithographic projection apparatus provided with such a detection assembly
03/24/2009US7508201 Eddy current sensor
03/24/2009US7508132 Device having a getter structure and a photomask
03/24/2009US7508124 Field emission device, display adopting the same and method of manufacturing the same
03/24/2009US7508098 Transfer apparatus
03/24/2009US7508084 CMOS image sensor
03/24/2009US7508083 Electronic component comprising a semiconductor chip and a plastic housing, and method for producing the same
03/24/2009US7508082 Semiconductor device and method of manufacturing the same
03/24/2009US7508081 Dicing die-bonding film
03/24/2009US7508080 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
03/24/2009US7508078 Electronic device, method for manufacturing electronic device, contact hole of electronic device, method for forming contact hole of electronic device
03/24/2009US7508076 Information handling system including a circuitized substrate having a dielectric layer without continuous fibers
03/24/2009US7508075 Self-aligned poly-metal structures
03/24/2009US7508074 Etch stop layer in poly-metal structures
03/24/2009US7508072 Semiconductor device with pad electrode for testing and manufacturing method of the same
03/24/2009US7508069 Managed memory component
03/24/2009US7508065 Device package and methods for the fabrication and testing thereof
03/24/2009US7508055 High heat release semiconductor and method for manufacturing the same
03/24/2009US7508052 Crack protection for silicon die
03/24/2009US7508051 Wafer with optical control modules in dicing paths
03/24/2009US7508048 Methods of fabricating a semiconductor device having multi-gate insulation layers and semiconductor devices fabricated thereby
03/24/2009US7508044 End face sensor and method of producing the same
03/24/2009US7508039 Carbon nanotube (CNT) multiplexers, circuits, and actuators
03/24/2009US7508036 Thin film transistor and manufacturing process thereof
03/24/2009US7508035 Semiconductor device and driving method of semiconductor device
03/24/2009US7508034 Single-crystal silicon substrate, SOI substrate, semiconductor device, display device, and manufacturing method of semiconductor device
03/24/2009US7508033 Semiconductor device with diamond-like carbon film on backside of substrate
03/24/2009US7508031 Enhanced segmented channel MOS transistor with narrowed base regions
03/24/2009US7508030 Semiconductor device with vertical MOSFET and method of manufacturing the same
03/24/2009US7508025 Atomic layer deposition of metal oxide and/or low asymmetrical tunnel barrier interpoly insulators
03/24/2009US7508024 Three dimensional flash cell
03/24/2009US7508022 Semiconductor device including a TCAM having a storage element formed with a DRAM
03/24/2009US7508016 CMOS imager having on-chip ROM
03/24/2009US7508015 Semiconductor device using a nitride semiconductor
03/24/2009US7508014 Field effect transistor including a gate electrode and an additional electrode
03/24/2009US7508010 Boron phoshide-based compound semiconductor device, production method thereof and light-emitting diode
03/24/2009US7508004 Light-emitting device, method for manufacturing light-emitting device, and electronic apparatus
03/24/2009US7508000 Method of fabricating self-aligned silicon carbide semiconductor devices
03/24/2009US7507999 Semiconductor device and method for manufacturing same
03/24/2009US7507996 Contact structure of a wiring and a thin film transistor array panel including the same
03/24/2009US7507995 Semiconductor memory cell and semiconductor memory device
03/24/2009US7507994 Thin film transistor array panels for a liquid crystal display and a method for manufacturing the same
03/24/2009US7507991 Electro-optical device and thin film transistor and method for forming the same
03/24/2009US7507988 Semiconductor heterostructure including a substantially relaxed, low defect density SiGe layer
03/24/2009US7507987 Method of making packets of nanostructures
03/24/2009US7507914 Micro-castellated interposer
03/24/2009US7507848 Vapor deposition of metal oxides, silicates and phosphates, and silicon dioxide
03/24/2009US7507678 Method and apparatus for forming oxynitride film and nitride film, oxynitride film, nitride film, and substrate
