Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2009
08/06/2009US20090197411 New metal precursors containing beta-diketiminato ligands
08/06/2009US20090197410 Method of forming tasin film
08/06/2009US20090197409 Substrate processing apparatus and method of manufacturing semiconductor device
08/06/2009US20090197408 Increasing electromigration resistance in an interconnect structure of a semiconductor device by forming an alloy
08/06/2009US20090197407 Process for Manufacturing Rounded Polysilicon Electrodes on Semiconductor Components
08/06/2009US20090197406 Sequential deposition of tantalum nitride using a tantalum-containing precursor and a nitrogen-containing precursor
08/06/2009US20090197405 Method of forming a layer over a surface of a first material embedded in a second material in a structure for a semiconductor device
08/06/2009US20090197404 High yield and high throughput method for the manufacture of integrated circuit devices of improved integrity, performance and reliability
08/06/2009US20090197403 Method for forming insulating film and method for manufacturing semiconductor device
08/06/2009US20090197402 Substrate processing apparatus, method for manufacturing semiconductor device, and process tube
08/06/2009US20090197401 Plasma immersion ion implantation method using a pure or nearly pure silicon seasoning layer on the chamber interior surfaces
08/06/2009US20090197400 Method for recycling of ion implantation monitor wafers
08/06/2009US20090197399 Method of growing group iii-v compound semiconductor, and method of manufacturing light-emitting device and electron device
08/06/2009US20090197398 III Nitride Single Crystal and Method of Manufacturing Semiconductor Device Incorporating the III Nitride Single Crystal
08/06/2009US20090197397 Method of Manufacturing Semiconductor Device
08/06/2009US20090197396 Method for Producing Silicon Wafer
08/06/2009US20090197395 Method of manufacturing device
08/06/2009US20090197394 Wafer processing
08/06/2009US20090197393 Method for dividing semiconductor wafer and manufacturing method for semiconductor devices
08/06/2009US20090197392 Manufacturing method of soi substrate
08/06/2009US20090197391 Method for manufacturing soi substrate
08/06/2009US20090197390 Lock and key structure for three-dimentional chip connection and process thereof
08/06/2009US20090197389 Method for manufacturing semiconductor device
08/06/2009US20090197388 Method of manufacturing semiconductor device
08/06/2009US20090197387 Method of forming a gate stack structure
08/06/2009US20090197386 Methods Of Forming An Interconnect Between A Substrate Bit Line Contact And A Bit Line In DRAM, And Methods Of Forming DRAM Memory Cells
08/06/2009US20090197385 Semiconductor device and method of fabricating the same
08/06/2009US20090197384 Semiconductor memory device and method for manufacturing semiconductor memory device
08/06/2009US20090197383 Method of fabricating a semiconductor device
08/06/2009US20090197382 Multi-gated, high-mobility, density improved devices
08/06/2009US20090197381 Method for selectively forming strain in a transistor by a stress memorization technique without adding additional lithography steps
08/06/2009US20090197380 Method for manufacturing a recessed gate transistor
08/06/2009US20090197379 Selective epitaxy vertical integrated circuit components and methods
08/06/2009US20090197378 Method of fabricating semiconductor device
08/06/2009US20090197377 Esd power clamp with stable power start up function
08/06/2009US20090197376 Plasma cvd method, method for forming silicon nitride film and method for manufacturing semiconductor device
08/06/2009US20090197375 Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for them
08/06/2009US20090197374 Method of fabricating chip package structure
08/06/2009US20090197373 Semiconductor Device Singulation Method
08/06/2009US20090197372 Method for manufacturing stack package using through-electrodes
08/06/2009US20090197371 Integrated Circuit Packaging Using Electrochemically Fabricated Structures
08/06/2009US20090197370 Method and apparatus for manufacturing semiconductor device
08/06/2009US20090197369 Multilayer substrate manufacturing method
08/06/2009US20090197368 Method to form a photovoltaic cell comprising a thin lamina
08/06/2009US20090197367 Method to form a photovoltaic cell comprising a thin lamina
08/06/2009US20090197366 Solid-state image sensor, manufacturing method for solid-state image sensor, and camera
08/06/2009US20090197365 Treatment method for surface of substrate, method of fabricating image sensor by using the treatment method, and image sensor fabricated by the same
08/06/2009US20090197364 Method of fabricating substrate
08/06/2009US20090197362 Array substrate for liquid crystal display device and method of manufacturing the same
08/06/2009US20090197361 Method for Producing an LED Light Source Comprising a Luminescence Conversion Element
