Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2009
12/22/2009US7635878 Semiconductor device having insulated gate bipolar transistor
12/22/2009US7635877 Nitride semiconductor device and manufacturing method thereof
12/22/2009US7635876 LED package structure and method of packaging the same
12/22/2009US7635872 Semiconductor layer, process for forming the same, and semiconductor light emitting device
12/22/2009US7635868 Silicon carbide epitaxial wafer, method for producing such wafer, and semiconductor device formed on such wafer
12/22/2009US7635866 Semiconductor device and its manufacturing method
12/22/2009US7635865 Wiring and manufacturing method thereof, semiconductor device comprising said wiring, and dry etching method
12/22/2009US7635861 Semiconductor device and method of manufacturing the same
12/22/2009US7635857 Transistor having soluble layers
12/22/2009US7635670 Chromium-free etching solution for si-substrates and uses therefor
12/22/2009US7635656 Serial irradiation of a substrate by multiple radiation sources
12/22/2009US7635655 Method for replacing a nitrous oxide based oxidation process with a nitric oxide based oxidation process for substrate processing
12/22/2009US7635654 Magnetic tunnel junction device with improved barrier layer
12/22/2009US7635653 Method of fabricating a semiconductor circuit having a plurality of MOS transistors and flash memory
12/22/2009US7635652 Mask with hydrophobic surface
12/22/2009US7635651 Method of smoothening dielectric layer
12/22/2009US7635650 Prevention of plasma induced damage arising from etching of crack stop trenches in multi-layered low-k semiconductor devices
12/22/2009US7635649 forming an anti-reflection coating on the polysilicon layer, forming a photoresist (PR) layer pattern on the anti-reflection coating, etching tanti-reflection coating using the PR layer pattern as a mask in capacitive coupled plasma (CCP) equipment using CF4, Ar, and O2
12/22/2009US7635648 Methods for fabricating dual material gate in a semiconductor device
12/22/2009US7635647 producing a photovoltaic panel by depositing thin-films of semiconductor materials such as cadmium sulfide or cadmium telluride from chemical vapors on a substrate at atmospheric pressure; renewable energy source; low cost
12/22/2009US7635646 Method for fabricating semiconductor device
12/22/2009US7635645 Method for forming interconnection line in semiconductor device and interconnection line structure
12/22/2009US7635644 Semiconductor device including metal interconnection and method for forming metal interconnection
12/22/2009US7635643 Method for forming C4 connections on integrated circuit chips and the resulting devices
12/22/2009US7635642 Integrated circuit package and method for producing it
12/22/2009US7635641 Integrated circuit support structures and their fabrication
12/22/2009US7635640 Method of fabricating polycrystalline silicon thin film for improving crystallization characteristics and method of fabricating liquid crystal display device using the same
12/22/2009US7635639 Method for the interconnection of active and passive components and resulting thin heterogeneous component
12/22/2009US7635638 Compound semiconductor device epitaxial growth substrate, semiconductor device, and manufacturing method thereof
12/22/2009US7635637 Semiconductor structures formed on substrates and methods of manufacturing the same
12/22/2009US7635636 Wafer level packaging of materials with different coefficients of thermal expansion
12/22/2009US7635635 Method for bonding a semiconductor substrate to a metal substrate
12/22/2009US7635634 Dielectric apparatus and associated methods
12/22/2009US7635633 Non-volatile memory device and method of manufacturing the same
12/22/2009US7635632 Gate electrode for a semiconductor fin device
12/22/2009US7635631 Semiconductor device and manufacturing method for the same
12/22/2009US7635630 Scalable high density non-volatile memory cells in a contactless memory array
12/22/2009US7635629 Method of manufacturing non-volatile memory device
12/22/2009US7635628 Nonvolatile memory device and method of manufacturing the same
12/22/2009US7635627 Methods for fabricating a memory device including a dual bit memory cell
12/22/2009US7635626 Method of manufacturing dynamic random access memory
12/22/2009US7635625 Method for manufacturing image sensor
12/22/2009US7635624 Dual gate structure for imagers and method of formation
12/22/2009US7635623 Methods of forming capacitors
12/22/2009US7635622 Method for manufacturing a vertical transistor that includes a super junction structure
12/22/2009US7635621 Lateral double-diffused metal oxide semiconductor (LDMOS) device with an enhanced drift region that has an improved Ron area product
12/22/2009US7635620 Semiconductor device structure having enhanced performance FET device
12/22/2009US7635619 Thin film transistor, method of manufacturing the thin film transistor, and display device
12/22/2009US7635618 Integrated circuit devices with high and low voltage components and processes for manufacturing these devices
12/22/2009US7635617 Manufacturing method of semiconductor substrate and manufacturing method of semiconductor device
12/22/2009US7635616 TFT LCD array substrate and manufacturing method thereof
