Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2010
05/04/2010US7708788 Cerium oxide abrasive and method of polishing substrates
05/04/2010US7708621 Polishing apparatus and method of reconditioning polishing pad
05/04/2010US7708618 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
05/04/2010US7708542 Device for holding a template for use in imprint lithography
05/04/2010US7708050 Composite material, having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methods
05/04/2010US7707965 Processing apparatus and lid opening/closing mechanism
05/04/2010US7707713 Component-embedded circuit board fabrication method
05/04/2010CA2384889C Temporary bridge for micro machined structures
05/04/2010CA2381081C Dual wafer attachment process
04/2010
04/29/2010WO2010048554A2 Spectrographic metrology of patterned wafers
04/29/2010WO2010048379A2 Remote access gateway for semiconductor processing equipment
04/29/2010WO2010048364A2 Methods for reducing damage to substrate layers during deposition processes
04/29/2010WO2010048254A1 High temperature sheet handling system and methods
04/29/2010WO2010048237A2 Ultraviolet reflector with coolant gas holes and method
04/29/2010WO2010048236A2 Non-volatile memory having silicon nitride charge trap layer
04/29/2010WO2010048227A2 Ultraviolet-transmitting microwave reflector comprising a micromesh screen
04/29/2010WO2010048165A2 Multiple gas feed apparatus and method
04/29/2010WO2010048161A2 Techniques for atomic layer deposition
04/29/2010WO2010048127A2 A silicon based nanoscale crossbar memory
04/29/2010WO2010048094A2 Pvd cu seed overhang re-sputtering with enhanced cu ionization
04/29/2010WO2010048084A2 Electrode and power coupling scheme for uniform process in a large-area pecvd chamber
04/29/2010WO2010048076A2 Plasma source for chamber cleaning and process
04/29/2010WO2010048032A2 Pad conditioner auto disk change
04/29/2010WO2010048001A2 In/out door for a vacuum chamber
04/29/2010WO2010047978A2 Silicon etch with passivation using chemical vapor deposition
04/29/2010WO2010047977A2 Same layer microelectronic circuit patterning using hybrid laser projection patterning (lpp) and semi-additive patterning (sap)
04/29/2010WO2010047976A2 Silicon etch with passivation using plasma enhanced oxidation
04/29/2010WO2010047970A2 Method and apparatus for removing photoresist
04/29/2010WO2010047953A2 A remote plasma clean process with cycled high and low pressure clean steps
04/29/2010WO2010047924A2 Method of making a split gate memory cell
04/29/2010WO2010047869A1 Cvd precursors
04/29/2010WO2010047446A1 Method for manufacturing 2-terminal semiconductor device using trench technique
04/29/2010WO2010047402A1 Semiconductor apparatus and manufacturing method thereof
04/29/2010WO2010047378A1 Charged particle beam apparatus
04/29/2010WO2010047362A1 Exposure apparatus and photomask
04/29/2010WO2010047346A1 Underlayer film for image formation
04/29/2010WO2010047340A1 Resist pattern coating agent and resist pattern forming method using same
04/29/2010WO2010047331A1 Iii nitride semiconductor electronic device, method for manufacturing iii nitride semiconductor electronic device, and iii nitride semiconductor epitaxial wafer
04/29/2010WO2010047328A1 Semiconductor memory device
04/29/2010WO2010047326A1 Method for manufacturing thin film transistor and thin film transistor
04/29/2010WO2010047314A1 Composition for polishing silicon nitride and method for controlling selectivity using same
04/29/2010WO2010047311A1 Method for inspecting electrostatic chuck, and electrostatic chuck apparatus
04/29/2010WO2010047308A1 Plasma etching method and plasma etching device
04/29/2010WO2010047297A1 Method for manufacturing nitride semiconductor light emitting element and method for manufacturing epitaxial wafer
04/29/2010WO2010047288A1 Method for manufacturing semiconductordevice
04/29/2010WO2010047281A1 Bipolar transistor
04/29/2010WO2010047280A1 Bipolar transistor
04/29/2010WO2010047276A1 Magnetoresistance element, mram, and magnetoresistance element initialization method
04/29/2010WO2010047275A2 Semiconductor test system and relay driving test method therefor
04/29/2010WO2010047273A1 Glass substrate laminated device and method for producing laminate glass substrate
04/29/2010WO2010047272A1 Pressure-sensitive adhesive sheet with spontaneously rolling property
04/29/2010WO2010047267A1 Igbt and igbt manufacturing method
