| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/22/2010 | DE102009020819A1 Verfahren zum Ausbilden eines Musters auf einem Gruppe-III-Nitridhalbleitersubstrat und Verfahren zum Herstellen einer Gruppe-III-Nitridhalbleiter-Lichtemissionseinrichtung A method of forming a pattern on a group III-nitride semiconductor substrate and method for fabricating a Group III nitride semiconductor light emitting device |
| 04/22/2010 | DE102009019281A1 Oberflächenbehandlungsverfahren für Gruppe-III-Nitrid-Halbleiter, Gruppe-III-Nitrid-Halbleiter, Verfahren zum Herstellen desselben sowie Gruppe-III-Nitrid-Halbleiterstruktur The same surface treatment method for the Group III nitride semiconductor, group III nitride semiconductor, and method of manufacturing group III-nitride semiconductor structure |
| 04/22/2010 | DE102008053598A1 Verfahren zum Lösen von Wafern von einem Waferträger und Vorrichtung dafür A method for loosening of wafers from a wafer carrier and apparatus therefor |
| 04/22/2010 | DE102008053597A1 Cleaning device for cleaning wafer block, has nozzle units provided at left side and right side of wafer block, where nozzle unit has multiple nozzle heads with multiple nozzle openings for bearing cleaning fluid |
| 04/22/2010 | DE102008053596A1 Method for cleaning wafer block, involves dissecting wafer block in individual thin wafers, where wafer block has wafers held on carrier device, where wafer block is driven in cleaning device, and wafer block is moved on transport level |
| 04/22/2010 | DE102008052223A1 Luminescence scanner for spatially resolved determination of physical characteristics of semiconductor component, has analyzing unit determining physical properties of semiconductor component from detected spatially resolved luminescence |
| 04/22/2010 | DE102008051928A1 Elektrischer Anschlussleiter für ein Halbleiterbauelement, Halbleiterbauelement und Verfahren zur Herstellung eines elektrischen Anschlussleiters Electrical connection conductor for a semiconductor device, semiconductor device and method for manufacturing an electrical connecting conductor |
| 04/22/2010 | DE102008051520A1 Verfahren zur Erzeugung einer (001)-texturierten Kristallschicht aus einem photoaktiven Schichtgitter-Halbleiter auf einer metallisch leitfähigen Schicht unter Beteiligung eines Metallpromoters A method for producing a (001) -textured crystal layer of a photoactive semiconductor layer on a metallic grid conductive layer, with the participation of a metal promoter |
| 04/22/2010 | DE102008049972A1 Verfahren zum Messen der Dicke von in einer Bearbeitungsmaschine bearbeiteten scheibenförmigen Werkstücken A method for measuring the thickness of machined in a machine tool disc-shaped workpieces |
| 04/22/2010 | DE102008048869A1 Vorrichtung und Verfahren zum Verbinden zweier Verbindungspartner Device and method for connecting two link partner |
| 04/22/2010 | DE102008047865A1 Circuit arrangement for use in semiconductor substrate, has multiple metallization planes, which extend parallel to main surface of semiconductor substrate |
| 04/22/2010 | DE102008045034A1 Durchlassstromeinstellung für Transistoren, die im gleichen aktiven Gebiet hergestellt sind, durch lokales Vorsehen eines eingebetteten verformungsinduzierenden Halbleitermaterials in dem aktiven Gebiet Forward current setting transistors fabricated in the same active region, by providing a local embedded strain-inducing semiconductor material in the active region |
| 04/22/2010 | DE102008044988A1 Verwenden einer Deckschicht in Metallisierungssystemen von Halbleiterbauelementen als CMP- und Ätzstoppschicht Use of a cover layer metallization in semiconductor devices as a CMP etch stop layer and |
| 04/22/2010 | DE102008044964A1 Verringerung der Leckströme und des dielektrischen Durchschlags in dielektrischen Materialien von Metallisierungssysteme von Halbleiterbauelementen durch die Herstellung von Aussparungen Reducing the leakage current and the dielectric breakdown in the dielectric materials of metallization of semiconductor devices by the production of recesses |
| 04/22/2010 | DE102008038043A1 Electronic component e.g. field-effect transistor, has strip electrodes with longitudinal axis running perpendicular to width extension of strip electrodes, so that thickness of electrodes increases or decreases along longitudinal axis |
| 04/22/2010 | DE102007046847B4 Verfahren zur Herstellung eines Zwischenschichtdielektrikums mit verspannten Materialien A method for producing a strained interlayer dielectric materials |
