Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2009
06/04/2009US20090142863 Organic el display panel for reducing resistance of electrode lines
06/04/2009US20090142862 Luminescent semi-conductive polymer material, method of preparing the same and organic light emitting element having the same
06/04/2009US20090142861 Method of Manufacturing Flash Memory Device
06/04/2009US20090142860 System and method for enhanced control of copper trench sheet resistance uniformity
06/04/2009US20090142859 Plasma control using dual cathode frequency mixing
06/04/2009US20090142858 Power-Measured Pulses for Thermal Trimming
06/04/2009US20090142857 Package design of small diameter sensor
06/04/2009US20090142715 Laminated resist used for immersion lithography
06/04/2009US20090142705 Method for forming mask pattern
06/04/2009US20090142700 Resin for photoresist composition, photoresist composition and method for forming resist pattern
06/04/2009US20090142599 Method to prevent metal contamination by a substrate holder
06/04/2009US20090142558 Mono-layer and multi-layer nanowire networks
06/04/2009US20090142493 Method of Electrochemically Fabricating Multilayer Structures Having Improved Interlayer Adhesion
06/04/2009US20090142479 Method of Manufacturing Semiconductor Device-Fabrication Wafer Holder
06/04/2009US20090142472 Methods of fabrication employing nanoscale mandrels
06/04/2009US20090142247 Chemical treatment to reduce machining-induced sub-surface damage in semiconductor processing components comprising silicon carbide
06/04/2009US20090142176 Wafer Carrying Apparatus
06/04/2009US20090142170 Loadport
06/04/2009US20090142168 Substrate processing apparatus
06/04/2009US20090142167 Loadlock designs and methods for using same
06/04/2009US20090142166 Container lid opening/closing system and substrate processing method using the system
06/04/2009US20090142164 Container lid opening/closing system and substrate processing method using the system
06/04/2009US20090142163 Wafer position correction with a dual, side-by-side wafer transfer robot
06/04/2009US20090142162 Substrate treating apparatus with inter-unit buffers
06/04/2009US20090141913 Microelectromechanical system
06/04/2009US20090141767 Integrated Electronic Sensor
06/04/2009US20090141764 Semiconductor laser and method of making the same
06/04/2009US20090141554 Memory device having small array area
06/04/2009US20090141547 Non-volatile memory devices and methods of fabricating and using the same
06/04/2009US20090141543 Magnetic random access memory, manufacturing method and programming method thereof
06/04/2009US20090141535 Methods involving memory with high dielectric constant antifuses adapted for use at low voltage
06/04/2009US20090141533 Metal gate compatible electrical antifuse
06/04/2009US20090141502 Light output enhanced gallium nitride based thin light emitting diode
06/04/2009US20090141418 Electrostatic chuck and apparatus having the same
06/04/2009US20090141408 Magnetoresistance effect element, magnetic head, magnetic reproducing apparatus, and magnetic memory
06/04/2009US20090141356 Optical element, and light source unit and exposure apparatus having the same
06/04/2009US20090141258 Imaging Device in a Projection Exposure Machine
06/04/2009US20090141225 Display device and method of fabricating the same
06/04/2009US20090141223 Transflective type liquid crystal display device and manufacturing method thereof
06/04/2009US20090141207 Thin film transistor substrate
06/04/2009US20090141087 Thermal Inkjet Printhead Chip Structure and Manufacturing Method for the same
06/04/2009US20090141083 Inkjet printhead and method of manufacturing the same
06/04/2009US20090140798 Semiconductor device including reference voltage generation circuit attaining reduced current consumption during stand-by
06/04/2009US20090140757 Microdisplay Assemblies and Methods of Packaging Microdisplays
06/04/2009US20090140648 Display panel and manufacturing method of display panel
06/04/2009US20090140582 Planar motor and stage using the same
06/04/2009US20090140443 Microstructure with Enlarged Mass and Electrode Area for Kinetic to Electrical Energy Conversion
06/04/2009US20090140442 Wafer Level Package Integration and Method
06/04/2009US20090140441 Wafer Level Die Integration and Method
06/04/2009US20090140440 Multi-chip stack structure and method for fabricating the same
06/04/2009US20090140438 Semiconductor device and manufacturing method thereof
06/04/2009US20090140437 Semiconductor device and fabrication method thereof
06/04/2009US20090140436 Method for forming a via in a substrate and substrate with a via