04/29/2010WO2010047264A1 Positive photosensitive resin composition for spray coating and method for producing through electrode using same
04/29/2010WO2010047248A1 Positive photosensitive composition and permanent resist
04/29/2010WO2010047243A1 Apparatus and method for peeling sheet
04/29/2010WO2010047235A1 Magnetron sputtering device
04/29/2010WO2010047228A1 Wiring board and method for manufacturing same
04/29/2010WO2010047227A1 Semiconductor device and method for manufacturing same
04/29/2010WO2010047222A1 Electrode, semiconductor device, and method for manufacturing the semiconductor device
04/29/2010WO2010047196A1 Surface treatment liquid, surface treatment method, hydrophobilization method, and hydrophobilized substrate
04/29/2010WO2010047186A1 Electronic circuit and communication function inspection method
04/29/2010WO2010047155A1 Heat treatment apparatus
04/29/2010WO2010047139A1 Solder alloy and semiconductor device
04/29/2010WO2010047138A1 Photosensitive resin composition, method for forming silica coating film, and apparatus and member each comprising silica coating film
04/29/2010WO2010047118A1 Semiconductor device and method for manufacturing same
04/29/2010WO2010047105A1 Sputtering target for forming thin film transistor wiring film
04/29/2010WO2010047086A1 Semiconductor device, method for manufacturing same, and display device
04/29/2010WO2010047077A1 Thin film transistor and method for manufacturing same
04/29/2010WO2010047073A1 Circuit pattern inspecting apparatus, management system including circuit pattern inspecting apparatus, and method for inspecting circuit pattern
04/29/2010WO2010047072A1 Semiconductor light-emitting element and semiconductor light-emitting element manufacturing method
04/29/2010WO2010047069A1 Compression molding method and device
04/29/2010WO2010047063A1 Thin film transistor having high-purity crystalline indium oxide semiconductor film, and method for manufacturing the thin film transistor
04/29/2010WO2010047060A1 Charged corpuscular beam apparatus
04/29/2010WO2010047040A1 Thin-film transistor having high adhesive strength between barrier film and drain electrode and source electrode films
04/29/2010WO2010047038A1 Semiconductor device and method for making same
04/29/2010WO2010047030A1 Nitride semiconductor device
04/29/2010WO2010047016A1 Bidirectional switch
04/29/2010WO2010047013A1 Semiconductor device and method for manufacturing same
04/29/2010WO2010047010A1 Semiconductor device and method for manufacturing the same
04/29/2010WO2010047007A1 Manufacturing method of electronic parts module
04/29/2010WO2010047006A1 Semiconductor device and method for manufacturing the same
04/29/2010WO2010047002A1 Wire bonding method and semiconductor device
04/29/2010WO2010046997A1 Electronic device and method for manufacturing the same
04/29/2010WO2010046996A1 Adhesive composition for semiconductor and semiconductor device manufactured using the same
04/29/2010WO2010046975A1 Prealigner
04/29/2010WO2010046881A2 Semiconductor device manufacturing method
04/29/2010WO2010046873A1 Multi-transistor memory cell
04/29/2010WO2010046825A1 Method for manufacturing a microelectronic package comprising at least one microelectronic device
04/29/2010WO2010046795A1 Semiconductor device and method of manufacturing such a device
04/29/2010WO2010046674A1 Improved wafer level chip scale packaging
04/29/2010WO2010046673A1 Improved metal-on-metal capacitor with diagonal feedline
04/29/2010WO2010046593A2 Method for defining a sports or playing area by means of a thermochromatic spin transition material
04/29/2010WO2010046563A1 Assembly of a grooved microelectronic chip with a toroidal wire element and method of assembling it
04/29/2010WO2010046235A1 Method to form solder deposits on substrates
04/29/2010WO2010046233A1 Method for producing monocrystalline piezo resistors and pressure sensor elements comprising such piezo resistors
04/29/2010WO2010045754A1 Method for singulating electronic components from a substrate
04/29/2010WO2010045750A1 Storage apparatus
04/29/2010WO2010028269A3 Stable amorphous metal oxide semiconductor
04/29/2010WO2010027400A3 Post etch reactive plasma milling to smooth through substrate via sidewalls and other deeply etched features
04/29/2010WO2010025099A3 High density helicon plasma source for wide ribbon ion beam generation
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