Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2010
05/25/2010US7722747 Method and apparatus for fluid processing a workpiece
05/25/2010US7722738 Semiconductor device manufacturing unit and semiconductor device manufacturing method
05/25/2010US7722737 Gas distribution system for improved transient phase deposition
05/25/2010US7722736 Apparatus for and method of processing a substrate with processing liquid
05/25/2010US7722724 Methods for substrate processing in cluster tool configurations having meniscus application systems
05/25/2010US7722719 Gas baffle and distributor for semiconductor processing chamber
05/25/2010US7722446 System and device for thinning wafers that have contact bumps
05/25/2010US7722439 Semiconductor device manufacturing apparatus and method
05/25/2010US7722437 Manufacturing method of semiconductor integrated circuit device
05/25/2010US7722436 Run-to-run control of backside pressure for CMP radial uniformity optimization based on center-to-edge model
05/25/2010US7722371 Electrical contactor, especially wafer level contactor, using fluid pressure
05/25/2010US7722095 Lid unit for thin-plate holding container, thin-plate holding container, and simplified attaching/detaching mechanism
05/25/2010US7721921 Tap unit for a beverage dispenser
05/25/2010US7721673 Hollow cathode discharging apparatus
05/25/2010US7721425 Method for connecting electronic parts
05/25/2010US7721414 Method of manufacturing 3-D spiral stacked inductor on semiconductor material
05/20/2010WO2010057095A2 Method for manufacturing an implantable electronic device
05/20/2010WO2010057068A2 Method and apparatus for wafer bonding with enhanced wafer mating
05/20/2010WO2010057060A2 Methods and systems for manufacturing thin-film solar cells
05/20/2010WO2010057016A2 Semiconductor device support for bonding
05/20/2010WO2010056990A1 Systems and methods for the crystallization of thin films
05/20/2010WO2010056952A1 Methods for improving the quality of structures comprising semiconductor materials
05/20/2010WO2010056823A2 Mass analysis magnet for a ribbon beam
05/20/2010WO2010056769A2 Eddy current sensor with enhanced edge resolution
05/20/2010WO2010056731A1 Method of nonstoichiometric cvd dielectric film surface passivation for film roughness control
05/20/2010WO2010056679A2 Semi-quantitative thickness determination
05/20/2010WO2010056615A2 Electron beam welding of large vacuum chamber body having a high emissivity coating
05/20/2010WO2010056502A1 Silicided trench contact to buried conductive layer
05/20/2010WO2010056443A1 Methods of forming layers of semiconductor material having reduced lattice strain, semiconductor structures, devices and engineered substrates including same
05/20/2010WO2010056433A2 OPTIMIZED COMPRESSIVE SiGe CHANNEL PMOS TRANSISTOR WITH ENGINEERED Ge PROFILE AND OPTIMIZED SILICON CAP LAYER
05/20/2010WO2010056369A2 Method and apparatus for circuit simulation
05/20/2010WO2010056210A1 Semiconductor substrate, package and device and manufacturing methods thereof
05/20/2010WO2010056209A2 Dicing system and method
05/20/2010WO2010055988A1 Transparent memory for transparent electronic device
05/20/2010WO2010055970A1 Method and apparatus for connecting electronic components through control over heating temperature of adhesive
05/20/2010WO2010055964A1 Method of testing semiconductor device
05/20/2010WO2010055946A1 Processing device
05/20/2010WO2010055926A1 Film forming apparatus
05/20/2010WO2010055872A1 Spherical shell contact, and method for manufacturing same
05/20/2010WO2010055862A1 Plasma etching method and plasma etching device
05/20/2010WO2010055857A1 Soi substrate manufacturing method
05/20/2010WO2010055855A1 Substrate processing apparatus and substrate processing method
05/20/2010WO2010055852A1 Composition for forming resist underlayer film and patterning method using same
05/20/2010WO2010055851A1 Substrate processing system
05/20/2010WO2010055750A1 Light emitting element, light receiving element, and method for manufacturing the light receiving element
05/20/2010WO2010055730A1 Bonding apparatus and bonding method
05/20/2010WO2010055724A1 Ion implantation method, and ion implantation apparatus
05/20/2010WO2010055673A1 Moving body drive control method, exposure method, robot control method, drive control device, exposure device, and robot device
05/20/2010WO2010055669A1 Electrode circuit, film formation device, electrode unit, and film formation method
05/20/2010WO2010055635A1 Nitride semiconductor device
05/20/2010WO2010055614A1 Semiconductor device
05/20/2010WO2010055613A1 Polymer laminate substrate for formation of epitaxially grown film, and manufacturing method therefor
