Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2009
08/06/2009US20090194879 Semiconductor device and manufacturing method thereof
08/06/2009US20090194878 Semiconductor device and method for manufacturing the same
08/06/2009US20090194877 Semiconductor device having soi structure
08/06/2009US20090194876 INTERCONNECT STRUCTURE AND METHOD FOR Cu/ULTRA LOW k INTEGRATION
08/06/2009US20090194875 HIGH PURITY Cu STRUCTURE FOR INTERCONNECT APPLICATIONS
08/06/2009US20090194874 Semiconductor chip package and method for manufacturing thereof
08/06/2009US20090194873 integrated circuit device and a method of making the integrated circuit device
08/06/2009US20090194871 Semiconductor package and method of attaching semiconductor dies to substrates
08/06/2009US20090194868 Panel level methods and systems for packaging integrated circuits with integrated heat sinks
08/06/2009US20090194866 Semiconductor device having wiring line and manufacturing method thereof
08/06/2009US20090194865 Method for manufacturing a semiconductor device, method for detecting a semiconductor substrate and semiconductor chip package
08/06/2009US20090194863 Semiconductor package and method for making the same
08/06/2009US20090194862 Semiconductor module and method of manufacturing the same
08/06/2009US20090194861 Hermetically-packaged devices, and methods for hermetically packaging at least one device at the wafer level
08/06/2009US20090194859 Semiconductor package and methods of fabricating the same
08/06/2009US20090194858 Hybrid carrier and a method for making the same
08/06/2009US20090194857 Thin Compact Semiconductor Die Packages Suitable for Smart-Power Modules, Methods of Making the Same, and Systems Using the Same
08/06/2009US20090194856 Molded package assembly
08/06/2009US20090194855 Folded leadframe multiple die package
08/06/2009US20090194854 Semiconductor device package and method of making a semiconductor device package
08/06/2009US20090194853 Shielded stacked integrated circuit packaging system and method of manufacture thereof
08/06/2009US20090194852 Semiconductor device packages with electromagnetic interference shielding
08/06/2009US20090194851 Semiconductor device packages with electromagnetic interference shielding
08/06/2009US20090194850 Crack Stops for Semiconductor Devices
08/06/2009US20090194849 Methods and apparatus for manufacturing semiconductor wafers
08/06/2009US20090194848 Method for manufacturing gallium nitride crystal and gallium nitride wafer
08/06/2009US20090194847 A1xGa yIn 1-x-yN CRYSTAL SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME
08/06/2009US20090194845 Semiconductor device comprising a capacitor in the metallization system and a method of forming the capacitor
08/06/2009US20090194844 Substrate contact for advanced soi devices based on a deep trench capacitor configuration
08/06/2009US20090194843 Integrated circuit arrangement including a protective structure
08/06/2009US20090194842 Semiconductor device and method of manufacturing the same
08/06/2009US20090194840 Method of Double Patterning, Method of Processing a Plurality of Semiconductor Wafers and Semiconductor Device
08/06/2009US20090194839 Nonvolatile nanotube diodes and nonvolatile nanotube blocks and systems using same and methods of making same
08/06/2009US20090194838 Cosi2 schottky diode integration in bismos process
08/06/2009US20090194830 Semiconductor device transducer and method
08/06/2009US20090194828 Method for mems threshold sensor packaging
08/06/2009US20090194826 Field-effect microelectronic device, capable of forming one or several transistor channels
08/06/2009US20090194825 Self-aligned contact structure in a semiconductor device
08/06/2009US20090194824 Body controlled double channel transistor and circuits comprising the same
08/06/2009US20090194821 Semiconductor device and method of fabricating the same
08/06/2009US20090194820 Cmos (complementary metal oxide semiconductor) devices having metal gate nfets and poly-silicon gate pfets
08/06/2009US20090194819 Cmos structures and methods using self-aligned dual stressed layers
08/06/2009US20090194816 Semiconductor device and method of fabricating the same
08/06/2009US20090194814 Semiconductor device and method for manufacturing the same
08/06/2009US20090194813 Semiconductor device and method for manufacturing the same
08/06/2009US20090194810 Semiconductor device using element isolation region of trench isolation structure and manufacturing method thereof
08/06/2009US20090194809 Semiconductor memory and method for manufacturing the same
08/06/2009US20090194807 Semiconductor memory device and method for manufacturing the same
08/06/2009US20090194806 Single poly type eeprom and method for manufacturing the eeprom
08/06/2009US20090194804 Non-volatile memory cell
08/06/2009US20090194803 Semiconductor device and method for manufacturing the same
08/06/2009US20090194801 ferroelectric capacitor manufacturing process
08/06/2009US20090194800 Dual-Pixel Full Color CMOS Imager with Large Capacity Well
08/06/2009US20090194799 Dual-pixel Full Color CMOS Imager
08/06/2009US20090194795 Solid state imaging device and method for fabricating the same
08/06/2009US20090194792 Semiconductor device and manufacturing method therefor
08/06/2009US20090194791 Compound semiconductor device and manufacturing method thereof
