Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2010
04/27/2010US7705357 Thin film transistor with channel region in recess
04/27/2010US7705355 Thin-film transistor display devices having composite electrodes
04/27/2010US7705354 Semiconductor device and method for fabricating the same
04/27/2010US7705345 High performance strained silicon FinFETs device and method for forming same
04/27/2010US7705303 Defect inspection and charged particle beam apparatus
04/27/2010US7705234 Solar module having a connecting element
04/27/2010US7704898 Method for the thermal treatment of disk-shaped substrates
04/27/2010US7704897 HDP-CVD SiON films for gap-fill
04/27/2010US7704896 Atomic layer deposition of thin films on germanium
04/27/2010US7704895 Deposition method for high-k dielectric materials
04/27/2010US7704894 Method of eliminating small bin defects in high throughput TEOS films
04/27/2010US7704893 Semiconductor device, method for manufacturing semiconductor device and gas for plasma CVD
04/27/2010US7704892 Semiconductor device having local interconnection layer and etch stopper pattern for preventing leakage of current
04/27/2010US7704891 Method of producing semiconductor device
04/27/2010US7704890 Method for fabricating thin film transistor and pixel structure
04/27/2010US7704889 Method and system for advanced process control in an etch system by gas flow control on the basis of CD measurements
04/27/2010US7704888 Methods for removing photoresist from semiconductor structures having high-k dielectric material layers
04/27/2010US7704887 Remote plasma pre-clean with low hydrogen pressure
04/27/2010US7704886 Multi-step Cu seed layer formation for improving sidewall coverage
04/27/2010US7704885 Semiconductor device and method for fabricating the same
04/27/2010US7704884 Semiconductor processing methods
04/27/2010US7704883 Annealing to improve edge roughness in semiconductor technology
04/27/2010US7704882 Semiconductor devices using fine patterns and methods of forming fine patterns
04/27/2010US7704881 Producing a covered through substrate via using a temporary cap layer
04/27/2010US7704880 Method of forming contact layers on substrates
04/27/2010US7704879 Method of forming low-resistivity recessed features in copper metallization
04/27/2010US7704878 Contact spacer formation using atomic layer deposition
04/27/2010US7704877 Method of manufacturing semiconductor device and control system
04/27/2010US7704876 Dual damascene interconnect structures having different materials for line and via conductors
04/27/2010US7704875 High-density contact holes
04/27/2010US7704874 Method for fabricating a frontside through-wafer via in a processed wafer and related structure
04/27/2010US7704873 Protective self-aligned buffer layers for damascene interconnects
04/27/2010US7704872 Ultraviolet assisted pore sealing of porous low k dielectric films
04/27/2010US7704871 Integration of thin film resistors having different TCRs into single die
04/27/2010US7704870 Via-first interconnection process using gap-fill during trench formation
04/27/2010US7704869 Method of fabricating ultra-deep vias and three-dimensional integrated circuits using ultra-deep vias
04/27/2010US7704868 Fabrication of a micro-electromechanical system (MEMS) device from a complementary metal oxide semiconductor (CMOS)
04/27/2010US7704867 Method of manufacturing semiconductor devices
04/27/2010US7704866 Methods for forming composite nanoparticle-metal metallization contacts on a substrate
04/27/2010US7704865 Methods of forming charge-trapping dielectric layers for semiconductor memory devices
04/27/2010US7704864 Method of manufacturing a superjunction device with conventional terminations
04/27/2010US7704863 Method of the application of a zinc sulfide buffer layer on a semiconductor substrate
04/27/2010US7704862 Surface planarization of thin silicon films during and after processing by the sequential lateral solidification method
04/27/2010US7704861 Electron beam microprocessing method
04/27/2010US7704860 Nitride-based semiconductor device and method for fabricating the same
04/27/2010US7704859 Electro-optical apparatus, electronic apparatus, and method of manufacturing electro-optical apparatus
04/27/2010US7704858 Methods of forming nickel silicide layers with low carbon content
04/27/2010US7704857 Method of manufacturing semiconductor device
04/27/2010US7704856 Semiconductor device, wiring substrate forming method, and substrate processing apparatus
