Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2009
12/30/2009CN100576548C Memory cell and method for forming same
12/30/2009CN100576547C CMOS semiconductor device having tensile and compressive stress films
12/30/2009CN100576546C Semiconductor device having a modified recess channel gate and a method for fabricating the same
12/30/2009CN100576540C Semiconductor device with a wave-shaped trench or gate and method for manufacturing the same
12/30/2009CN100576539C Semiconductor wafer, semiconductor chip, semiconductor device, and wafer testing method
12/30/2009CN100576538C Bi-directional transistor and method therefor
12/30/2009CN100576537C FinFET structure and its forming method
12/30/2009CN100576536C Self-reparable semiconductor and system thereof
12/30/2009CN100576533C 半导体器件 Semiconductor devices
12/30/2009CN100576532C Structure of semiconductor element embedding in carrier plate and its manufacture method
12/30/2009CN100576531C 半导体封装及其制造方法 Semiconductor package and its manufacturing method
12/30/2009CN100576529C Semiconductor device, and testing method and device for the same
12/30/2009CN100576528C Test substrate, test substrate mask and test substrate forming method
12/30/2009CN100576522C Semiconductor package structure and method of manufacture
12/30/2009CN100576521C Stack type projection structure and manufacturing method thereof
12/30/2009CN100576518C Glue film and chip encapsulation manufacture process using the glue film
12/30/2009CN100576517C Circuit device and producing method thereof
12/30/2009CN100576515C Semiconductor device and manufacturing method thereof
12/30/2009CN100576514C 0.8 micrometre CMOS process
12/30/2009CN100576513C Fabricating method for semiconductor device
12/30/2009CN100576512C Manufacture method of semiconductor device
12/30/2009CN100576511C Method for fabricating CMOS image sensor
12/30/2009CN100576510C Method for forming CMOS image sensor, grid side wall and improving unevenness of etching
12/30/2009CN100576509C Production method of self-aligning contact hole
12/30/2009CN100576508C 半导体集成电路 The semiconductor integrated circuit
12/30/2009CN100576507C Integrated circuit bipolar transistor performance regulation method and method of manufacture
12/30/2009CN100576506C Manufacturing design method for integrated circuit
12/30/2009CN100576505C Method for fabricating semiconductor device
12/30/2009CN100576504C Manufacturing method for semiconductor devices, and formation apparatus for semiconductor wafer dicing masks
12/30/2009CN100576503C A method of preparation of an epitaxial substrate
12/30/2009CN100576502C Method for forming dual damascene pattern
12/30/2009CN100576501C Forming method of metal connection device
12/30/2009CN100576500C Fuse-wires structure and forming method thereof
12/30/2009CN100576499C Dual mosaic structure forming method
12/30/2009CN100576498C Through-hole forming method
12/30/2009CN100576497C Method for forming integrated circuit device self-alignment contact
12/30/2009CN100576496C Method for forming double mosaic structure
12/30/2009CN100576495C Making method for interconnection structure
12/30/2009CN100576494C Method of forming double-setting line arrange for semiconductor device using protective access cover layer
12/30/2009CN100576493C Method of forming metal line in semiconductor device
12/30/2009CN100576492C Method for forming device isolation region
12/30/2009CN100576491C Isolation structure of shallow plough groove and manufacturing method thereof
12/30/2009CN100576490C Forming method of shallow groove isolation construction
12/30/2009CN100576489C Lifting device
12/30/2009CN100576488C Wafer clamping device
12/30/2009CN100576487C Transfer/alignment method in vacuum processing apparatus, vacuum processing apparatus and computer storage medium
12/30/2009CN100576486C Electrostatic holding apparatus and electrostatic tweezers using same
12/30/2009CN100576485C Monitoring methods of etching
12/30/2009CN100576484C Method for distributing wafer plainness measuring point
12/30/2009CN100576483C Unmolded package for a semiconductor device
12/30/2009CN100576482C Method for bonding electronic components
12/30/2009CN100576481C Tin paste printing apparatus and CSP, BGA chip repairing method using the same
12/30/2009CN100576480C Method for manufacturing semiconductor device
