Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2009
06/04/2009WO2009068754A1 Siloxane polymer compositions and methods of using the same
06/04/2009WO2009068571A1 Process for fabricating an electronic device
06/04/2009WO2009068566A1 Electronic device with controlled electrical field
06/04/2009WO2009068548A1 Integrated circuit having memory cell array including barriers, and method of manufacturing same
06/04/2009WO2009068374A1 Underbump metallurgy employing sputter-deposited nickel copper alloy
06/04/2009WO2009068373A1 Underbump metallurgy employing sputter-deposited nickel titanium alloy
06/04/2009WO2009068010A1 Laminated power electronics subassembly
06/04/2009WO2009051763A3 Apparatus and methods for optimizing cleaning of patterned substrates
06/04/2009WO2009042137A3 Temperature control modules for showerhead electrode assemblies for plasma processing apparatuses
06/04/2009WO2009038780A3 Nand-structured series variable-resistance material memories, processes of forming same, and methods of using same
06/04/2009WO2009038747A3 Buried low-resistance metal word lines for cross-point variable-resistance material memories
06/04/2009WO2009034358A3 Hydrogen trapping
06/04/2009WO2009032539A3 Semiconductor assemblies and methods of manufacturing such assemblies
06/04/2009WO2009031001A3 Vertical igbt and method of manufacturing the same
06/04/2009WO2009027200A3 Method for purifying polycrystalline silicon
06/04/2009WO2009023787A3 Stoker with purge condition sensing
06/04/2009WO2009005788A3 A technique for forminig an interlayer dielectric material of increased reliability above a structure including closely spaced lines
06/04/2009WO2007047536A3 Method and apparatus for flag-less wafer bonding tool
06/04/2009WO2007037881A3 Semiconductor fabrication process including silicide stringer removal processing
06/04/2009WO2007037805A3 Film stack and method for fabricating the same
06/04/2009WO2007021855A3 Atmospheric process and system for controlled and rapid removal of polymers from high aspect ratio holes
06/04/2009WO2007001988A3 Structure and method for forming laterally extending dielectric layer in a trench-gate fet
06/04/2009WO2006138424A3 Through chip connection
06/04/2009WO2006123299A3 Methods for fabricating micro-electro-mechanical devices
06/04/2009WO2006121298A9 Method for forming high-resolution pattern with direct writing means
06/04/2009WO2006121297A9 Method for forming high-resolution pattern and substrate having prepattern formed thereby
06/04/2009WO2006078505A3 A non-volatile memory cell comprising a dielectric layer and a phase change material in series
06/04/2009WO2005062998A3 Metal interconnect system and method for direct die attachment
06/04/2009WO2005006339A3 A scalable flash eeprom memory cell with notched floating gate and graded source region, and method of manufacturing the same
06/04/2009US20090144693 Exposure data generator and method thereof
06/04/2009US20090142996 Polishing apparatus and method
06/04/2009US20090142992 Polishing apparatus and polishing method
06/04/2009US20090142990 Method for polishing a workpiece
06/04/2009US20090142936 Method of forming gated, self-aligned micro-structures and nano-structures
06/04/2009US20090142935 Method for forming silazane-based dielectric film
06/04/2009US20090142934 Method of forming semiconductor device having nanotube structures
06/04/2009US20090142933 Manufacturing apparatus for semiconductor device and manufacturing method for semiconductor device
06/04/2009US20090142932 Method of forming a hard mask pattern in a semiconductor device
06/04/2009US20090142931 Cleaning method following opening etch
06/04/2009US20090142930 Gate profile control through effective frequency of dual HF/VHF sources in a plasma etch process
06/04/2009US20090142929 Method for plasma processing over wide pressure range
06/04/2009US20090142928 Manufacturing method of semiconductor device
06/04/2009US20090142927 Fabricating sub-lithographic contacts
06/04/2009US20090142926 Line edge roughness reduction and double patterning
06/04/2009US20090142925 Method for forming tungsten film having low resistivity and good surface roughness and method for forming wiring of semiconductor device using the same
06/04/2009US20090142924 Reduced electromigration and stressed induced migration of cu wires by surface coating
06/04/2009US20090142923 Copper gate electrode of liquid crystal display device and method of fabricating the same
06/04/2009US20090142922 Method for manufacturing semiconductor device
06/04/2009US20090142921 Method for reducing dielectric overetch when making contact to conductive features
