Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2009
05/28/2009US20090137119 Novel seal isolation liner for use in contact hole formation
05/28/2009US20090137118 Method of manufacturing semiconductor device
05/28/2009US20090137117 Method Forming Contact Plug for Semiconductor Device Using H2 Remote Plasma Treatment
05/28/2009US20090137116 Isolating chip-to-chip contact
05/28/2009US20090137115 Method of manufacturing metal interconnection
05/28/2009US20090137114 Method of making semiconductor device
05/28/2009US20090137113 Method for fabricating a Microstructure
05/28/2009US20090137112 Method of manufacturing nonvolatile semiconductor memory devices
05/28/2009US20090137111 Method of fabricating metal interconnection and method of fabricating image sensor using the same
05/28/2009US20090137110 Low fabrication cost, high performance, high reliability chip scale package
05/28/2009US20090137109 Compressive nitride film and method of manufacturing thereof
05/28/2009US20090137108 Semiconductor device, semiconductor wafer, and methods of producing the same device and wafer
05/28/2009US20090137107 Method of manufacturing semiconductor device
05/28/2009US20090137106 Using ion implantation to control trench depth and alter optical properties of a substrate
05/28/2009US20090137105 Systems and methods for preparing epitaxially textured polycrystalline films
05/28/2009US20090137104 Method of fabricating polycrystalline semiconductor
05/28/2009US20090137103 Method for manufacturing semiconductor device
05/28/2009US20090137102 Method for making quantum dots
05/28/2009US20090137101 Method for manufacturing soi substrate and semiconductor device
05/28/2009US20090137100 Tellurium Precursors for GST Films in an ALD or CVD Process
05/28/2009US20090137099 Mbe device and method for the operation thereof
05/28/2009US20090137098 Method of manufacturing semiconductor element
05/28/2009US20090137097 Method for dicing wafer
05/28/2009US20090137096 Clamp ring for wafer and method of manufacturing semiconductor apparatus
05/28/2009US20090137095 Method for manufacturing semiconductor substrate and semiconductor substrate manufacturing apparatus
05/28/2009US20090137094 Method of filling a trench in a substrate
05/28/2009US20090137093 Method of forming finfet device
05/28/2009US20090137092 Method for manufacturing semiconductor device
05/28/2009US20090137091 Methods of manufacturing semiconductor devices
05/28/2009US20090137090 Method for fabricating semiconductor device
05/28/2009US20090137089 Semiconductor mos transistor device and method for making the same
05/28/2009US20090137088 JFET Having a Step Channel Doping Profile and Method of Fabrication
05/28/2009US20090137087 Method of manufacturing semiconductor device, film deposition method, and film deposition apparatus
05/28/2009US20090137086 Method for making a device including placing a semiconductor chip on a substrate
05/28/2009US20090137085 Method of manufacturing a wiring substrate and semiconductor device
05/28/2009US20090137084 Method and apparatus for manufacturing semiconductor module
05/28/2009US20090137083 Assembling of doubled-side stacking pulral chips
05/28/2009US20090137082 Manufacturing method for electronic devices
05/28/2009US20090137081 Phase change ram device and method for manufacturing the same
05/28/2009US20090137079 Method for manufacturing a microelectromechanical component, and a microelectromechanical component
05/28/2009US20090137078 Semiconductro laser device
05/28/2009US20090137077 Thin film transistor array substrate and fabricating method thereof
05/28/2009US20090137076 Surface emitting semiconductor laser, its manufacturing method, and manufacturing method of electron device
05/28/2009US20090137074 Method of manufacturing display device
05/28/2009US20090137072 Light emitting device methods
05/28/2009US20090137071 High Reliability Surveillance and/or Identification Tag/Devices and Methods of Making and Using the Same
05/28/2009US20090137070 Manufacturing Method for Partially-Good Memory Modules with Defect Table in EEPROM
05/28/2009US20090137069 Chip packaging process including simpification and mergence of burn-in test and high temperature test
05/28/2009US20090137068 Method and Computer Program Product for Wafer Manufacturing Process Abnormalities Detection
05/28/2009US20090137067 Method for forming an inductor
05/28/2009US20090137066 Sensor for a magnetic memory device and method of manufacturing the same
05/28/2009US20090137065 Method for manufacturing memory device
05/28/2009US20090136867 Si-polymers and photoresists comprising same
05/28/2009US20090136853 Hydride battery