| 04/22/2010 | DE102007009914B4 Halbleiterbauelement in Form eines Feldeffekttransistors mit einem Zwischenschichtdielektrikumsmaterial mit erhöhter innerer Verspannung und Verfahren zur Herstellung desselben Of the same semiconductor device in the form of a field effect transistor with an interlayer dielectric with increased internal stress and methods for preparing |
| 04/22/2010 | DE102006045914B4 Halbleitervorrichtung insbesonere vertikaler Super-Junction-MOS-Baustein und Verfahren zu deren Fertigung Semiconductor device insbesonere vertical super junction MOS device and process for their production |
| 04/22/2010 | DE102005011873B4 Verfahren zur Erzeugung einer Zone erhöhter Rekombination, insbesondere verwendbar in Bodygebieten von Leistungstransistoren Method for producing a zone of increased recombination, in particular usable in body regions of power transistors |
| 04/22/2010 | DE102004063583B4 Nichtflüchtige Speichervorrichtung A non-volatile memory device |
| 04/22/2010 | DE102004044179B4 Verfahren zur Montage von Halbleiterchips Process for mounting semiconductor chips |
| 04/22/2010 | DE102004009516B4 Verfahren und System zum Steuern eines Produktparameters eines Schaltungselements A method and system for controlling a parameter of a product circuit element |
| 04/22/2010 | DE102004009056B4 Verfahren zur Herstellung eines Halbleitermoduls aus mehreren stapelbaren Halbleiterbauteilen mit einem Umverdrahtungssubstrat A process for producing a semiconductor module of a plurality of stackable semiconductor devices with a rewiring substrate |
| 04/21/2010 | EP2178352A2 Method and apparatus for accurately applying structures to a substrate |
| 04/21/2010 | EP2178129A1 Semiconductor light emitting element and method for manufacturing the same |
| 04/21/2010 | EP2178126A1 Semiconductor device, method for manufacturing the same and image display |
| 04/21/2010 | EP2178125A2 Trenched field effect transistor and method of its manufacture |
| 04/21/2010 | EP2178115A1 Semiconductor integrated circuit |
| 04/21/2010 | EP2178114A2 Packaging for thin, disk-shaped products |
| 04/21/2010 | EP2178113A1 Electronic component and method of manufacturing the same |
| 04/21/2010 | EP2178112A2 Solid-state imaging device and method of manufacturing the same |
| 04/21/2010 | EP2178111A1 Method for manufacturing components stacked and self-aligned on a substrate |
| 04/21/2010 | EP2178110A1 Semiconductor device, method for manufacturing the same and image display |
| 04/21/2010 | EP2178109A1 Plasma processing method and plasma processing apparatus |
| 04/21/2010 | EP2178108A1 Contacts on diamond |
| 04/21/2010 | EP2178107A1 Lighting optical apparatus, photolithography equipment and device manufacturing method |
| 04/21/2010 | EP2177952A1 Positive working resist composition and method for pattern formation using the positive working resist composition |
| 04/21/2010 | EP2177950A1 Replication and transfer of microstructures and nanostructures |
| 04/21/2010 | EP2177949A1 Method of correcting proximity effects in a tri-tone attenuated phase shifting mask |
| 04/21/2010 | EP2177948A1 Method of Fabricating an Integrated Circuit using a Tri-Tone Attenuated Phase Shifting Mask Corrected for Proximity Effects |
| 04/21/2010 | EP2177944A1 Method of manufacturing a lateral electro-optical modulator on silicon with self-aligned doping regions |
| 04/21/2010 | EP2177867A1 Measurement method, stage apparatus, and exposure apparatus |
| 04/21/2010 | EP2177646A1 Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces |
| 04/21/2010 | EP2177545A1 Polymer for forming insulating film, composition for forming insulating film, insulating film, and electronic device having insulating film |
| 04/21/2010 | EP2177506A1 Positive resist composition, pattern forming method using the composition, and compound used in the composition |
| 04/21/2010 | EP2177487A1 Method of removing foreign matter from surface of glass substrate |
| 04/21/2010 | EP2177278A1 Substrate cleaning apparatus and method of cleaning substrate |
| 04/21/2010 | EP2176882A2 Microelectronic package element and method of fabricating thereof |
| 04/21/2010 | EP2176880A1 Damascene contacts on iii-v cmos devices |
| 04/21/2010 | EP2176878A1 Planar nonpolar m-plane group iii-nitride films grown on miscut substrates |
| 04/21/2010 | EP2176708A1 Apparatus and method for modifying optical material properties |
| 04/21/2010 | EP1979934B1 Method for treating an oxygen-containing semiconductor wafer, and semiconductor component |
