Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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10/08/2009 | US20090253358 Polishing article with integrated window stripe |
10/08/2009 | US20090253355 Cmp abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for cmp abrasive |
10/08/2009 | US20090253352 Slicing Method |
10/08/2009 | US20090253273 Method of heat-treating semiconductor |
10/08/2009 | US20090253272 Method for manufacturing semiconductor device and substrate processing apparatus |
10/08/2009 | US20090253271 Spin-on film processing using accoustic radiation pressure |
10/08/2009 | US20090253270 oxidation to deposit a metal oxide on semiconductor substrate surface by applying the chemical bath and applying the co-reactant bath; liquid phase depositing an oxide of hafnium, aluminium, titanium, zirconium, scandium, yttrium and lanthanium |
10/08/2009 | US20090253269 Semiconductor manufacturing apparatus and semiconductor device manufacturing method |
10/08/2009 | US20090253268 Post-contact opening etchants for post-contact etch cleans and methods for fabricating the same |
10/08/2009 | US20090253267 Reverse masking profile improvements in high aspect ratio etch |
10/08/2009 | US20090253266 Semiconductor Device Having Multiple Fin Heights |
10/08/2009 | US20090253265 Method for fabricating semiconductor device and substrate processing apparatus |
10/08/2009 | US20090253264 Thin film formation method and manufacturing method for semiconductor device |
10/08/2009 | US20090253263 Method for fabricating semiconductor device capable of decreasing critical dimension in peripheral region |
10/08/2009 | US20090253262 Electroless plating system |
10/08/2009 | US20090253261 Silicon Wafer Having Through-Wafer Vias With A Predetermined Geometric Shape |
10/08/2009 | US20090253260 Semiconductor device, its manufacturing method, and sputtering target material for use in the method |
10/08/2009 | US20090253259 Solder ball attachment jig and method for manufacturing semiconductor device using the same |
10/08/2009 | US20090253258 Semiconductor manufacturing apparatus and semiconductor manufacturing method |
10/08/2009 | US20090253257 Methods of fabricating multi-layer nonvolatile memory devices |
10/08/2009 | US20090253256 Methods of fabricating semiconductor devices having transistors with different gate structures |
10/08/2009 | US20090253255 Semiconductor device having a pair of fins and method of manufacturing the same |
10/08/2009 | US20090253254 Method of fabricating semiconductor device |
10/08/2009 | US20090253253 Method of adjusting fdsoi threshold voltage through oxide charges generation in the buried oxide |
10/08/2009 | US20090253252 Substrates for silicon solar cells and methods of producing the same |
10/08/2009 | US20090253251 Crystalline semiconductor film, method of manufacturing the same, and semiconductor device |
10/08/2009 | US20090253250 Formation of nanowhiskers on a substrate of dissimilar material |
10/08/2009 | US20090253249 Method of manufacturing semiconductor device |
10/08/2009 | US20090253248 Method of manufacturing silicon nano-structure |
10/08/2009 | US20090253247 Method for manufacturing iron silicide nano-wires |
10/08/2009 | US20090253246 Plasma processing apparatus and plasma processing method |
10/08/2009 | US20090253245 Wafer Bonding method and wafer structure |
10/08/2009 | US20090253244 Nonvolatile Memory Devices Having Gate Structures Doped by Nitrogen and Methods of Fabricating the Same |
10/08/2009 | US20090253243 Methods of Manufacturing Non-Volatile Memory Devices |
10/08/2009 | US20090253242 Method of Fabricating Non-Volatile Memory Device |
10/08/2009 | US20090253241 Method for manufacturing a semiconductor device |
10/08/2009 | US20090253240 Thick Oxide P-Gate NMOS Capacitor for Use In A Low-Pass Filter of a Circuit and Method of Making Same |
10/08/2009 | US20090253239 Method and structure for ballast resistor |
10/08/2009 | US20090253238 Method of forming multiple fins for a semiconductor device |
10/08/2009 | US20090253237 Scalable Power Field Effect Transistor with Improved Heavy Body Structure and Method of Manufacture |
10/08/2009 | US20090253236 Method of fabricating semiconductor device |
10/08/2009 | US20090253235 Method of manufacturing semiconductor device with offset sidewall structure |
10/08/2009 | US20090253234 Methods of fabricating lateral dmos transistors including retrograde regions therein |
10/08/2009 | US20090253233 Method of fabricating bonding structure |
10/08/2009 | US20090253232 Microwave Cure of Semiconductor Devices |
10/08/2009 | US20090253231 Adhesive sheet for laser dicing and its manufacturing method |
10/08/2009 | US20090253230 Method for manufacturing stack chip package structure |
10/08/2009 | US20090253229 Method and Apparatus for Manufacturing Semiconductor Devices |
10/08/2009 | US20090253227 Engineered or structured coatings for light manipulation in solar cells and other materials |
