| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 03/25/2009 | CN100472804C P-channel MOS transistor, semiconductor integrated circuit device and fabrication process thereof |
| 03/25/2009 | CN100472803C Semiconductor device |
| 03/25/2009 | CN100472802C Bipolar transistor |
| 03/25/2009 | CN100472801C Method for the production of a bipolar semiconductor component and corresponding bipolar semiconductor component |
| 03/25/2009 | CN100472800C Bipolar transistor and method for the production thereof |
| 03/25/2009 | CN100472799C Display unit and method for fabricating the same |
| 03/25/2009 | CN100472798C Organic light emitting display device and method of fabricating the same |
| 03/25/2009 | CN100472796C Organic electroluminescent device and method for manufacturing the same |
| 03/25/2009 | CN100472793C Circuit fabrication method |
| 03/25/2009 | CN100472792C Solid state imaging device and method for producing the same |
| 03/25/2009 | CN100472788C Quickflashing memory device and its forming method |
| 03/25/2009 | CN100472787C Integrated circuit and method for reducing leakage current in circuit |
| 03/25/2009 | CN100472783C Contact method and device generated by using the method |
| 03/25/2009 | CN100472779C Module part |
| 03/25/2009 | CN100472777C Physical quantity sensor and manufacturing method therefor |
| 03/25/2009 | CN100472776C Small radio communication module and manufacturing method thereof |
| 03/25/2009 | CN100472774C Semiconductor device cutting fusing wire and method |
| 03/25/2009 | CN100472770C Area array package with non-electrically connected solder balls |
| 03/25/2009 | CN100472769C Semiconductor device and method for manufacturing same, and semiconductor wafer |
| 03/25/2009 | CN100472768C Electronic packaging materials for use with low-k dielectric-containing semiconductor devices and method for improving reliability thereof |
| 03/25/2009 | CN100472767C Chip structure |
| 03/25/2009 | CN100472762C Package circuit board and forming method thereof |
| 03/25/2009 | CN100472761C Graded semiconductor layer |
| 03/25/2009 | CN100472760C Forming a plurality of thin-film devices |
| 03/25/2009 | CN100472759C Nonvolatile memory devices and methods of fabricating the same |
| 03/25/2009 | CN100472758C Semiconductor memory and making method thereof |
| 03/25/2009 | CN100472757C Method for producing auto-alignment retracting grid metal-oxide-semiconductor transistor element |
| 03/25/2009 | CN100472756C Dual-metal CMOS transistors with tunable gate electrode work function and method of making the same |
| 03/25/2009 | CN100472755C Integration method for single-wall carbon nano tube part |
| 03/25/2009 | CN100472754C Electronic component and manufacturing method thereof |
| 03/25/2009 | CN100472753C Method for adjusting and controlling single-wall carbon nano tube axial energy belt |
| 03/25/2009 | CN100472752C Method for manufacturing a semiconductor device |
| 03/25/2009 | CN100472751C Method of preventing energy analysis attack to RSA algorithm |
| 03/25/2009 | CN100472750C Spread block lamination integrated with dielectric substance in interconnection structure and forming method thereof |
| 03/25/2009 | CN100472749C Substrate with determinate thermal expansion coefficient |
| 03/25/2009 | CN100472748C Layer transfer of low defect SiGe using etch-back process |
| 03/25/2009 | CN100472747C Method for holding substrate in vacuum, method for manufacturing liquid crystal display device, and device for holding substrate |
| 03/25/2009 | CN100472746C Transferring unit |
| 03/25/2009 | CN100472745C Thin plate supporting container clamping device |
| 03/25/2009 | CN100472744C Method and apparatus for measuring the size of free air balls on a wire bonder |
| 03/25/2009 | CN100472743C Chip check apparatus |
| 03/25/2009 | CN100472742C 倒装片安装方法以及凸块形成方法 Flip-chip mounting method, and a bump forming method |
| 03/25/2009 | CN100472741C Manufacturing method for semiconductor device |
| 03/25/2009 | CN100472740C Semiconductor device and method of manufacturing the same |
| 03/25/2009 | CN100472739C Copper interconnect wiring and method of forming thereof |
| 03/25/2009 | CN100472738C Method for producing non-volatile memory |
| 03/25/2009 | CN100472737C Silicon carbide power devices with self-aligned source and well regions and methods of fabricating same |
| 03/25/2009 | CN100472736C Silicon carbide-oxide layered structure, production method thereof, and semiconductor device |
| 03/25/2009 | CN100472735C Field effect transistor having lateral depletion structure |
| 03/25/2009 | CN100472734C Quick heat treatment method for semiconductor wafer |
| 03/25/2009 | CN100472733C Post treatment of low K dielectric films |