| 04/21/2010 | EP1668695B1 Method and apparatus for fabricating cmos field effect transistors |
| 04/21/2010 | EP1656696B1 Methods of forming a transistor with an integrated metal silicide gate electrode |
| 04/21/2010 | EP1504471B1 Layer arrangement and memory arrangement |
| 04/21/2010 | EP1461826B1 Non-contact air cuhion support platform |
| 04/21/2010 | EP1110078B1 Adaptive lighting system and method for machine vision apparatus |
| 04/21/2010 | EP1018146B1 Package for electrical components |
| 04/21/2010 | EP0968528B1 Method of manufacturing a semiconductor device comprising a field-effect transistor |
| 04/21/2010 | EP0902960B1 Universal vacuum chamber including equipment modules such as a plasma generating source, vacuum pumping arrangement and/or cantilevered substrate support |
| 04/21/2010 | CN201440416U 快恢复二极管 Fast Recovery Diode |
| 04/21/2010 | CN201440409U Adjusting mechanism for three-dimensional state of bearing oar of push-pull boat |
| 04/21/2010 | CN201440408U Silicon slice load-bearing frame |
| 04/21/2010 | CN201440407U Silicon material rotating basket |
| 04/21/2010 | CN201440406U Lead frame member and inking rework tool thereof |
| 04/21/2010 | CN201440405U Silicon chip spraying cleaning tank |
| 04/21/2010 | CN201439182U 化学机械研磨装置 The chemical mechanical polishing apparatus |
| 04/21/2010 | CN1992173B Method and structure for implanting bonded substrates for electrical conductivity |
| 04/21/2010 | CN1990910B Film forming apparatus and its operating method |
| 04/21/2010 | CN1987436B Base board detector and glass base board detector |
| 04/21/2010 | CN1959959B Single mask design method and structure in use for integrating PMOS and MMOS transistors of strain silicon |
| 04/21/2010 | CN1957299B Radiation-sensitive composition, multilayer body and method for producing same, and electronic component |
| 04/21/2010 | CN1939603B 涂敷方法及涂敷装置 Coating method and coating apparatus |
| 04/21/2010 | CN1933096B Low-temperature chip direct bonding method |
| 04/21/2010 | CN1909239B Phase change material, phase change random access memory including the same, and methods of manufacturing and operating the same |
| 04/21/2010 | CN1907582B Treating liquid feed device |
| 04/21/2010 | CN1894795B Laminated semiconductor substrate and process for producing the same |
| 04/21/2010 | CN1877805B Damage evaluation method of compound semiconductor member |
| 04/21/2010 | CN1839217B Methods of depositing materials over substrates, and methods of forming layers over substrates |
| 04/21/2010 | CN1773313B Flexible waveguide compositions and waveguides formed therefrom, waveguide forming method |
| 04/21/2010 | CN1744439B Level shifter circuit, display device and its driving circuit and stress test method |
| 04/21/2010 | CN1716090B Method and system for projecting an alternating phase shift mask of image of integrated circuit |
| 04/21/2010 | CN1707759B Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer |
| 04/21/2010 | CN1691286B Electrode contact structure and method for production thereof |
| 04/21/2010 | CN1672242B Light conducting device |
| 04/21/2010 | CN1650401B Exposure method, exposure apparatus, and method for manufacturing device |
| 04/21/2010 | CN1649174B Thin film transistor and method for fabricating the same |
| 04/21/2010 | CN1647082B Integrated circuit development method |
| 04/21/2010 | CN1645515B Nonvolatile semiconductor memory |
| 04/21/2010 | CN1519930B Semiconductor device, electronic apparatus. their manufacture method and electronic instrument |
| 04/21/2010 | CN1501170B Lithographic apparatus and device manufacturing method |
| 04/21/2010 | CN1497345B Photosensitive thermosetting pastel composition and fired article pattern used by it |
| 04/21/2010 | CN1484712B Boron nitride/yttria composite components of semiconductor processing equipment and method of manufacturing thereof |
| 04/21/2010 | CN1470922B Baseboard assembling device and baseboard assembling method |
| 04/21/2010 | CN101697366A LED fabrication via ion implant isolation |
| 04/21/2010 | CN101697357A Schottky barrier diode and preparation method thereof |
| 04/21/2010 | CN101697354A Transparent extended p-n heterojunction thin film and preparation method thereof |
| 04/21/2010 | CN101697352A Multi-point insulated silicon transistor with double ultra sallow isolation structures |
| 04/21/2010 | CN101697350A Multi-point silicon transistor with double ultra sallow isolation structures |
| 04/21/2010 | CN101697349A A surface geometry for mos-gated device |