03/24/2009US7507677 Removable amorphous carbon CMP stop
03/24/2009US7507676 Film formation method and apparatus for semiconductor process
03/24/2009US7507675 Silicon substrate is irradiated to produce silicon oxide; reacted with 1-alkene or alkylne; Field Effect Transistor (FET) structures, gate of FET being formed by functionalized organic monolayer containing oligosaccharides or oligopeptides, capable of interacting with biological substance; biosesors
03/24/2009US7507674 Memory device including resistance change layer as storage node and method(s) for making the same
03/24/2009US7507673 Method for etching an object to be processed
03/24/2009US7507672 Plasma etching system and method
03/24/2009US7507670 Silicon electrode assembly surface decontamination by acidic solution
03/24/2009US7507669 Gap tuning for surface micromachined structures in an epitaxial reactor
03/24/2009US7507668 Chemically mechanically polishing the surface gallium-indium-arsenide-phosphide crystal using polishing slurry containing abrasive grains formed of SiO2; crystal surface having a small surface roughness can be formed at a high polishing rate and effectively
03/24/2009US7507667 Selective heating using flash anneal
03/24/2009US7507666 Manufacture method for semiconductor device having concave portions filled with conductor containing Cu as its main composition
03/24/2009US7507665 Method of manufacturing electrical parts
03/24/2009US7507664 Tungsten plug corrosion prevention method using ionized air
03/24/2009US7507663 Fabrication of semiconductor devices
03/24/2009US7507662 Ferroelectric memory and its manufacturing method
03/24/2009US7507661 Method of forming narrowly spaced flash memory contact openings and lithography masks
03/24/2009US7507660 Deposition processes for tungsten-containing barrier layers
03/24/2009US7507659 Fabrication process of a semiconductor device
03/24/2009US7507658 Semiconductor apparatus and method of fabricating the apparatus
03/24/2009US7507657 Method for fabricating storage node contact in semiconductor device
03/24/2009US7507656 Method and structure for low k interlayer dielectric layer
03/24/2009US7507654 Method for mounting electronic element on a circuit board
03/24/2009US7507653 Method of fabricating metal compound dots dielectric piece
03/24/2009US7507652 Methods of forming a composite dielectric structure and methods of manufacturing a semiconductor device including a composite dielectric structure
03/24/2009US7507651 Method for fabricating semiconductor device with bulb shaped recess gate pattern
03/24/2009US7507650 Process for producing Schottky junction type semiconductor device
03/24/2009US7507649 Method for electrical doping a semiconductor material with Cesium
03/24/2009US7507648 Methods of fabricating crystalline silicon film and thin film transistors
03/24/2009US7507647 Method of manufacturing a high voltage semiconductor device including a deep well and a gate oxide layer simultaneously
03/24/2009US7507646 Semiconductor devices and method of manufacturing them
03/24/2009US7507645 Method of forming polycrystalline semiconductor layer and thin film transistor using the same
03/24/2009US7507644 Method of forming dielectric layer of flash memory device
03/24/2009US7507642 Vapor-phase growth method, semiconductor manufacturing method and semiconductor device manufacturing method
03/24/2009US7507641 Method of producing bonded wafer
03/24/2009US7507640 Method for producing silicon wafer
03/24/2009US7507639 Wafer dividing method
03/24/2009US7507638 Ultra-thin die and method of fabricating same
03/24/2009US7507637 Method of manufacturing wafer level stack package
03/24/2009US7507636 Amorphous Si/Au eutectic wafer bonding structure
03/24/2009US7507635 CMOS image sensor and method of fabricating the same
03/24/2009US7507634 Method for fabricating a localize SOI in bulk silicon substrate including changing first trenches formed in the substrate into unclosed empty space by applying heat treatment
03/24/2009US7507633 Method and structure for improved alignment in MRAM integration
03/24/2009US7507632 Semiconductor device and manufacturing method thereof
03/24/2009US7507631 Epitaxial filled deep trench structures