| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/02/2009 | US7541007 Microreactor and method of use to produce hydrogen by methanol reforming |
| 06/02/2009 | US7540971 Plasma etch process using polymerizing etch gases across a wafer surface and additional polymer managing or controlling gases in independently fed gas zones with time and spatial modulation of gas content |
| 06/02/2009 | US7540968 Micro movable device and method of making the same using wet etching |
| 06/02/2009 | US7540935 Plasma oxidation and removal of oxidized material |
| 06/02/2009 | US7540931 Method of producing ceramic green sheet and method of producing electronic component using this ceramic green sheet |
| 06/02/2009 | US7540923 Shower head structure for processing semiconductor |
| 06/02/2009 | US7540921 Crystallization apparatus, crystallization method, phase modulation element, device and display apparatus |
| 06/02/2009 | US7540800 Rough polishing method of semiconductor wafer and polishing apparatus of semiconductor wafer |
| 06/02/2009 | US7540717 Membrane nanopumps based on porous alumina thin films, membranes therefor and a method of fabricating such membranes |
| 06/02/2009 | US7540371 Break-away positioning conveyor mount for accommodating conveyor belt bends |
| 06/02/2009 | CA2392445C Silicon layer highly sensitive to oxygen and method for obtaining same |
| 06/02/2009 | CA2347425C Fabrication of gallium nitride layers by lateral growth |
| 06/02/2009 | CA2320218C Crystal ion-slicing of single-crystal films |
| 05/29/2009 | WO2008062729A1 Silicon carbide semiconductor device and process for producing the same |
| 05/29/2009 | CA2669581A1 Silicon carbide semiconductor device and method of manufacturing the same |
| 05/28/2009 | WO2009067688A1 Systems and methods for preparing epitaxially textured polycrystalline films |
| 05/28/2009 | WO2009067641A2 R-plane sapphire method and apparatus |
| 05/28/2009 | WO2009067381A1 Method of controlling etch microloading for a tungsten-containing layer |
| 05/28/2009 | WO2009067364A1 Transfer of high temperature wafers |
| 05/28/2009 | WO2009067354A1 Photoresist compositions and process for multiple exposures with multiple layer photoresist systems |
| 05/28/2009 | WO2009067299A1 Surface mount package with enhanced strength solder joint |
| 05/28/2009 | WO2009067214A1 Mos transistors having niptsi contact layers and methods for fabricating the same |
| 05/28/2009 | WO2009067162A1 Process using colored mask combined with selective area deposition |
| 05/28/2009 | WO2009067160A1 Use of gradient colored mask |
| 05/28/2009 | WO2009067154A1 Multicolored mask process for making display circuitry |
| 05/28/2009 | WO2009067153A1 Multicolor mask |
| 05/28/2009 | WO2009067147A1 Integrated color mask |
| 05/28/2009 | WO2009067140A2 Fin-jfet |
| 05/28/2009 | WO2009067104A1 Plasma etch process for controlling line edge roughness |
| 05/28/2009 | WO2009066997A2 Contact etch for ams products |
| 05/28/2009 | WO2009066993A2 Use of selective wee to obtain near planar topography |
| 05/28/2009 | WO2009066983A2 Method of curing defects in spin-on-glass |
| 05/28/2009 | WO2009066979A2 Mems based probe card and a method of testing semiconductor ion sensor using the same |
| 05/28/2009 | WO2009066949A2 Fabricating method of polycrystalline silicon thin film, polycrystalline silicon thin film fabricated using the same |
| 05/28/2009 | WO2009066923A2 Substrate rotating and oscillating apparatus for rapid thermal process |
| 05/28/2009 | WO2009066905A1 Substrate oscillating apparatus for rapid thermal process |
| 05/28/2009 | WO2009066852A1 Method and apparatus for controlling position of z-axis for wafer prober |
| 05/28/2009 | WO2009066847A1 Method of aligning a wafer and method of manufacturing a flip chip using the same |
| 05/28/2009 | WO2009066825A1 Method for preventing kirkendall void formation for packages fabricated by joining an electronic component finished with electroplated cu to solder and electronic packages fabricated by using the same |
| 05/28/2009 | WO2009066768A1 Composition for surface antireflection films and pattern-making method |
| 05/28/2009 | WO2009066764A1 Semiconductor integrated circuit device and its test method |
| 05/28/2009 | WO2009066750A1 Etching solution composition |
| 05/28/2009 | WO2009066739A1 Method for fabricating semiconductor device, semiconductor device, communication apparatus, and semiconductor laser |
| 05/28/2009 | WO2009066725A1 Zno-group semiconductor element |
| 05/28/2009 | WO2009066723A1 Electron emitting element, electron emitting device, light emitting device, image display, blower, cooling device, electrifying device, image forming device, electron beam curing device, and electron emitting element manufacturing method |
| 05/28/2009 | WO2009066602A1 Dicing method |
| 05/28/2009 | WO2009066573A1 Conveyance robot, locally cleaned housing with the conveyance robot, and semiconductor manufacturing device with the housing |