10/08/2009 | US20090253226 Camera module and method of fabricating the same |
10/08/2009 | US20090253225 Method of processing a semiconductor substrate by thermal activation of light elements |
10/08/2009 | US20090253224 Nanocrystal structures |
10/08/2009 | US20090253223 Organic electroluminescent element manufacturing method |
10/08/2009 | US20090253222 Etching process state judgment method and system therefor |
10/08/2009 | US20090253221 Method of measuring nitrogen content, method of forming silicon oxynitride film and process for producing semiconductor device |
10/08/2009 | US20090253076 Coating-type underlayer coating forming composition for lithography containing vinylnaphthalene resin derivative |
10/08/2009 | US20090253054 Phase shift mask blank and method of manufacturing phase shift mask |
10/08/2009 | US20090252974 Epitaxial wafer having a heavily doped substrate and process for the preparation thereof |
10/08/2009 | US20090252944 Silicon wafer and production method thereof |
10/08/2009 | US20090252939 Wafer structures and wafer bonding methods |
10/08/2009 | US20090252931 Reinforced assembly carrier and method for manufacturing the same as well as method for manufacturing semiconductor packages |
10/08/2009 | US20090252892 Processing chamber |
10/08/2009 | US20090252583 Actuatable loadport system |
10/08/2009 | US20090252582 Processing thin wafers |
10/08/2009 | US20090252580 Wafer processing apparatus with wafer alignment device |
10/08/2009 | US20090252578 Substrate processing apparatus and substrate processing method for successively processing a plurality of substrates |
10/08/2009 | US20090252190 Semiconductor optical device and method of fabricating the same |
10/08/2009 | US20090251972 Nonvolatile memory arrays with charge trapping dielectric and with non-dielectric nanodots |
10/08/2009 | US20090251968 Integrated circuit having a base structure and a nanostructure |
10/08/2009 | US20090251967 Non-volatile storage having a connected source and well |
10/08/2009 | US20090251946 Data cells with drivers and methods of making and operating the same |
10/08/2009 | US20090251940 Nonvolatile semiconductor memory device using a variable resistance film and method of manufacturing the same |
10/08/2009 | US20090251879 Die thinning processes and structures |
10/08/2009 | US20090251878 Electronic Assembly and Method for Making Electronic Devices |
10/08/2009 | US20090251874 Solder ball interface |
10/08/2009 | US20090251862 Silicon based microchannel cooling and electrical package |
10/08/2009 | US20090251679 Exposure method and exposure apparatus, stage unit, and device manufacturing method having two substrate stages with one stage temporarily positioned below the other stage |
10/08/2009 | US20090251674 Lithographic apparatus and device manufacturing method |
10/08/2009 | US20090251653 Tft substrate, liquid crystal display device using same, and method for manufacturing same |
10/08/2009 | US20090251628 Pixel structure of liquid crystal display panel and method of making the same |
10/08/2009 | US20090251626 Liquid crystal display panel and manufacturing method thereof |
10/08/2009 | US20090251615 Active matrix substrate, display device, television apparatus, manufacturing method of an active matrix substrate, and manufacturing method of a display device |
10/08/2009 | US20090251573 Solid-state imaging apparatus and manufacturing method thereof |
10/08/2009 | US20090251446 Liquid Crystal Display Device |
10/08/2009 | US20090251206 Integrated circuit and method for manufacturing the same |
10/08/2009 | US20090251204 Temperature Compensated Work Function Based Voltage Reference |
10/08/2009 | US20090251201 Multi-level anti-fuse and methods of operating and fabricating the same |
10/08/2009 | US20090251170 Semiconductor device with its test time reduced and a test method therefor |
10/08/2009 | US20090251168 Device for protecting an integrated circuit against a laser attack |
10/08/2009 | US20090251166 Ball grid array connection monitoring system and method |
10/08/2009 | US20090251164 Process and temperature insensitive flicker noise monitor circuit |
10/08/2009 | US20090251160 Semiconductor integrated circuit wafer, semiconductor integrated circuit chip, and method of testing semiconductor integrated circuit wafer |
10/08/2009 | US20090251051 Organic light emitting diode display and method for manufacturing the same |
10/08/2009 | US20090251048 Organic light emitting device and manufacturing method thereof |
10/08/2009 | US20090250955 Wafer transfer blade |
10/08/2009 | US20090250855 Stage for substrate |
10/08/2009 | US20090250826 Process for manufacturing semiconductor device and semiconductor device manufactured by such process |
10/08/2009 | US20090250824 Method and apparatus to reduce pin voids |
10/08/2009 | US20090250823 Electronic Modules and Methods for Forming the Same |
10/08/2009 | US20090250821 Corrosion resistant via connections in semiconductor substrates and methods of making same |