06/04/2009US20090140435 Semiconductor integrated circuit device and a method of prototyping a semiconductor chip
06/04/2009US20090140433 MEMS chip-to-chip interconnects
06/04/2009US20090140431 Hybrid contact structure with low aspect ratio contacts in a semiconductor device
06/04/2009US20090140430 Copper Alloy Sputtering Target and Semiconductor Element Wiring
06/04/2009US20090140429 Metal interconnection of a semiconductor device and method of manufacturing the same
06/04/2009US20090140428 Air gap structure having protective metal silicide pads on a metal feature
06/04/2009US20090140427 Metal foil interconnection of electrical devices
06/04/2009US20090140426 Flip chip package and method for manufacturing the same
06/04/2009US20090140424 Wafer level semiconductor package and method for manufacturing the same
06/04/2009US20090140423 Underbump metallurgy employing sputter-deposited nickel titanium alloy
06/04/2009US20090140421 Semiconductor Device and Method of Making Integrated Passive Devices
06/04/2009US20090140420 Soft error rate mitigation by interconnect structure
06/04/2009US20090140419 Extended plating trace in flip chip solder mask window
06/04/2009US20090140418 Method for integrating porous low-k dielectric layers
06/04/2009US20090140417 Holistic Thermal Management System for a Semiconductor Chip
06/04/2009US20090140413 Semiconductor package structure, applications thereof and manufacturing method of the same
06/04/2009US20090140411 Resin-sealed semiconductor device, manufacturing method thereof, base material for the semiconductor device, and layered and resin-sealed semiconductor device
06/04/2009US20090140410 Electronic part and method of producing the same
06/04/2009US20090140408 Integrated circuit package-on-package system with stacking via interconnect
06/04/2009US20090140406 Semiconductor Mount
06/04/2009US20090140403 Electronic device
06/04/2009US20090140402 Semiconductor device and method for manufacturing the same
06/04/2009US20090140401 System and Method for Improving Reliability of Integrated Circuit Packages
06/04/2009US20090140400 Method of Mid-Frequency Decoupling
06/04/2009US20090140399 Semiconductor Module with Switching Components and Driver Electronics
06/04/2009US20090140398 Hard mask patterns of a semiconductor device and a method for forming the same
06/04/2009US20090140396 Stressed interlayer dielectric with reduced probability for void generation in a semiconductor device by using an intermediate etch control layer of increased thickness
06/04/2009US20090140395 Edge seal for thru-silicon-via technology
06/04/2009US20090140394 Semiconductor Device and Method of Forming Through Hole Vias in Die Extension Region Around Periphery of Die
06/04/2009US20090140392 Warpage resistant semiconductor package and method for manufacturing the same
06/04/2009US20090140390 GaAs SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, AND GROUP III-V COMPOUND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
06/04/2009US20090140389 Nitride semiconductor device and method of manufacturing the same
06/04/2009US20090140388 Integrated circuit including an emitter structure and method for producing the same
06/04/2009US20090140387 High-density 3-dimensional resistors
06/04/2009US20090140383 Method of creating spiral inductor having high q value
06/04/2009US20090140381 Semiconductor Device and Method for Forming Passive Circuit Elements with Through Silicon Vias to Backside Interconnect Structures
06/04/2009US20090140380 Device with gaps for capacitance reduction
06/04/2009US20090140379 Semiconductor device and method for fabricating the same
06/04/2009US20090140378 Flash memory device and method of fabricating the same
06/04/2009US20090140377 Dielectric isolation type semiconductor device and manufacturing method therefor
06/04/2009US20090140376 Semiconductor device and method for manufacturing the device
06/04/2009US20090140375 Method of forming isolation layer in semiconductor device
06/04/2009US20090140374 Semiconductor device with improved control ability of a gate and method for manufacturing the same
06/04/2009US20090140373 Method of Manufacturing LCD Driver IC
06/04/2009US20090140372 Semiconductor Devices and Methods of Manufacture Thereof
06/04/2009US20090140371 Semiconductor integrated device and manufacturing method for the same
06/04/2009US20090140369 Semiconductor power module package without temperature sensor mounted thereon and method of fabricating the same
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