05/20/2010WO2010055612A1 Method for manufacturing metal laminated substrate for semiconductor element formation and metal laminated substrate for semiconductor element formation
05/20/2010WO2010055610A1 Pattern check device and pattern check method
05/20/2010WO2010055603A1 Semiconductor device and method for manufacturing same
05/20/2010WO2010055601A1 Method for accelerating self-assembly of block copolymer and method for forming self-assembled pattern of block copolymer using same
05/20/2010WO2010055569A1 Mosfet and method for manufacturing same
05/20/2010WO2010055552A1 Suck bag height test method, suck bag height test device and computer readable recording medium
05/20/2010WO2010055551A1 Treatment liquid ejection inspecting method, treatment liquid ejection inspecting apparatus and computer readable recording medium
05/20/2010WO2010055374A1 An antireflective coating composition comprising fused aromatic rings
05/20/2010WO2010055373A1 An antireflective coating composition comprising fused aromatic rings
05/20/2010WO2010055102A1 P-type field-effect transistor and method of production
05/20/2010WO2010054987A1 Structure for device isolation
05/20/2010WO2010054957A1 Method for detaching and removing a semiconductor chip from a tape
05/20/2010WO2010054875A1 Arrangement of at least two wafers with a bonding connection and method for producing such an arrangement
05/20/2010WO2010054623A2 Method for positioning and/or guiding at least one random processing head for the metallization of thin substrates at a defined distance above the substrate surface
05/20/2010WO2010054618A1 Composite substrate for a semiconductor chip
05/20/2010WO2010039410A3 Brush box cleaner with force control
05/20/2010WO2010039409A3 Apparatus and method for cleaning semiconductor substrate using pressurized fluid
05/20/2010WO2010036306A3 Solvent softening to allow die placement
05/20/2010WO2010036304A3 Laser ablation to create pocket for die placement
05/20/2010WO2010033156A3 Barrier slurry for low-k dielectrics
05/20/2010WO2010030962A3 Structures and methods for wafer packages, and probes
05/20/2010WO2010028180A3 Adjusting polishing rates by using spectrographic monitoring of a substrate during processing
05/20/2010WO2010025334A3 Localized substrate geometry characterization
05/20/2010WO2010024888A3 Non-contact manipulating devices and methods
05/20/2010WO2010022309A3 Vertical substrate buffering system
05/20/2010WO2010022215A3 Process gas delivery for semiconductor process chamber
05/20/2010WO2010019264A3 Chemical mechanical polisher having movable slurry dispensers and method
05/20/2010WO2010016964A3 Susceptor ring
05/20/2010WO2010006148A3 Wire slicing system
05/20/2010US20100124826 Methods Of Utilizing Block Copolymer To Form Patterns
05/20/2010US20100124825 Barrier metal film production apparatus, barrier metal film production method, metal film production method, and metal film production apparatus
05/20/2010US20100124824 Etch Apparatus and Method of Etching Silicon Nitride
05/20/2010US20100124823 Novel method for removing dummy poly in a gate last process
05/20/2010US20100124822 Apparatuses for adjusting electrode gap in capacitively-coupled rf plasma reactor
05/20/2010US20100124821 Methods for forming a conductive material, methods for selectively forming a conductive material, methods for forming platinum, and methods for forming conductive structures
05/20/2010US20100124820 Method of Making a Contact in a Semiconductor Device
05/20/2010US20100124819 Method of manufacturing nonvolatile semiconductor memory device
05/20/2010US20100124818 Fabricating high-k/metal gate devices in a gate last process
05/20/2010US20100124817 Method of fabricating self-aligned contact pad using chemical mechanical polishing process
05/20/2010US20100124816 Reticles and methods of forming semiconductor devices
05/20/2010US20100124815 Method of manufacturing semiconductor device
05/20/2010US20100124814 Methods for improving the quality of structures comprising semiconductor materials
05/20/2010US20100124813 Self-Aligned Three-Dimensional Non-Volatile Memory Fabrication
05/20/2010US20100124812 Method for fabricating semiconductor device with vertical gate
05/20/2010US20100124811 Method for fabricating capacitor in semiconductor device
05/20/2010US20100124810 Nonvolatile Memory Device and Fabrication Method Thereof
05/20/2010US20100124809 Method for forming a shallow junction region using defect engineering and laser annealing
05/20/2010US20100124808 Method of fabricating semiconductor device
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