08/06/2009US20090197360 Light emitting diode package and fabrication method thereof
08/06/2009US20090197359 Methods for evaluating and manufacturing semiconductor wafer
08/06/2009US20090197358 Method for making COP evaluation on single-crystal silicon wafer
08/06/2009US20090197357 High-temperature ion implantation apparatus and methods of fabricating semiconductor devices using high-temperature ion implantation
08/06/2009US20090197356 Substrate positioning on a vacuum chuck
08/06/2009US20090197355 Method for manufacturing semiconductor device and semiconductor device manufacturing system
08/06/2009US20090197354 System and method for monitoring manufacturing process
08/06/2009US20090197353 Method of manufacturing material to be etched
08/06/2009US20090197352 Substrate processing method and film forming method
08/06/2009US20090197351 Laser processing method
08/06/2009US20090197350 Magnetic memory device and method
08/06/2009US20090197211 Lithographic apparatus and device manufacturing method
08/06/2009US20090197118 Method for producing Group III nitride-based compound semiconductor, wafer, and Group III nitride-based compound semiconductor device
08/06/2009US20090197113 Interconnect structure and method of fabricating the same
08/06/2009US20090197049 Method for dry chemical treatment of substrates and also use thereof
08/06/2009US20090197012 Plasma cvd apparatus
08/06/2009US20090196719 Insert for carrier board of test handler
08/06/2009US20090196717 Apparatus for Handling a Substrate and a Method Thereof
08/06/2009US20090196714 Device for the transport, storage, and transfer of substrates
08/06/2009US20090196318 Method of manufacturing vertical cavity surface emitting laser and method of manufacturing laser array, vertical cavity surface emitting laser and laser array, and image forming apparatus with laser array
08/06/2009US20090196096 Memory Cells, Methods Of Forming Memory Cells, And Methods Of Forming Programmed Memory Cells
08/06/2009US20090196094 Integrated circuit including electrode having recessed portion
08/06/2009US20090196093 Stacked die memory
08/06/2009US20090196091 Self-aligned phase change memory
08/06/2009US20090196086 High bandwidth cache-to-processing unit communication in a multiple processor/cache system
08/06/2009US20090196011 Device mounting board and manufacturing method therefor, and semiconductor module
08/06/2009US20090196010 Device mounting board, and semiconductor module and manufacturing method therefor
08/06/2009US20090196006 Substrate structure of secure digital input/output module interface and its manufacturing method
08/06/2009US20090196003 Wiring board for semiconductor devices, semiconductor device, electronic device, and motherboard
08/06/2009US20090195948 Methods for making a starting substrate wafer for semiconductor engineering having wafer through connections
08/06/2009US20090195854 Reflective spatial light modulator having dual layer electrodes and method of fabricating same
08/06/2009US20090195779 System for scatterometric measurements and applications
08/06/2009US20090195777 Dosimetry using optical emission spectroscopy/residual gas analyzer in conjunction with ion current
08/06/2009US20090195723 Active matrix substrate and method of manufacturing the same
08/06/2009US20090195614 Inkjet Printhead Nozzle Arrangement With Actuator Arm Slot Protection Barrier
08/06/2009US20090195578 Ink cartridge, image forming apparatus, and method to manufacture ink cartridge
08/06/2009US20090195335 Semiconductor configuration having an integrated coupler and method for manufacturing such a semiconductor configuration
08/06/2009US20090195300 Gate controlled atomic switch
08/06/2009US20090195297 Ccd device and method of driving same
08/06/2009US20090195296 Method for Recovering an On-State Forward Voltage and, Shrinking Stacking Faults in Bipolar Semiconductor Devices, and the Bipolar Semiconductor Devices
08/06/2009US20090195289 Process-Variation Tolerant Diode, Standard Cells Including the Same, Tags and Sensors Containing the Same, and Methods for Manufacturing the Same
08/06/2009US20090195154 Display device and manufacturing method of display device
08/06/2009US20090194898 Hafnium Silicide Target for Forming Gate Oxide Film, and Method for Preparation Thereof
08/06/2009US20090194888 Semiconductor device including wiring and manufacturing method thereof
08/06/2009US20090194887 Embedded die package on package (pop) with pre-molded leadframe
08/06/2009US20090194885 Semiconductor device having wiring line and manufacturing method thereof
08/06/2009US20090194883 Data line structure in lead region and manufacturing method thereof
08/06/2009US20090194882 Electronic device
08/06/2009US20090194881 Method for Manufacturing a Wafer Level Package
08/06/2009US20090194880 Wafer level chip scale package and process of manufacture
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