04/27/2010US7704855 Method for fabricating strained silicon-on-insulator structures and strained silicon-on-insulator structures formed thereby
04/27/2010US7704854 Method for fabricating semiconductor device having conductive liner for rad hard total dose immunity
04/27/2010US7704853 Method for the elimination of the effects of defects on wafers
04/27/2010US7704852 Amorphization/templated recrystallization method for hybrid orientation substrates
04/27/2010US7704851 Method of manufacturing a semiconductor device
04/27/2010US7704849 Methods of forming trench isolation in silicon of a semiconductor substrate by plasma
04/27/2010US7704848 Method for designing semiconductor device and semiconductor device
04/27/2010US7704847 On-chip heater and methods for fabrication thereof and use thereof
04/27/2010US7704846 Substrate embedded with passive device
04/27/2010US7704845 Varactor and method for manufacturing the same
04/27/2010US7704844 High performance MOSFET
04/27/2010US7704843 Method of manufacturing a semiconductor device
04/27/2010US7704842 Lateral high-voltage transistor with vertically-extended voltage-equalized drift region
04/27/2010US7704841 Transistor structure and method for making same
04/27/2010US7704840 Stress enhanced transistor and methods for its fabrication
04/27/2010US7704839 Buried stress isolation for high-performance CMOS technology
04/27/2010US7704838 Method for forming an independent bottom gate connection for buried interconnection including bottom gate of a planar double gate MOSFET
04/27/2010US7704837 Cell based integrated circuit and unit cell architecture therefor
04/27/2010US7704836 Method of fabricating super trench MOSFET including buried source electrode
04/27/2010US7704835 Method of forming a selective spacer in a semiconductor device
04/27/2010US7704834 Method for forming split gate flash nonvolatile memory devices
04/27/2010US7704832 Integrated non-volatile memory and peripheral circuitry fabrication
04/27/2010US7704831 Semiconductor memory device with bit line of small resistance and manufacturing method thereof
04/27/2010US7704830 Split gate memory cell using sidewall spacers
04/27/2010US7704829 Method for fabricating nonvolatile memory device
04/27/2010US7704828 Method of fabricating a semiconductor device
04/27/2010US7704827 Semiconductor device and method for manufacturing the same
04/27/2010US7704826 Leveling algorithm for semiconductor manufacturing equipment and related apparatus
04/27/2010US7704825 Method of fabricating memory including diode
04/27/2010US7704824 Semiconductor layer
04/27/2010US7704823 Strained semiconductor device and method of making same
04/27/2010US7704822 Semiconductor device
04/27/2010US7704821 In-situ nitridation of high-k dielectrics
04/27/2010US7704820 Fabricating method of metal line
04/27/2010US7704819 Creating high voltage FETs with low voltage process
04/27/2010US7704818 Semiconductor device and method for manufacturing semiconductor device
04/27/2010US7704817 Method for manufacturing semiconductor device
04/27/2010US7704816 Boron derived materials deposition method
04/27/2010US7704815 Method of creating defect free high Ge content (>25%) SiGe-on-insulator (SGOI) substrates using wafer bonding techniques
04/27/2010US7704814 Method for manufacturing MOS transistor of semiconductor device
04/27/2010US7704813 Reliable high-voltage junction field effect transistor and method of manufacturing therefor
04/27/2010US7704812 Semiconductor circuit and method of fabricating the same
04/27/2010US7704811 Sub-lithographics opening for back contact or back gate
04/27/2010US7704810 Manufacturing method of display device
04/27/2010US7704809 Silicon-on-insulator chip with multiple crystal orientations
04/27/2010US7704808 Methods of forming semiconductor-on-insulating (SOI) field effect transistors with body contacts
04/27/2010US7704807 Multi-channel type thin film transistor and method of fabricating the same
04/27/2010US7704806 Thin film transistor having silicon nanowire and method of fabricating the same
04/27/2010US7704805 Fuse structures, methods of making and using the same, and integrated circuits including the same
04/27/2010US7704804 Method of forming a crack stop laser fuse with fixed passivation layer coverage
04/27/2010US7704803 Semiconductor device having diffusion layers as bit lines and method for manufacturing the same
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