| 03/25/2009 | CN100472732C Method for fabricating semiconductor device with deep opening |
| 03/25/2009 | CN100472731C Semiconductor manufacturing device |
| 03/25/2009 | CN100472730C Method for manufacturing semiconductor device and manufacturing system |
| 03/25/2009 | CN100472729C Composition for copper wiring polishing and method of polishing surface of semiconductor integrated circuit |
| 03/25/2009 | CN100472728C CMP polishing method, CMP polishing apparatus, and process for producing semiconductor device |
| 03/25/2009 | CN100472727C Resist film removing apparatus, method of removing resist film, organic matter removing apparatus and method of removing organic matter |
| 03/25/2009 | CN100472726C Laser beam machining method |
| 03/25/2009 | CN100472725C Methods for reducing wordline sheet resistance |
| 03/25/2009 | CN100472724C Method for depositing metal layers using sequential flow deposition |
| 03/25/2009 | CN100472723C Method for forming an electrode |
| 03/25/2009 | CN100472722C Conductive bond for through-wafer interconnection |
| 03/25/2009 | CN100472721C N-type ohmic electrode, semiconductor light-emitting device with the electrode, and method for forming n-type ohmic electrode |
| 03/25/2009 | CN100472720C Method for slowing down dopant-enhanced diffusion in substrates and devices fabricated therefrom |
| 03/25/2009 | CN100472719C Box type zinc diffusion method made by indium gallium arsenide photoelectric detector chip |
| 03/25/2009 | CN100472718C Free-standing substrate, manufacturing method thereof and semiconductor light-emitting device |
| 03/25/2009 | CN100472717C Shower head of chemical vapor deposition apparatus |
| 03/25/2009 | CN100472716C Method for manufacturing p-type group III nitride semiconductor, and group III nitride semiconductor light-emitting device |
| 03/25/2009 | CN100472715C Epitaxial growth process |
| 03/25/2009 | CN100472714C Method for the production of a hard mask |
| 03/25/2009 | CN100472713C Exposure apparatus and device producing method |
| 03/25/2009 | CN100472712C Method for forming a trench capacitor |
| 03/25/2009 | CN100472711C Device for and method of creating a model for determining relationship between process and quality |
| 03/25/2009 | CN100472710C Semiconductor substrate and fabricating method thereof |
| 03/25/2009 | CN100472709C Method for fabricating a germanium on insulator (geoi) type wafer |
| 03/25/2009 | CN100472708C Protective tape separation method, and apparatus using the same |
| 03/25/2009 | CN100472707C Waferless automatic cleaning after barrier removal |
| 03/25/2009 | CN100472706C Integrally formed bake plate unit for use in wafer fabrication system |
| 03/25/2009 | CN100472676C Distribution capacitor in high density application |
| 03/25/2009 | CN100472656C Nonvolatile semiconductor storage and method for writing data into the storage |
| 03/25/2009 | CN100472651C Semiconductor storage device |
| 03/25/2009 | CN100472650C 半导体存储器件和半导体集成电路 The semiconductor memory device and a semiconductor integrated circuit |
| 03/25/2009 | CN100472331C Dephotoresist agent |
| 03/25/2009 | CN100472329C Lithographic apparatus and device manufacturing method utilizing movement of clean air to reduce contamination |
| 03/25/2009 | CN100472328C Lithographic apparatus and device manufacturing method |
| 03/25/2009 | CN100472326C Method and device for producing analogue exposure tool imaging performance model and program product |
| 03/25/2009 | CN100472325C Method and apparatus for forming pattens on workpieces |
| 03/25/2009 | CN100472306C Substrate for display device, manufacturing method for same and display device |
| 03/25/2009 | CN100472220C TCP handling device and positional deviation correcting method for the same |
| 03/25/2009 | CN100472204C Wiring pattern check up apparatus |
| 03/25/2009 | CN100472002C Reduction of carrot defects in silicon carbide epitaxy |
| 03/25/2009 | CN100471996C Preparation method of thin film of oxidic materials having a high dielectric constant |
| 03/25/2009 | CN100471992C Semiconductor manufacture reactor |
| 03/25/2009 | CN100471990C Film forming method and film forming device using plasma CVD |
| 03/25/2009 | CN100471984C Method of depositing a material layer |
| 03/25/2009 | CN100471609C Manufacturing objects cutting method |
| 03/24/2009 | US7509623 Manufacturing method of semiconductor device |
| 03/24/2009 | US7509186 Method and system for reducing the variation in film thickness on a plurality of semiconductor wafers having multiple deposition paths in a semiconductor manufacturing process |
| 03/24/2009 | US7508833 Wireless communication apparatus and base station detection method |
| 03/24/2009 | US7508646 Substrate holding technique |