06/04/2009US20090142920 Method for manufacturing semiconductor device
06/04/2009US20090142919 Semiconductor device and manufacturing method of the same
06/04/2009US20090142918 Semiconductor device fabricating method
06/04/2009US20090142917 Method for fabricating metal line of semiconductor device
06/04/2009US20090142916 Apparatus and method of manufacturing an integrated circuit
06/04/2009US20090142915 Gate structure and method of forming the same
06/04/2009US20090142914 Method for Manufacturing Semiconductor Device
06/04/2009US20090142913 Semiconductor device and manufacturing method thereof
06/04/2009US20090142912 Method of Manufacturing Thin Film Semiconductor Device and Thin Film Semiconductor Device
06/04/2009US20090142911 Masking paste, method of manufacturing same, and method of manufacturing solar cell using masking paste
06/04/2009US20090142910 Manufacturing method of multi-level non-volatile memory
06/04/2009US20090142909 Method for manufacturing microcrystalline semiconductor film, thin film transistor having microcrystalline semiconductor film, and photoelectric conversion device having microcrystalline semiconductor film
06/04/2009US20090142908 Method of manufacturing photoelectric conversion device
06/04/2009US20090142907 Semiconductor manufacturing apparatus and manufacturing method of semiconductor device
06/04/2009US20090142906 Method of dividing wafer
06/04/2009US20090142905 Method for manufacturing soi substrate
06/04/2009US20090142904 Method for manufacturing soi substrate
06/04/2009US20090142903 Chip on wafer bonder
06/04/2009US20090142902 Methods Of Etching Trenches Into Silicon Of A Semiconductor Substrate, Methods Of Forming Trench Isolation In Silicon Of A Semiconductor Substrate, And Methods Of Forming A Plurality Of Diodes
06/04/2009US20090142901 Method for fabricating semiconductor device
06/04/2009US20090142900 Method for creating tensile strain by selectively applying stress memorization techniques to nmos transistors
06/04/2009US20090142899 Interfacial layer for hafnium-based high-k/metal gate transistors
06/04/2009US20090142898 Coupling Well Structure for Improving HVMOS Performance
06/04/2009US20090142897 Field effect transistor with narrow bandgap source and drain regions and method of fabrication
06/04/2009US20090142896 Method for manufacturing semiconductor device
06/04/2009US20090142895 Method of forming a via
06/04/2009US20090142894 Method for fabricating a semiconductor structure
06/04/2009US20090142893 Oxide epitaxial isolation
06/04/2009US20090142892 Method of fabricating semiconductor device having thin strained relaxation buffer pattern and related device
06/04/2009US20090142891 Maskless stress memorization technique for cmos devices
06/04/2009US20090142890 Phosphorus Activated NMOS Using SiC Process
06/04/2009US20090142889 Oxide Isolated Metal Silicon-Gate JFET
06/04/2009US20090142888 Manufacturing method of semiconductor device
06/04/2009US20090142887 Methods of manufacturing an oxide semiconductor thin film transistor
06/04/2009US20090142886 Method of fabricating thin film transistor structure
06/04/2009US20090142885 Method for protecting porous low-k dielectric post chemical mechanical planarization
06/04/2009US20090142884 Method of manufacturing a semiconductor device
06/04/2009US20090142882 Phase Change Memories With Improved Programming Characteristics
06/04/2009US20090142881 Tellurium (Te) Precursors for Making Phase Change Memory Materials
06/04/2009US20090142880 Solar Cell Contact Formation Process Using A Patterned Etchant Material
06/04/2009US20090142878 Plasma treatment between deposition processes
06/04/2009US20090142877 Method for making a thin-film poly-crystalline silicon solar cell on an indium tin oxide-glass substrate at a low temperature
06/04/2009US20090142875 Method of making an improved selective emitter for silicon solar cells
06/04/2009US20090142873 Method for Manufacturing a Sensor Array Including a Monolithically Integrated Circuit
06/04/2009US20090142872 Fabrication of capacitive micromachined ultrasonic transducers by local oxidation
06/04/2009US20090142871 Method of manufacturing semiconductor device
06/04/2009US20090142870 Manufacturing method of group iii nitride semiconductor light-emitting device
06/04/2009US20090142867 Method for manufacturing semiconductor device
06/04/2009US20090142866 Method for cutting liquid crystal display panel and method for fabricating liquid crystal display panel using the same
06/04/2009US20090142865 Liquid crystal display
06/04/2009US20090142864 Method for manufacturing thin film transistor array substrate
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