Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2009
07/30/2009WO2009094414A1 Ion source gas reactor
07/30/2009WO2009094376A2 Method for forming strained channel pmos devices and integrated circuits therefrom
07/30/2009WO2009094325A1 Method for integrating selective low-temperature ruthenium deposition into copper metallization of a semiconductor device
07/30/2009WO2009094282A1 Two-dimensional patterning employing self-assembled material
07/30/2009WO2009094281A1 Anisotropic stress generation by stress-generating liners having a sublithographic width
07/30/2009WO2009094276A2 Vertical outgassing channels
07/30/2009WO2009094275A2 Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber
07/30/2009WO2009094124A2 Zone melt recrystallization for inorganic films
07/30/2009WO2009094024A1 Electronic device with connection bumps
07/30/2009WO2009094009A1 Large area nanopatterning method and apparatus
07/30/2009WO2009093992A2 Trench memory structures and operation
07/30/2009WO2009093762A1 Method for manufacturing semiconductor element
07/30/2009WO2009093760A1 Method for forming silicon oxide film, storage medium, and plasma processing apparatus
07/30/2009WO2009093706A1 Photosensitive resin laminate
07/30/2009WO2009093698A1 Method for forming carbon nanotube-dispersed film and method for manufacturing semiconductor device
07/30/2009WO2009093661A1 Process for forming metallic-film pattern
07/30/2009WO2009093633A1 Semiconductor device comprising capacitive element
07/30/2009WO2009093625A1 Field-effect transistor, method for manufacturing field-effect transistor, display device using field-effect transistor, and semiconductor device
07/30/2009WO2009093623A1 Semiconductor device and method of manufacturing semiconductor device
07/30/2009WO2009093608A1 Highly clean and hot valve
07/30/2009WO2009093606A1 Method for manufacturing organic semiconductor element
07/30/2009WO2009093602A1 Display device
07/30/2009WO2009093596A1 Method for producing metal fine particle, method for producing metal-containing paste, and method for forming metal thin film wiring
07/30/2009WO2009093594A1 Surface position detecting device, exposure apparatus, and device manufacturing method
07/30/2009WO2009093581A1 Insulating film material, film forming method using the insulating film material, and insulating film
07/30/2009WO2009093554A1 Bonding wire for semiconductor device
07/30/2009WO2009093553A1 Illuminating apparatus, exposure apparatus, exposure method and device manufacturing method
07/30/2009WO2009093483A1 Ulsi micro-interconnect member having ruthenium electroplating layer on barrier layer
07/30/2009WO2009093462A1 Semiconductor element and method for manufacturing the same
07/30/2009WO2009093459A1 Atomic layer growing apparatus and thin film forming method
07/30/2009WO2009093419A1 Resin for chemically amplified photoresist and method for producing the same
07/30/2009WO2009093418A1 Process for producing compound semiconductor substrate, compound semiconductor substrate, and light emitting element
07/30/2009WO2009093417A1 Susceptor and vapor phase growth system and vapor phase growth method
07/30/2009WO2009093410A1 Semiconductor element and method for manufacturing the same
07/30/2009WO2009093387A1 Magnetic random access memory and method for initializing the same
07/30/2009WO2009093360A1 Circuit simulator and circuit simulation method
07/30/2009WO2009093358A1 Bonding apparatus, and method for adjusting height of bonding stage on bonding apparatus
07/30/2009WO2009093354A1 Semiconductor device and display device
07/30/2009WO2009093328A1 Semiconductor device and method for production thereof
07/30/2009WO2009093295A1 Semiconductor device and manufacturing method of same
07/30/2009WO2009093171A1 Improved phase control in hf- or zr-based high-k oxides
07/30/2009WO2009093109A1 Method for manufacturing a microelectronic package comprising at least one microelectronic device
07/30/2009WO2009093102A1 Method of forming openings in a semiconductor device and a semiconductor device fabricated by the method
07/30/2009WO2009092981A1 Method for obtaining a structured material with through openings, in particular nitrides of type iii semiconductors structured according to photonic crystal patterns
07/30/2009WO2009092926A1 Method and related equipment for making thin poly- or mono-crystalline semiconductor substrates
07/30/2009WO2009092841A1 Self-aligned metal mask assembly for selectively depositing thin films on microelectronic substrates and devices, and method of use
07/30/2009WO2009092799A2 Object comprising a graphics element transferred onto a support wafer and method of producing such an object
