| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 12/23/2009 | WO2009126043A3 Contacting device |
| 12/23/2009 | WO2009124317A3 Mocvd growth technique for planar semipolar (al, in, ga, b)n based light emitting diodes |
| 12/23/2009 | WO2009120845A3 Techniques for improved uniformity tuning in an ion implanter system |
| 12/23/2009 | WO2009120722A3 Methods and apparatus for conserving electronic device manufacturing resources |
| 12/23/2009 | WO2009118468A3 Electrical connection method for a component provided with inserts comprising compensating blocks |
| 12/23/2009 | WO2009114798A3 Wafer container with tubular environmental control components |
| 12/23/2009 | WO2009114244A4 Line width roughness improvement with noble gas plasma |
| 12/23/2009 | WO2009114184A3 Physical vapor deposition method with a source of isotropic ion velocity distribution at the wafer surface |
| 12/23/2009 | WO2009114175A3 Cam lock electrode clamp |
| 12/23/2009 | WO2009099775A4 Modified sputtering target and deposition components, methods of production and uses thereof |
| 12/23/2009 | WO2009091376A3 Method and apparatus for high-pressure atomic-beam laser induced deposition/etching |
| 12/23/2009 | WO2009088452A8 Improved sawtooth electric field drift region structure for power semiconductor devices |
| 12/23/2009 | WO2009088422A3 Reduced mask configuration for power mosfets with electrostatic discharge (esd) circuit protection |
| 12/23/2009 | WO2008145085A8 Gripper, in particular a bernoulli gripper |
| 12/23/2009 | WO2008102266A3 Method and apparatus for rapid fabrication of functional printed circuit board |
| 12/23/2009 | EP2136609A1 Device for assembling components with metal welding studs |
| 12/23/2009 | EP2136405A1 Method and structure for SOI body contact FET with reduced parasitic capacitance |
| 12/23/2009 | EP2136404A1 Transistor gate electrode having conductor material layer |
| 12/23/2009 | EP2136401A1 Process and apparatus for tri-dimensional interconnection of electronic devices |
| 12/23/2009 | EP2136398A1 Semiconductor memory device and method for manufacturing the same |
| 12/23/2009 | EP2136397A1 Flotox type eeprom |
| 12/23/2009 | EP2136395A2 Wafer carrier |
| 12/23/2009 | EP2136394A1 Semiconductor device |
| 12/23/2009 | EP2136393A1 Adhesive film for semiconductor and semiconductor device made with the same |
| 12/23/2009 | EP2136392A1 Plasma processing apparatus, plasma processing method, and storage medium |
| 12/23/2009 | EP2136391A1 Dry etching method |
| 12/23/2009 | EP2136390A2 Production of semiconductor material and devices using oblique angle etched templates |
| 12/23/2009 | EP2136244A1 Display device having an organic semiconductor and manufacturing method therefor using a partition wall |
| 12/23/2009 | EP2135979A1 Method for manufacturing nitride single crystal |
| 12/23/2009 | EP2135978A1 Mg-CONTAINING ZnO MIXED SINGLE CRYSTAL, LAMINATE THEREOF AND THEIR PRODUCTION METHODS |
| 12/23/2009 | EP2135910A1 Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and semiconductor device manufacturing method |
| 12/23/2009 | EP2135707A1 Cushion for polishing pad and polishing pad using the cushion |
| 12/23/2009 | EP2135704A1 Process and device for the precision processing of substrates by means of a laser coupled into a liquid stream, and use of same |
| 12/23/2009 | EP2135285A1 High voltage gan-based heterojunction transistor structure and method of forming same |
| 12/23/2009 | EP2135283A1 Method of fabricating a self-aligning damascene memory structure |
| 12/23/2009 | EP2135278A1 Patterned thin soi |
| 12/23/2009 | EP2135277A1 Apparatus and method for semiconductor wafer bumping via injection molded solder |
| 12/23/2009 | EP2135276A2 Die attachment method with a covex surface underfill |
| 12/23/2009 | EP2135274A1 A first inter-layer dielectric stack for non-volatile memory |
| 12/23/2009 | EP2134887A2 Method for the precision processing of substrates and use of said method |
| 12/23/2009 | EP2134800A1 Dicing and die attach adhesive |
| 12/23/2009 | EP1784861B1 Thermally controlled fluidic self-assembly |
| 12/23/2009 | EP1635382B1 Exposure device and device producing method |
| 12/23/2009 | EP1548809B1 Heat treatment method and heat treatment apparatus |
| 12/23/2009 | EP1494512B1 Ecr plasma source and ecr plasma device |
| 12/23/2009 | EP1336191B1 Stepped upper electrode for plasma processing uniformity |
| 12/23/2009 | EP1320902B1 The semiconductor led device and producing method |
| 12/23/2009 | CN201369339Y Integral solar energy lamination detection stand |
| 12/23/2009 | CN201369321Y Vortex non-contact silicon wafer holding device |
| 12/23/2009 | CN201369320Y Turnplate-type pickup device for chips |
| 12/23/2009 | CN201369319Y Multi-channel real-time film thickness monitor |