08/06/2009US20090194790 Field effect transister and process for producing the same
08/06/2009US20090194789 Method of creating a strained channel region in a transistor by deep implantation of strain-inducing species below the channel region
08/06/2009US20090194788 Strained channel transistor structure and method
08/06/2009US20090194787 Vertical outgassing channels
08/06/2009US20090194786 Semiconductor device and method of manufacturing same
08/06/2009US20090194785 Semiconductor device and manufacturing method thereof
08/06/2009US20090194784 Group-iii nitride compound semiconductor device and production method thereof, group-iii nitride compound semiconductor light-emitting device and production method thereof, and lamp
08/06/2009US20090194775 Semiconductor light emitting devices with high color rendering
08/06/2009US20090194773 Gallium nitride material devices including diamond regions and methods associated with the same
08/06/2009US20090194772 Method For Fabricating Silicon Carbide Vertical MOSFET Devices
08/06/2009US20090194770 Double-active-layer structure with a polysilicon layer and a microcrystalline silicon layer, method for manufacturing the same and its application
08/06/2009US20090194769 Crystallizing method, thin-film transistor manufacturing method, thin-film transistor, and display device
08/06/2009US20090194768 Vertical system integration
08/06/2009US20090194766 Thin film transistor, method of manufacturing the same, and flat panel display device having the same
08/06/2009US20090194765 Ceramic MESFET device and manufacturing method thereof
08/06/2009US20090194764 Multi-layer storage node, resistive random access memory device including a multi-layer storage node and methods of manufacturing the same
08/06/2009US20090194763 Semiconductor element, method for manufacturing the semiconductor element, electronic device and method for manufacturing the electronic device
08/06/2009US20090194762 Method of Doping Organic Semiconductors
08/06/2009US20090194761 Enhancement of optical polarization of nitride light-emitting diodes by increased indium incorporation
08/06/2009US20090194690 Inspection Method And Inspection System Using Charged Particle Beam
08/06/2009US20090194671 Image sensor reflector
08/06/2009US20090194425 Electrochemical Fabrication Methods Including Use of Surface Treatments to Reduce Overplating and/or Planarization During Formation of Multi-layer Three-Dimensional Structures
08/06/2009US20090194413 Multi-cathode ionized physical vapor deposition system
08/06/2009US20090194412 Multi-cathode ionized physical vapor deposition system
08/06/2009US20090194237 Plasma processing system
08/06/2009US20090194235 Plasma processing apparatus
08/06/2009US20090194233 Component for semicondutor processing apparatus and manufacturing method thereof
08/06/2009US20090194162 Method to form a photovoltaic cell comprising a thin lamina
08/06/2009US20090194161 Solar cell having multiple transparent conductive layers and manufacturing method thereof
08/06/2009US20090194160 Thin-film photovoltaic devices and related manufacturing methods
08/06/2009US20090194159 Dye-sensitized solar cell and method for manufacturing the same
08/06/2009US20090194154 Semiconductor device and method of manufacturing semiconductor device
08/06/2009US20090194151 Semiconductor substrate, method for forming electrode, and method for fabricating solar cell
08/06/2009US20090194149 Low band gap semiconductor oxides, processes for making the same, and dye sensitized solar cells containing the same
08/06/2009US20090194028 Plasma processing device
08/06/2009DE19804568B9 Vorrichtung bestehend aus einem Feldeffekttransistor (FET) in Verbindung mit einer Vorspannungs-Versorgungseinrichtung und einem kapazitiven Element und Verfahren zu deren Ansteuerung Device consisting of a field effect transistor (FET) in conjunction with a bias supply means, and a capacitive element and driving method thereof
08/06/2009DE112007002179T5 Vorrichtung zur chemischen Dampfabscheidung mit einem Brausekopf, zum positiven Regulieren der Injektionsgeschwindigkeit von reaktiven Gasen und Verfahren dafür An apparatus for chemical vapor deposition with a shower head, to the positive regulating the rate of injection of reactive gases and methods therefor
08/06/2009DE10241396B4 Verfahren zur Herstellung eines Halbleiterelements mit T-förmiger Gate-Struktur, etwa eines FET und dessen Gate-Elektrode A process for producing a semiconductor element with a T-shaped gate structure, such as an FET and its gate electrode
08/06/2009DE102008063587A1 Graben-Gate-Mosfet und Verfahren zu seiner Herstellung Trench-gate MOSFET and method for its preparation
08/06/2009DE102008062606A1 Bildsensor und Verfahren zu seiner Herstellung Image sensor and method for its preparation
08/06/2009DE102008061820A1 Bildsensor und Verfahren zu seiner Herstellung Image sensor and method for its preparation
08/06/2009DE102008007749A1 Thermisch aktivier- und härtbare Klebefolie insbesondere für die Verklebung von elektronischen Bauteilen und flexiblen gedruckten Leiterbahnen Thermally activatable and hardenable adhesive film particularly for bonding electronic components and flexible printed conductor tracks
08/06/2009DE102008007632A1 Verfahren zum Laserschneiden eines nichtmetallischen Werkstücks A method of laser cutting a non-metallic workpiece