07/30/2009WO2009092794A2 Object provided with a graphics element transferred onto a support wafer and method of producing such an object
07/30/2009WO2009092657A1 Method for forming a trench dram cell with asymmetric strap using ion bombardment and corresponding dram structure
07/30/2009WO2009092646A2 Method and apparatus for mounting a piece of foil on a substrate
07/30/2009WO2009092624A1 A method of fabricating epitaxially grown layers on a composite structure
07/30/2009WO2009092506A2 A method of fabricating a composite structure with a stable bonding layer of oxide
07/30/2009WO2009092453A2 Process for the manufacture of solar cells
07/30/2009WO2009092292A1 Cleaning composition for thick film resist
07/30/2009WO2009092165A1 Method and apparatus for a radiation detector
07/30/2009WO2009076414A3 Droplet actuator configurations and methods
07/30/2009WO2009071815A3 Equipment for producing semiconductors and corresponding pumping device and substrate holder
07/30/2009WO2009071798A3 Miniature gas cabinet
07/30/2009WO2009064166A3 An integrated ion sensitive field effect transistor sensor
07/30/2009WO2009062123A3 Pitch reduction using oxide spacer
07/30/2009WO2009052247A3 Semiconductor device metal programmable pooling and dies
07/30/2009WO2009038244A4 Magazine for depositing substrates
07/30/2009US20090193386 Semiconductor cell for photomask data verification and semiconductor chip
07/30/2009US20090193375 Manufacturing method, manufacturing program and manufacturing system for semiconductor device
07/30/2009US20090192743 Sampling estimating method, sampling inspection estimating apparatus, and computer readable medium storing sampling inspection estimating program
07/30/2009US20090192652 Substrate processing apparatus and substrate processing method
07/30/2009US20090192643 Process controller, process control method, and computer-readable recording medium
07/30/2009US20090192641 Optimization method of deposition time and an optimization system of deposition time
07/30/2009US20090191795 Composition for forming polishing layer of chemical mechanical polishing pad, chemical mechanical polishing pad and chemical mechanical polishing method
07/30/2009US20090191791 Polishing method and polishing apparatus
07/30/2009US20090191790 Substrate polishing apparatus
07/30/2009US20090191724 Substrate Heating Apparatus, Heating Method, and Semiconductor Device Manufacturing Method
07/30/2009US20090191723 Method of performing lithographic processes
07/30/2009US20090191722 Film formation method and apparatus for semiconductor process
07/30/2009US20090191721 Sequential tantalum-nitride deposition
07/30/2009US20090191720 Coating process and equipment for reduced resist consumption
07/30/2009US20090191719 Methods for fabricating compound material wafers
07/30/2009US20090191718 Substrate processing apparatus, method of manufacturing semiconductor device, and reaction vessel
07/30/2009US20090191717 Atomic layer deposition apparatus
07/30/2009US20090191716 Polysilicon layer removing method and storage medium
07/30/2009US20090191715 Method for etching interlayer dielectric film
07/30/2009US20090191714 Method of removing oxides
07/30/2009US20090191713 Method of forming fine pattern using block copolymer
07/30/2009US20090191712 Manufacturing method of semiconductor device
07/30/2009US20090191711 Hardmask open process with enhanced cd space shrink and reduction
07/30/2009US20090191710 CMP method for improved oxide removal rate
07/30/2009US20090191709 Method for Manufacturing a Semiconductor Device
07/30/2009US20090191708 Method for forming a through silicon via layout
07/30/2009US20090191707 Method of manufacturing a semiconductor device
07/30/2009US20090191706 Method for fabricating a semiconductor device
07/30/2009US20090191705 Semiconductor Contact Barrier
07/30/2009US20090191704 Formation of Through-Wafer Electrical Interconnections and Other Structures Using a Thin Dielectric Membrane
07/30/2009US20090191703 Process with saturation at low etch amount for high contact bottom cleaning efficiency for chemical dry clean process
07/30/2009US20090191702 Semiconductor device and manufacturing method thereof
07/30/2009US20090191701 Microelectronic devices and methods for forming interconnects in microelectronic devices
07/30/2009US20090191700 Semiconductor device with integrated flash memory and peripheral circuit and its manufacture method
07/30/2009US20090191699 Methods for forming silicide conductors using substrate masking
07/30/2009US20090191698 Tft array panel and fabricating method thereof
07/30/2009US20090191697 Method for manufacturing a nonvolatile memory device
07/30/2009US20090191696 Method for increasing the penetration depth of material infusion in a substrate using a gas cluster ion beam