| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 03/19/2009 | WO2009034967A1 Information processor, information processing method and program |
| 03/19/2009 | WO2009034963A1 Semiconductor manufacturing method, semiconductor manufacturing apparatus and display apparatus |
| 03/19/2009 | WO2009034954A1 TiO2-CONTAINING QUARTZ GLASS SUBSTRATE |
| 03/19/2009 | WO2009034926A1 Method for manufacturing electronic device |
| 03/19/2009 | WO2009034898A1 Film forming apparatus and film forming method |
| 03/19/2009 | WO2009034895A1 Substrate placing mechanism and substrate processing apparatus |
| 03/19/2009 | WO2009034893A1 Substrate placing mechanism, substrate processing apparatus, method for suppressing film deposition on substrate placing mechanism, and storage medium |
| 03/19/2009 | WO2009034869A1 Vacuum processing system and substrate transfer method |
| 03/19/2009 | WO2009034865A1 Exhaust system structure of film forming apparatus, film forming apparatus and method of disposing of exhaust gas |
| 03/19/2009 | WO2009034854A1 Transfer robot, transfer method and control method |
| 03/19/2009 | WO2009034827A1 Pressure-sensitive adhesive tape and process for producing the same |
| 03/19/2009 | WO2009034822A1 Substrate processing apparatus, method for suppressing contamination of substrate processing apparatus, and storage medium |
| 03/19/2009 | WO2009034795A1 Substrate transfer robot and vacuum processing apparatus |
| 03/19/2009 | WO2009034793A1 Flexible wiring board and bare chip mounting method |
| 03/19/2009 | WO2009034774A1 Wafer processing tape |
| 03/19/2009 | WO2009034699A1 Semiconductor device manufacturing method |
| 03/19/2009 | WO2009034605A1 Nonvolatile semiconductor memory device and method for manufacturing the same |
| 03/19/2009 | WO2009034600A1 Integrated circuit and noise measuring method |
| 03/19/2009 | WO2009034596A1 Process for producing silicic coating, silicic coating and semiconductor device |
| 03/19/2009 | WO2009034496A2 Wafer, method of manufacturing integrated circuits on a wafer, and method of storing data about said circuits |
| 03/19/2009 | WO2009034461A2 Semiconductor device and wire bonding method |
| 03/19/2009 | WO2009034362A1 Substrate for high frequency integrated circuit |
| 03/19/2009 | WO2009034113A1 Method of producing a structure by layer transfer |
| 03/19/2009 | WO2009033871A1 Method for producing a multiplicity of chips and correspondingly produced chip |
| 03/19/2009 | WO2009033837A2 Method of fabricating ultra-deep vias and three-dimensional integrated circuits using ultra-deep vias |
| 03/19/2009 | WO2009033629A1 Method and apparatus for measuring a lifetime of charge carriers |
| 03/19/2009 | WO2009033544A1 Method for annealing semiconductor components |
| 03/19/2009 | WO2009017997A9 Method for forming a semiconductor device having abrupt ultra shallow epi-tip regions |
| 03/19/2009 | WO2009014741A3 A plasma processing method for forming a film and an electronic component manufactured by the method |
| 03/19/2009 | WO2009014391A3 Preparation method of electroconductive copper patterning layer by laser irradiation |
| 03/19/2009 | WO2009014357A3 Concentric buckling based vertical probe and its fabrication method |
| 03/19/2009 | WO2009013531A3 A method of manufacturing a semiconductor device, and a semiconductor device |
| 03/19/2009 | WO2009009694A3 Solder cap application process on copper bump using solder powder film |
| 03/19/2009 | WO2009009514A3 Composite nanorods |
| 03/19/2009 | WO2009007932A3 Integrated circuits on a wafer and method of producing integrated circuits |
| 03/19/2009 | WO2009006152A3 Method and apparatus for a voltage/current probe test arrangements |
| 03/19/2009 | WO2009005295A3 Nanostructure, a method for fabricating the same, and fed, blu and fe type lamp with the nanostructure |
| 03/19/2009 | WO2008137951A3 Plating apparatus and method |
| 03/19/2009 | WO2008130493A3 Connecting microsized devices using ablative films |
| 03/19/2009 | WO2008112883A3 Die attachment method with a covex surface underfill |
| 03/19/2009 | WO2008097448A3 Methods of forming one or more covered voids in a semiconductor substrate, methods of forming field effect transistors, methods of forming semiconductor-on-insulator substrates, methods of forming a span comprising silicon dioxide, methods of cooling semiconductor devices, methods of forming electromagnetic radiation emitte |
| 03/19/2009 | WO2008093008A3 Method for preparing thin gan layers by implantation and recycling of a starting substrate |
| 03/19/2009 | WO2008073750A3 Technique for atomic layer deposition |
| 03/19/2009 | WO2008003080A3 Methods for determining wafer temperature |
| 03/19/2009 | WO2007131057A4 Vacuum processing chamber suitable for etching high aspect ratio features and components of same |
| 03/19/2009 | WO2007002040A3 Method for forming silicon-containing materials during a photoexcitation deposition process |
| 03/19/2009 | US20090077696 Methods, Systems and Computer Program Products for Measuring Critical Dimensions of Fine Patterns Using Scanning Electron Microscope Pictures and Secondary Electron Signal Profiles |
| 03/19/2009 | US20090077530 Design pattern correcting method, design pattern forming method, process proximity effect correcting method, semiconductor device and design pattern correcting program |
| 03/19/2009 | US20090077529 Design pattern correcting method, design pattern forming method, process proximity effect correcting method, semiconductor device and design pattern correcting program |
