| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 04/22/2010 | US20100097897 Time piece with led light means |
| 04/22/2010 | US20100097875 Enhanced Power Distribution in an Integrated Circuit |
| 04/22/2010 | US20100097853 Jeet memory cell |
| 04/22/2010 | US20100097738 Electrostatic chuck and substrate bonding device using the same |
| 04/22/2010 | US20100097547 Reflective liquid crystal display and manufacturing method of the same |
| 04/22/2010 | US20100097512 Solid-state imaging apparatus, camera, and method of manufacturing solid-state imaging apparatus |
| 04/22/2010 | US20100097303 Organic Light Emitting Diode Display Device and Manufacturing Method Thereof |
| 04/22/2010 | US20100097296 Organic Light Emitting Diode Display Device and Manufacturing Method Thereof |
| 04/22/2010 | US20100097157 Semiconductor device and manufacturing the same |
| 04/22/2010 | US20100097156 Semiconductor device and manufacturing the same |
| 04/22/2010 | US20100097059 Mems 2d and 3d magnetic field sensors and associated manufacturing method |
| 04/22/2010 | US20100096869 Endeffectors for handling semiconductor wafers |
| 04/22/2010 | US20100096761 Semiconductor substrate for build-up packages |
| 04/22/2010 | US20100096759 Semiconductor substrates with unitary vias and via terminals, and associated systems and methods |
| 04/22/2010 | US20100096756 Semiconductor device and method of manufacturing the same |
| 04/22/2010 | US20100096755 Wiring structure and method for fabricating the same |
| 04/22/2010 | US20100096754 Semiconductor package, semiconductor module, and method for fabricating the semiconductor package |
| 04/22/2010 | US20100096753 Through-silicon via structures providing reduced solder spreading and methods of fabricating the same |
| 04/22/2010 | US20100096749 Semiconductor package and manufacturing method thereof |
| 04/22/2010 | US20100096747 Semiconductor device and method of manufacturing the same |
| 04/22/2010 | US20100096746 Package module structure of compound semiconductor devices and fabricating method thereof |
| 04/22/2010 | US20100096745 Bonded wafer structure and method of fabrication |
| 04/22/2010 | US20100096744 Printed wiring board and method for manufacturing the same |
| 04/22/2010 | US20100096741 Chip-Stacked Package Structure and Method for Manufacturing the Same |
| 04/22/2010 | US20100096738 Ic die having tsv and wafer level underfill and stacked ic devices comprising a workpiece solder connected to the tsv |
| 04/22/2010 | US20100096737 Stackable semiconductor assemblies and methods of manufacturing such assemblies |
| 04/22/2010 | US20100096736 Semiconductor Device and Manufacturing Method Thereof |
| 04/22/2010 | US20100096734 Thermally improved semiconductor qfn/son package |
| 04/22/2010 | US20100096733 Process for fabricating a substrate comprising a deposited buried oxide layer |
| 04/22/2010 | US20100096732 Semiconductor integrated circuit device |
| 04/22/2010 | US20100096730 Passivation technique |
| 04/22/2010 | US20100096729 Geometry and design for conformal electronics |
| 04/22/2010 | US20100096727 Semi-conductor substrate and method of masking layer for producing a free-standing semi-conductor substrate by means of hydride-gas phase epitaxy |
| 04/22/2010 | US20100096726 Metal capacitor and method of making the same |
| 04/22/2010 | US20100096725 Semiconductor Package with Embedded Spiral Inductor |
| 04/22/2010 | US20100096722 Fuse in a Semiconductor Device and Method for Fabricating the Same |
| 04/22/2010 | US20100096721 Semiconductor device production method and semiconductor device |
| 04/22/2010 | US20100096720 Soi substrate and method for manufacturing the same |
| 04/22/2010 | US20100096719 Methods of forming fine patterns in integrated circuit devices |
| 04/22/2010 | US20100096714 Method of manufacturing mems sensor and mems sensor |
| 04/22/2010 | US20100096713 Mems package and packaging method thereof |
| 04/22/2010 | US20100096712 Hermetic sealing and electrical contacting of a microelectromechanical structure, and microsystem (mems) produced therewith |
| 04/22/2010 | US20100096708 Chip Module for Installing in Sensor Chip Cards for Fluidic Applications and Method for Producing a Chip Module of This Type |
| 04/22/2010 | US20100096707 Method for Forming Insulation Film |
| 04/22/2010 | US20100096705 Implantation method for reducing threshold voltage for high-k metal gate device |
| 04/22/2010 | US20100096704 Suspended nanochannel transistor structure and method for fabricating the same |
| 04/22/2010 | US20100096703 Semiconductor device and manufacturing method thereof |
| 04/22/2010 | US20100096702 Semiconductor device and method of fabricating the same |
| 04/22/2010 | US20100096701 Semiconductor Device and Method of Manufacturing the Same |
| 04/22/2010 | US20100096700 Method for fabricating asymmetric double-gate transistors by which asymmetric and symmetric double-gate transistors can be made on the same substrate |
| 04/22/2010 | US20100096695 High stress film |
| 04/22/2010 | US20100096694 Planar extended drain transistor and method of producing the same |
| 04/22/2010 | US20100096693 Semiconductor device with vertical gate and method for fabricating the same |
| 04/22/2010 | US20100096691 Semiconductor device having vertically aligned pillar structures that have flat side surfaces and method for manufacturing the same |
| 04/22/2010 | US20100096688 Non-volatile memory having charge trap layer with compositional gradient |
| 04/22/2010 | US20100096687 Non-volatile memory having silicon nitride charge trap layer |