05/28/2009US20090136780 A sapphire single-crystal base material and upper layer of a group III nitride crystal epitaxially formed on the sapphire having undergone a heat treatment to form an interfacial reaction product for a heating time that won't allow the reaction product to reach the surface; flat surface; semiconductors
05/28/2009US20090136741 Nanoscopically modified superhydrophobic coating
05/28/2009US20090136724 Method of fabricating semiconductor device
05/28/2009US20090136712 Film-like adhesive and method for carrying the same
05/28/2009US20090136686 Methods for Controllably Induction Heating an Article
05/28/2009US20090136411 Carbon nanotube, method for positioning the same, field-effect transistor made using the carbon nanotube, method for making the field-effect transistor, and semiconductor device
05/28/2009US20090136237 Coupling structure for optical fibres and process for making it
05/28/2009US20090136235 Probe card with optical transmitting unit and memory tester having the same
05/28/2009US20090136179 Light emitting unit, apparatus and method for manufacturing the same, apparatus for molding lens thereof, and light emitting device package thereof
05/28/2009US20090136173 Integrated lateral mode converter
05/28/2009US20090136116 Method and apparatus for inspecting reticle
05/28/2009US20090135875 Semiconductor laser and method for fabricating the same
05/28/2009US20090135869 Surface-emitting laser light source using two-dimensional photonic crystal
05/28/2009US20090135655 Embedded Flash Memory Devices on SOI Substrates and Methods of Manufacture Thereof
05/28/2009US20090135540 Electrostatic holding apparatus and electrostatic tweezers using the same
05/28/2009US20090135481 Polarizer, projection lens system, exposure apparatus and exposing method
05/28/2009US20090135472 Method of manufacturing oscillator device, and optical deflector and optical instrument having oscillator device
05/28/2009US20090135381 Apparatus for processing substrate and method of doing the same
05/28/2009US20090135348 Methods and apparatus for forming color filter on array flat panel displays
05/28/2009US20090135325 Electro-optical device and electronic apparatus
05/28/2009US20090135322 Thin film transistor substrate, liquid crystal display device having the same and method of manufacturing the same
05/28/2009US20090135222 Method of making an inkjet printhead
05/28/2009US20090134939 Transistor device and method
05/28/2009US20090134911 Drive method for driving element having capacity impedance, drive device, and imaging device
05/28/2009US20090134902 Integrated circuit package having reversible esd protection
05/28/2009US20090134892 Semiconductor integrated circuit
05/28/2009US20090134778 Organic Electroluminescent Element, Production Method of the Same, Display Device, and Lighting Device
05/28/2009US20090134646 Automatic system for guiding, retaining and adjusting cables
05/28/2009US20090134531 Overlay mark and method for forming the same
05/28/2009US20090134530 Wiring substrate and method of manufacturing the same
05/28/2009US20090134529 Circuit board module, electric device, and method for producing circuit board module
05/28/2009US20090134527 Structure of three-dimensional stacked dice with vertical electrical self-interconnections and method for manufacturing the same
05/28/2009US20090134523 Semiconductor device and method of manufacturing the same
05/28/2009US20090134522 Micro-Electromechanical System Memory Device and Method of Making the Same
05/28/2009US20090134521 Integrated circuit and manufacturing method of copper germanide and copper silicide as copper capping layer
05/28/2009US20090134518 Semiconductor device and manufacturing method of semiconductor device
05/28/2009US20090134517 Semiconductor device and method of manufacturing the same
05/28/2009US20090134514 Method for fabricating electrical bonding pads on a wafer
05/28/2009US20090134513 Method and structures for fabricating mems devices on compliant layers
05/28/2009US20090134512 Method of producing multiple semiconductor devices
05/28/2009US20090134511 Multiple Size Package Socket
05/28/2009US20090134510 Semiconductor package and method of fabricating the same, and electronic device using the semiconductor package
05/28/2009US20090134509 Integrated circuit packaging system with carrier and method of manufacture thereof
05/28/2009US20090134508 Integrated circuit with flexible planar leads
05/28/2009US20090134507 Adhesive on wire stacked semiconductor package
05/28/2009US20090134506 Semiconductor device, method for manufacturing the same, and flexible substrate for mounting semiconductor