| 03/19/2009 | US20090077528 Pattern correction method, pattern correction system, mask manufacturing method, semiconductor device manufacturing method, recording medium, and designed pattern |
| 03/19/2009 | US20090077517 Semiconductor intergrated device and apparatus for designing the same |
| 03/19/2009 | US20090077516 Semiconductor integrated device and apparatus for designing the same |
| 03/19/2009 | US20090077150 Method and system for controlling a voltage waveform |
| 03/19/2009 | US20090076763 Method of detecting extraneous matter on heat processing plate, heat processing apparatus, program, and computer-readable recording medium with program recorded thereon |
| 03/19/2009 | US20090075568 Polishing pad, method of producing the same and method of producing semiconductor device by using the same |
| 03/19/2009 | US20090075491 Method for curing a dielectric film |
| 03/19/2009 | US20090075490 Method of forming silicon-containing films |
| 03/19/2009 | US20090075489 Reduction of etch-rate drift in hdp processes |
| 03/19/2009 | US20090075488 Beta-diketiminate ligand sources and metal-containing compounds thereof, and systems and methods including same |
| 03/19/2009 | US20090075487 Method of manufacturing semiconductor device |
| 03/19/2009 | US20090075486 Surface treatment solution for the fine surface processing of a glass substrate containing multiple ingredients |
| 03/19/2009 | US20090075485 Method for forming pattern of semiconductor device |
| 03/19/2009 | US20090075484 Method of Processing A Substrate, Spin Unit for Supplying Processing Materials to A Substrate, and Apparatus for Processing A Substrate Having the Same |
| 03/19/2009 | US20090075483 Ultra lightweight photovoltaic device and method for its manufacture |
| 03/19/2009 | US20090075482 Process for forming a pattern including on a semiconductor device |
| 03/19/2009 | US20090075481 Method of fabricating semiconductor substrate by use of heterogeneous substrate and recycling heterogeneous substrate during fabrication thereof |
| 03/19/2009 | US20090075480 Silicon Carbide Doped Oxide Hardmask For Single and Dual Damascene Integration |
| 03/19/2009 | US20090075479 Method of manufacturing semiconductor device |
| 03/19/2009 | US20090075478 Semiconductor device,having a through electrode, semiconductor module employing thereof and method for manufacturing semiconductor device having a through electrode |
| 03/19/2009 | US20090075477 Method of manufacturing semiconductor device |
| 03/19/2009 | US20090075476 Manufacturing method of substrate having conductive layer and manufacturing method of semiconductor device |
| 03/19/2009 | US20090075475 Method of substrate treatment, process for producing semiconductor device, substrate treating apparatus, and recording medium |
| 03/19/2009 | US20090075474 Methods for forming dual damascene wiring using porogen containing sacrificial via filler material |
| 03/19/2009 | US20090075473 Method for fabricating semiconductor device |
| 03/19/2009 | US20090075472 Methods to mitigate plasma damage in organosilicate dielectrics |
| 03/19/2009 | US20090075471 Method of manufacturing semiconductor memory device |
| 03/19/2009 | US20090075470 Method for Manufacturing Interconnect Structures Incorporating Air-Gap Spacers |
| 03/19/2009 | US20090075469 Thermo-compression bonded electrical interconnect structure and method |
| 03/19/2009 | US20090075468 System and Process for Producing Nanowire Composites and Electronic Substrates Therefrom |
| 03/19/2009 | US20090075467 Method for manufacturing a flash memory device |
| 03/19/2009 | US20090075466 Method of manufacturing a non-volatile memory device |
| 03/19/2009 | US20090075465 Methods of forming a conductive interconnect in a pixel of an imager and in other integrated circuitry |
| 03/19/2009 | US20090075464 Semiconductor device and manufacturing method thereof |
| 03/19/2009 | US20090075463 Method of fabricating t-gate |
| 03/19/2009 | US20090075462 Method of Fabricating a Semiconductor Device |
| 03/19/2009 | US20090075461 Method of processing semiconductor wafer |
| 03/19/2009 | US20090075460 Process for fabricating semiconductor device |
| 03/19/2009 | US20090075459 Apparatus and method for picking-up semiconductor dies |
| 03/19/2009 | US20090075458 Method of manufacturing device having adhesive film on back-side surface thereof |
| 03/19/2009 | US20090075457 Manufacturing method of semiconductor apparatus |
| 03/19/2009 | US20090075456 Method for manufacturing SOI substrate and method for manufacturing semiconductor device |
| 03/19/2009 | US20090075455 Growing N-polar III-nitride Structures |
| 03/19/2009 | US20090075454 Method and High Gapfill Capability for Semiconductor Devices |
| 03/19/2009 | US20090075453 Method of producing semiconductor substrate |
| 03/19/2009 | US20090075452 Substrate provided with an alignment mark in a substantially transmissive process layer, mask for exposing said mark, device manufacturing method, and device manufactured thereby |
| 03/19/2009 | US20090075451 Method for manufacturing semiconductor substrate |
| 03/19/2009 | US20090075450 Method of manufacturing stack-type capacitor and semiconductor memory device having the stack-type capacitor |
| 03/19/2009 | US20090075449 Integrated high voltage capacitor having capacitance uniformity structures and a method of manufacture therefor |
| 03/19/2009 | US20090075448 Method of Forming Inside Rough and Outside Smooth HSG Electrodes and Capacitor Structure |
| 03/19/2009 | US20090075447 Method and fabricating a mono-crystalline emitter |