12/30/2009CN100576479C Method and device for feeding encapsulating material to a mould cavity
12/30/2009CN100576478C Package method for crystal grain relocation
12/30/2009CN100576477C Method of forming a leaded molded array package
12/30/2009CN100576476C Chip buried in semiconductor encapsulation base plate structure and its manufacturing method
12/30/2009CN100576475C Low-pressure removal of photoresist and etch residue
12/30/2009CN100576474C Atomic layer deposition of tantalum-containing materials using the tantalum precursor TAIMATA
12/30/2009CN100576473C A method for manufacturing a semiconductor device having a silicided gate electrode and a method for manufacturing an integrated circuit including the same
12/30/2009CN100576472C Semiconductor device having amorphous silicon MONOS storage unit structure and method thereof
12/30/2009CN100576471C Method of manufacturing metal oxide semiconductor device
12/30/2009CN100576470C Memory with recessed devices
12/30/2009CN100576469C Methods for forming semiconductor wires and resulting devices
12/30/2009CN100576468C Method of manufacturing semiconductor device
12/30/2009CN100576467C Method for improving gallium nitride based transistor material and device performance using indium doping
12/30/2009CN100576466C Semiconductor power device having a top-side drain using a sinker trench
12/30/2009CN100576465C Method for improving high-temperature induced slipping defect in semi-conductor production
12/30/2009CN100576464C 等离子体处理方法 The plasma processing method
12/30/2009CN100576463C Method for forming a pattern in semiconductor device with double exposure technology
12/30/2009CN100576462C Method for reducing roughness of a thick insulating layer
12/30/2009CN100576461C Method for depositing benzocyclobutene layer and method for preparing convex point
12/30/2009CN100576460C Film-forming apparatus and film-forming method
12/30/2009CN100576459C Method for determining groove etch time and method for preparing isolation of shallow channel
12/30/2009CN100576458C Method for forming shallow groove as well as shallow groove structure
12/30/2009CN100576457C Etching method and apparatus for a single wafer
12/30/2009CN100576456C Loading device of chemical mechanical polishing equipment for semiconductor wafers
12/30/2009CN100576455C Method for manufacturing high dielectric constant grid medium embedded with silicon nanocrystal
12/30/2009CN100576454C Grid structure and non-volatile semiconductor memory manufacture method
12/30/2009CN100576453C Grid and NMOS transistor manufacture method
12/30/2009CN100576452C Method for etching grid, method and system for detecting grid etch end-point
12/30/2009CN100576451C Method for forming grid side wall layer
12/30/2009CN100576450C Method of manufacturing a semiconductor device
12/30/2009CN100576449C Method for manufacturing compound semiconductor epitaxial substrate
12/30/2009CN100576448C Methods for transferring a useful layer of silicon carbide to a receiving substrate
12/30/2009CN100576447C Pitch reduced patterns relative to photolithography features
12/30/2009CN100576446C Reflux processing method and method for manufacturing TFT
12/30/2009CN100576445C Method for forming a pattern of a semiconductor device
12/30/2009CN100576444C Substrate holding apparatus, exposure apparatus and device manufacturing method
12/30/2009CN100576443C Substrate cleaning method
12/30/2009CN100576442C Capacitor and method for preparing RAM unit
12/30/2009CN100576441C Integrated semiconductor product comprising a metal-insulator-metal capacitor
12/30/2009CN100576440C Preparation method of high density silicon nanocrystal film
12/30/2009CN100576439C Method for constructing anti-reflection structure on substrate surface
12/30/2009CN100576438C Plasma confinement baffle and flow equalizer for enhanced magnetic control of plasma radial distribution
12/30/2009CN100576437C Silicon chip etching condition optimization method
12/30/2009CN100576436C Control device and method for head of smearing machine
12/30/2009CN100576435C System and method for chemical dry-type etch system
12/30/2009CN100576434C Chip identification production method and light shield
12/30/2009CN100576433C Device and method for liquid treatment of wafer-shaped articles
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