12/22/2009US7635615 Manufacturing processing for an isolated transistor with strained channel
12/22/2009US7635612 Method and use of a device for applying coatings to band-like structures during the production of semiconductor components
12/22/2009US7635611 Semiconductor substrate for build-up packages
12/22/2009US7635610 Multi-chip stack package and fabricating method thereof
12/22/2009US7635608 Method of fabricating organic electronic device
12/22/2009US7635607 Image sensor and manufacturing method thereof
12/22/2009US7635606 Wafer level package with cavities for active devices
12/22/2009US7635605 Infrared sensor and method of producing the same
12/22/2009US7635604 Well for CMOS imager and method of formation
12/22/2009US7635603 Method for making red-light emitting diode having silicon quantum dots
12/22/2009US7635601 Method of manufacturing semiconductor device and cleaning apparatus
12/22/2009US7635600 Photovoltaic structure with a conductive nanowire array electrode
12/22/2009US7635599 Three terminal magnetic sensing devices having base lead layers in-plane with collector substrate materials and methods of making the same
12/22/2009US7635547 Preparing a composite layer; forming a trench by etching the composite layer in the non-pattern areas from the second side of the membrane forming thin layer; forming an auxiliary strut by filling a support layer inside the trench; forming a main strut by removing sections of the substrate
12/22/2009US7635544 Transparent substrate for mask blank and mask blank
12/22/2009US7635516 Heat-peelable pressure-sensitive adhesive sheet and method for processing adherend using the heat-peelable pressure-sensitive adhesive sheet
12/22/2009US7635502 ALD apparatus and method
12/22/2009US7635501 Exhaust pipe having means for preventing deposition of a reaction by-product and method for preventing deposition of a reaction by-product
12/22/2009US7635454 Integrated chemical microreactor with separated channels
12/22/2009US7635445 Method of separating a mold from a solidified layer disposed on a substrate
12/22/2009US7635418 Plasma processing apparatus and methods for removing extraneous material from selected areas on a substrate
12/22/2009US7635417 Semiconductor apparatus and cleaning unit thereof
12/22/2009US7635412 Crystallizing silicon using a laser beam transmitted through a mask
12/22/2009US7635397 Manufacturing apparatus for semiconductor device and manufacturing method for semiconductor device
12/22/2009US7635395 Comprises solution preparation step wherein first solid material is dissolved in solvent to prepare gasification solution, solvent removal step wherein second solid material is separated by removing solvent, and solid sublimation step wherein second solid material is gasified by sublimation; for CVD
12/22/2009US7635292 Substrate holding device and polishing apparatus
12/22/2009US7635244 Sheet-like electronic component clean transfer device and sheet-like electronic component manufacturing system
12/22/2009US7635191 Manufacturing method for variable shape mirror
12/22/2009US7635079 System for locating conductive sphere utilizing screen and hopper of solder balls
12/22/2009US7635077 Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby
12/22/2009CA2490849C An automated singularization tool for brittle insulating arrays
12/22/2009CA2453003C Use of diverse materials in air-cavity packaging of electronic devices
12/22/2009CA2442286C Wireless programmable logic devices
12/17/2009WO2009152329A2 Method for surface treatment of semiconductor substrates
12/17/2009WO2009152327A2 Post oxidation annealing of low temperature thermal or plasma based oxidation
12/17/2009WO2009152284A2 Improved method and apparatus for wafer bonding
12/17/2009WO2009152221A1 Methods for coating the backside of semiconductor wafers
12/17/2009WO2009152207A2 Zinc oxide alloys and devices including the same
12/17/2009WO2009152127A2 Techniques for providing a multimode ion source
12/17/2009WO2009152108A2 GeSbTe MATERIAL INCLUDING SUPERFLOW LAYER(S), AND USE OF Ge TO PREVENT INTERACTION OF Te FROM SbXTeY AND GeXTeY RESULTING IN HIGH Te CONTENT AND FILM CRISTALLINITY
12/17/2009WO2009152103A2 Method and apparatus for dampening pressure fluctuations in a fluid delivery system
12/17/2009WO2009152066A2 Gas delivery system for reducing oxidation in wire bonding operations
12/17/2009WO2009152063A2 Bandgap-shifted semiconductor surface and apparatus
12/17/2009WO2009152046A1 Systems and methods for detecting design and process defects on a wafer, reviewing defects on a wafer, selecting one or more features within a design for use as process monitoring features, or some combination thereof
12/17/2009WO2009152036A1 Organic arc etch selective for immersion photoresist
12/17/2009WO2009152008A2 Cmp pad identification and layer ratio modeling
12/17/2009WO2009152005A1 Methods and apparatus to provide group via materials to reactors for group ibiiiavia film formation
12/17/2009WO2009151994A1 A method to increase yield and reduce down time in semiconductor fabrication units by preconditioning components using sub-aperture reactive atom etch
12/17/2009WO2009151984A2 Referenced inspection device
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