| 05/28/2009 | WO2009066566A1 PROCESS FOR PRODUCING SINGLE CRYSTAL SiC SUBSTRATE AND SINGLE CRYSTAL SiC SUBSTRATE PRODUCED BY THE PROCESS |
| 05/28/2009 | WO2009066551A1 Sputtering apparatus and film forming method |
| 05/28/2009 | WO2009066524A1 Electrostatic discharge protection device and semiconductor integrated circuit including same |
| 05/28/2009 | WO2009066500A1 Semiconductor device configuration method |
| 05/28/2009 | WO2009066498A1 Active matrix substrate, liquid crystal panel, television receiver, and liquid crystal panel manufacturing method |
| 05/28/2009 | WO2009066479A1 Thin-film transistor and process for producing the thin-film transistor |
| 05/28/2009 | WO2009066466A1 Nitride semiconductor, nitride semiconductor crystal growth method, and nitride semiconductor light emitting element |
| 05/28/2009 | WO2009066464A1 Nitride semiconductor and nitride semiconductor crystal growth method |
| 05/28/2009 | WO2009066435A1 Resin laminate, pressure sensitive adhesive sheet, method for working adherend using the pressure sensitive adhesive sheet, and device for separating the pressure sensitive adhesive sheet |
| 05/28/2009 | WO2009066434A1 Field effect transistor and method for manufacturing the same |
| 05/28/2009 | WO2009066431A1 Fabrication system of semiconductor integrated circuit, fabrication device, fabrication method, integrated circuit and communication system |
| 05/28/2009 | WO2009066409A1 Method for manufacturing semiconductor device |
| 05/28/2009 | WO2009066355A1 Polishing head, polishing apparatus and work removing method |
| 05/28/2009 | WO2009066351A1 Polishing head and polishing apparatus |
| 05/28/2009 | WO2009066286A2 Amorphous group iii-v semiconductor material and preparation thereof |
| 05/28/2009 | WO2009066135A1 Precise oxide dissolution |
| 05/28/2009 | WO2009065757A1 Device and process for wet treating a peripheral area of a wafer-shaped article |
| 05/28/2009 | WO2009065303A1 Plasma confinement device and semiconductor processing apparatus using the same |
| 05/28/2009 | WO2009048255A3 Method for wafer test and probe card for the same |
| 05/28/2009 | WO2009045844A3 Non contact substrate chuck |
| 05/28/2009 | WO2009042976A3 Apparatus for testing devices |
| 05/28/2009 | WO2009041774A3 Electrospray vaporizer |
| 05/28/2009 | WO2009041304A8 Oscillation circuit |
| 05/28/2009 | WO2009039342A3 X-ray inspection of solder reflow in high-density printed circuit board applications |
| 05/28/2009 | WO2009039264A3 Wafer bonding activated by ion implantation |
| 05/28/2009 | WO2009035989A3 Signal drop compensation at external terminal of integrated circuit package |
| 05/28/2009 | WO2009031076A3 A transistor and a method of manufacturing the same |
| 05/28/2009 | WO2009011975A3 Method for fabricating monolithic two-dimensional nanostructures |
| 05/28/2009 | WO2009003552A3 Treatment system for flat substrates |
| 05/28/2009 | WO2009000136A8 Polycrystalline silicon thin film transistors with bridged-grain structures |
| 05/28/2009 | WO2008122889A3 Front-end processed wafer having through-chip connections |
| 05/28/2009 | WO2008107194A3 Method for the precision processing of substrates and use of said method |
| 05/28/2009 | WO2008099394A3 A method and device of diamond like carbon multi-layer doping growth |
| 05/28/2009 | WO2008046304A8 A cleaning method for use in post etch and ashing a semiconductor wafer |
| 05/28/2009 | WO2007059193A3 Low profile image sensor package |
| 05/28/2009 | WO2004066367A3 Low-gidl mosfet structure and method for fabrication |
| 05/28/2009 | US20090138118 Server and program |
| 05/28/2009 | US20090137760 Adhesive composition and adhesive film |
| 05/28/2009 | US20090137189 Polishing pad |
| 05/28/2009 | US20090137188 Polishing pad |
| 05/28/2009 | US20090137132 Decreasing the etch rate of silicon nitride by carbon addition |
| 05/28/2009 | US20090137131 Thin film transistor, method of manufacturing same, display device, method of modifying an oxide film, method of forming an oxide film, semiconductor device, method of manufacturing semiconductor device, and apparatus for manufacturing semiconductor device |
| 05/28/2009 | US20090137130 Method For Forming A Multiple Layer Passivation Film And A Device Incorporating The Same |
| 05/28/2009 | US20090137129 Method for manufacturing semiconductor device |
| 05/28/2009 | US20090137128 Substrate Processing Apparatus and Semiconductor Device Producing Method |
| 05/28/2009 | US20090137127 Plasma etching method and storage medium |
| 05/28/2009 | US20090137126 Method of forming a spacer |
| 05/28/2009 | US20090137125 Etching method and etching apparatus |
| 05/28/2009 | US20090137124 Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios |
| 05/28/2009 | US20090137123 Polishing Composition and Polishing Method |
| 05/28/2009 | US20090137122 Method of passivating chemical mechanical polishing compositions for copper film planarization processes |
| 05/28/2009 | US20090137121 Three-Dimensional Network in CMP Pad |
| 05/28/2009 | US20090137120 Damping polyurethane cmp pads with microfillers |