| 04/22/2010 | US20100096685 Strained Semiconductor Device and Method of Making Same |
| 04/22/2010 | US20100096684 Semiconductor device and its manufacture method |
| 04/22/2010 | US20100096682 Non-volatile semiconductor storage device and method of manufacturing the same |
| 04/22/2010 | US20100096680 Oc dram cell with increased sense margin |
| 04/22/2010 | US20100096679 Fet, ferroelectric memory device, and methods of manufacturing the same |
| 04/22/2010 | US20100096674 Methods and systems of thick semiconductor drift detector fabrication |
| 04/22/2010 | US20100096672 Self-aligned, integrated circuit contact |
| 04/22/2010 | US20100096659 Semiconductor device and method of manufacturing the same |
| 04/22/2010 | US20100096656 Cationic conjugated polyelectrolyte electron injection layers altered with counter anions having oxidative properties |
| 04/22/2010 | US20100096640 Self-assembled heterogeneous integrated optical analysis system |
| 04/22/2010 | US20100096638 Thin film transistor substrate, method of manufacturing the same, and display apparatus having the same |
| 04/22/2010 | US20100096637 Thin film transistor and manufacturing method thereof |
| 04/22/2010 | US20100096634 Panel structure, display device including same, and methods of manufacturing panel structure and display device |
| 04/22/2010 | US20100096633 Flexible light-emitting device, electronic device, and method for manufacturing flexible-light emitting device |
| 04/22/2010 | US20100096632 Display device and manufacturing method thereof |
| 04/22/2010 | US20100096631 Thin film transistor and method for manufacturing the same |
| 04/22/2010 | US20100096630 Bottom-Gate Thin Film Transistor and Method of Fabricating the Same |
| 04/22/2010 | US20100096620 Organic thin film transistor and method of fabricating the same |
| 04/22/2010 | US20100096619 electronic devices using carbon nanotubes having vertical structure and the manufacturing method thereof |
| 04/22/2010 | US20100096618 Doping of nanostructures |
| 04/22/2010 | US20100096613 Semiconductor device |
| 04/22/2010 | US20100096612 Phase change memory device having an inversely tapered bottom electrode and method for manufacturing the same |
| 04/22/2010 | US20100096611 Vertically integrated memory structures |
| 04/22/2010 | US20100096610 Phase-change material memory cell |
| 04/22/2010 | US20100096609 Phase change memory device having a layered phase change layer composed of multiple phase change materials and method for manufacturing the same |
| 04/22/2010 | US20100096273 Cu surface plasma treatment to improve gapfill window |
| 04/22/2010 | US20100096176 Contact structure of a wires and method manufacturing the same, and thin film transistor substrate including the contact structure and method manufacturing the same |
| 04/22/2010 | US20100096087 Apparatus For Aligning Electrodes In A Process Chamber to Protect An Exclusion Area Within An Edge Environ Of A Wafer |
| 04/22/2010 | US20100096086 Device for the Pre- and/or Aftertreatment of a Component Surface by Means of a Plasma Jet |
| 04/22/2010 | US20100096083 Shower head structure and treating device |
| 04/22/2010 | US20100095891 Method and apparatus for cleaning a cvd chamber |
| 04/22/2010 | DE112008001312T5 Vorrichtung und Verfahren, um Wafer einer Flüssigkeit auszusetzen Apparatus and method for exposing a wafer liquid |
| 04/22/2010 | DE112008000776T5 Auf-Chip-Speicherzelle und Verfahren zur Herstellung derselben On-chip memory cell and method for manufacturing the same |
| 04/22/2010 | DE112008000468T5 Verbesserung der Defekthäufigkeit nach der Dünnschicht-Separation durch Modifikation der Separations-Wärmebehandlung Improve the defect frequency based on thin-film separation by modifying the separation heat treatment |
| 04/22/2010 | DE10324053B4 Unterstützungsliner zur Steuerung der Höhe von Isolationsgräben bei der Herstellung von vertikalen DRAMs Liner support for controlling the height of isolation trenches in the manufacture of DRAMs vertical |
| 04/22/2010 | DE102009049848A1 Elektrische Verbindungsvorrichtung Electrical connection device |
| 04/22/2010 | DE102009044961A1 Chipintegrierte HF-Abschirmungen mit rückseitigen Umverdrahtungsleitungen Chip Integrated RF shields with rear redistribution |
| 04/22/2010 | DE102009044956A1 Chipintegrierte HF-Abschirmungen mit Durch-Substrat-Leitern Chip Integrated RF shields with through substrate conductors |
| 04/22/2010 | DE102009044955A1 Chipintegrierte Hochfrequenzabschirmung mit Zwischenverbindungsmetallisierung Chip Integrated RF shielding with interconnect metallization |
| 04/22/2010 | DE102009044952A1 Chipintegrierte HF-Abschirmungen mit vorderseitigen Umverdrahtungsleitungen Chip Integrated RF shields with front redistribution |
| 04/22/2010 | DE102009040579A1 Verfahren zum Produzieren von Halbleiter-Bauelementen A method of producing semiconductor devices |
| 04/22/2010 | DE102009039909A1 Verfahren zum Erzeugen eines Layoutmusters einer Halbleitervorrichtung und Gerät zum Erzeugen eines Layoutmusters A method of generating a layout pattern of a semiconductor device and device for generating a layout pattern |
| 04/22/2010 | DE102009034578A1 Halbleiteranordnung und Verfahren zum Herstellen einer Halbleiteranordnung A semiconductor device and method of manufacturing a semiconductor device |
| 04/22/2010 | DE102009028485A1 Halbleiterbauelementstruktur mit vertikalen Dielektrikumsschichten The semiconductor device structure with vertical dielectric layers |