| 12/23/2009 | CN201369318Y Wafer cleaning device |
| 12/23/2009 | CN201368906Y Test system of semiconductor device |
| 12/23/2009 | CN201368649Y Improved silicon wafer spin dryer seal structure |
| 12/23/2009 | CN101611659A Circuit connecting adhesive film, connecting structure and method for manufacturing the connecting structure |
| 12/23/2009 | CN101611499A Display device |
| 12/23/2009 | CN101611496A Doped nanoparticle-based semiconductor junction |
| 12/23/2009 | CN101611495A Semiconductor device and method for providing a reduced surface area electrode |
| 12/23/2009 | CN101611493A Chip capacitor embedded pwb |
| 12/23/2009 | CN101611489A Semiconductor device |
| 12/23/2009 | CN101611488A Method and apparatus for modifying integrated circuit by laser |
| 12/23/2009 | CN101611487A Thin-film solar module |
| 12/23/2009 | CN101611486A Probe card including a plurality of connectors and method of bonding the connectors to a substrate of the probe card |
| 12/23/2009 | CN101611485A Mounting apparatus for electronic part |
| 12/23/2009 | CN101611484A Leadless semiconductor package and method of manufacture |
| 12/23/2009 | CN101611483A Method and device for encapsulating electronic components using underpressure |
| 12/23/2009 | CN101611482A Method and equipment for exposing the surface of an integrated circuit |
| 12/23/2009 | CN101611481A A semiconductor package |
| 12/23/2009 | CN101611480A Ex-situ doped semiconductor transport layer |
| 12/23/2009 | CN101611479A Gallium nitride epitaxial crystal, method for production thereof, and field effect transistor |
| 12/23/2009 | CN101611478A Integrated hydrogen anneal and gate oxidation for improved gate oxide integrity |
| 12/23/2009 | CN101611477A Method for polishing heterostructures |
| 12/23/2009 | CN101611476A Metal polishing liquid and polishing method |
| 12/23/2009 | CN101611475A In-situ reclaim of volatile components |
| 12/23/2009 | CN101611474A Amorphous insulator film and thin-film transistor |
| 12/23/2009 | CN101611473A Methods of fabricating semiconductor devices including implanted regions for providing low-resistance contact to buried layers and related devices |
| 12/23/2009 | CN101611472A Gas treatment systems |
| 12/23/2009 | CN101611471A Epitaxial substrate for field effect transistor |
| 12/23/2009 | CN101611470A Moving body apparatus, apparatus for forming pattern, method of forming pattern, method of producing device, method of producing moving body apparatus, and method of driving moving body |
| 12/23/2009 | CN101611469A Sintered silicon wafer |
| 12/23/2009 | CN101611468A Folded package camera module and method of manufacture |
| 12/23/2009 | CN101611467A Analog micromirror devices with continuous intermediate states |
| 12/23/2009 | CN101611350A Positive-type photosensitive resin composition |
| 12/23/2009 | CN101611178A Method for manufacturing nitride single crystal |
| 12/23/2009 | CN101611167A Atomic layer deposition systems and methods |
| 12/23/2009 | CN101611166A Chemical vapor-phase growing apparatus, method of forming film and process for producing semiconductor device |
| 12/23/2009 | CN101611116A Novel polishing slurries and abrasive-free solutions having a multifunctional activator |
| 12/23/2009 | CN101611043A Material for forming silicon-containing film, and silicon-containing insulating film and method for forming the same |
| 12/23/2009 | CN101610864A Process for producing silver powder |
| 12/23/2009 | CN101610646A Electrical connection structure as well as technology and circuit board structure thereof |
| 12/23/2009 | CN101609867A Nitride semiconductor light-emitting diode and method of manufacturing the same |
| 12/23/2009 | CN101609855A Photosensitive capacitor, photosensitive circuit, substrate, manufacturing process thereof and display device |
| 12/23/2009 | CN101609844A Non-volatile memory unit and manufacture method thereof |
| 12/23/2009 | CN101609843A Thin film transistor, method of manufacturing the same, and flat panel display device having the same |
| 12/23/2009 | CN101609841A Metal oxide semiconductor (MOS) transistor structure and manufacturing method thereof |
| 12/23/2009 | CN101609835A Functional array element with self-alignment electrode structure and manufacturing method thereof |
| 12/23/2009 | CN101609834A Semiconductor device having OTP cells and method for fabricating the same |
| 12/23/2009 | CN101609833A Circuit apparatus and method of manufacturing the same |
| 12/23/2009 | CN101609832A Display device and manufacturing method thereof, and semiconductor device and manufacturing method thereof |
| 12/23/2009 | CN101609830A Printed circuit board including electronic component embedded therein and method of manufacturing the same |