Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2010
06/01/2010US7727701 Positive resist composition and method of forming resist pattern
06/01/2010US7727686 Irradiating a thermotropic liquid crystal polymer exhibiting optical anisotropy and having a melting point of 250-350 degrees C. with a pulsed laser to evaporate the polymer, and depositing and solidifying the evaporant on a surface; protects organic electronic device from oxygen and moisture
06/01/2010US7727681 regeneration transmission to quartz substrate doped with gallium; using etching gas; radiation transparent; controlling thickness; photolithography
06/01/2010US7727630 nickel powder batches include particles having a small particle size, narrow size distribution and a spherical morphology, encapulated by a metal oxide selected from ZrO2, SiO2, b2O3, TiO2, Cu2O, CuO, Bi2o3, V2O5 and Al2O3
06/01/2010US7727601 edge-sealed barrier stack includes a decoupling layer and at least two barrier layers(selected from metals, metal oxides, metal nitrides, metal carbides, metal oxynitrides, metal oxyborides); edges sealed against lateral moisture and gas diffusion
06/01/2010US7727412 Dry etching method
06/01/2010US7727408 Semiconductor texturing process
06/01/2010US7727366 Balancing pressure to improve a fluid seal
06/01/2010US7727354 Structure for preventing gap formation and plasma processing equipment having the same
06/01/2010US7727340 silicon carbide substrate covered with silicon dioxide layer, and a SIC/SiO2 interface is doped with N2 using ammonia while annealing for reduction in the interface trap density
06/01/2010US7727331 Crystal firm, crystal substrate, and semiconductor device
06/01/2010US7727053 Double-side polishing method for wafer
06/01/2010US7726964 Molding apparatus and molding method
06/01/2010US7726715 Vacuum suction head
06/01/2010US7726546 Bonding apparatus and bonding method
06/01/2010US7726545 Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei
06/01/2010US7726543 Method for the production of a soldered joint
06/01/2010US7726490 Lid unit thin plate supporting container
06/01/2010US7726323 Device and process for liquid treatment of wafer-shaped articles
06/01/2010US7726013 Method of manufacturing circuit board including transfer chip having a plurality of first pad electrodes connected to wiring
06/01/2010US7726011 Chip transfer method and apparatus
06/01/2010CA2555582C Group i-vii semiconductor single crystal thin film and process for producing same
06/01/2010CA2486662C Vapor-phase growth apparatus
06/01/2010CA2462745C Method of doping organic semi-conductors with quinonediimine derivatives and the dopand thereof
05/2010
05/27/2010WO2010060038A1 Polycarbonates as adhesives in electronics manufacturing
05/27/2010WO2010059921A1 Semi-automated reworkability equipment for de-bonding a display
05/27/2010WO2010059870A2 Interlocking valve chamber and lid
05/27/2010WO2010059868A2 Method and apparatus for trench and via profile modification
05/27/2010WO2010059857A2 Bottom up plating by organic surface passivation and differential plating retardation
05/27/2010WO2010059827A2 Laser scribing platform with moving gantry
05/27/2010WO2010059790A2 Integration sequences with top profile modification
05/27/2010WO2010059781A1 Printing semiconductor elements by shear-assisted elastomeric stamp transfer
05/27/2010WO2010059701A2 Temperature uniformity measurement during thermal processing
05/27/2010WO2010059645A2 Method and apparatus for linear pad conditioning
05/27/2010WO2010059595A2 Laser-scribing tool architecture
05/27/2010WO2010059580A2 Image mask assembly for photolithography
05/27/2010WO2010059556A1 Method and system for stripping the edge of a semiconductor wafer
05/27/2010WO2010059441A2 Methods of forming a masking pattern for integrated circuits
05/27/2010WO2010059434A2 Methods for forming a conductive material, methods for selectively forming a conductive material, methods for forming platinum, and methods for forming conductive structures
05/27/2010WO2010059419A2 Method of forming a semiconductor layer
05/27/2010WO2010059367A2 Methods and apparatus for producing semiconductor on insulator structures using directed exfoliation
05/27/2010WO2010059361A2 Methods and apparatus for producing semiconductor on insulator structures using directed exfoliation
05/27/2010WO2010059357A2 Extended chamber liner for improved mean time between cleanings of process chambers
05/27/2010WO2010059338A1 Integrated capacitor with array of crosses
05/27/2010WO2010059337A1 Integrated capacitor with alternating layered segments
05/27/2010WO2010059336A1 Integrated capacitor with grid plates
05/27/2010WO2010059335A1 Shielding for integrated capacitors
05/27/2010WO2010059334A1 Integrated capacitor with interlinked lateral fins
05/27/2010WO2010059310A2 Laser ablation tooling via sparse patterned masks
05/27/2010WO2010059300A2 Pyrometry for substrate processing
05/27/2010WO2010059296A1 Self-aligned three-dimensional non-volatile memory fabrication
05/27/2010WO2010059252A2 Front end of line plasma mediated ashing processes and apparatus
05/27/2010WO2010059152A1 Improved switching materials comprising mixed nanoscopic particles and carbon nanotubes and method of making and using the same
05/27/2010WO2010059131A1 Method of at least partially releasing an epitaxial layer
05/27/2010WO2010059118A1 Functional capping
05/27/2010WO2010059042A1 Device and method for at least partially encapsulating a closed flat carrier with electronic components
05/27/2010WO2010058912A2 Probe card and fabrication method thereof
05/27/2010WO2010058825A1 Al ALLOY FILM FOR DISPLAY DEVICE, THIN FILM TRANSISTOR SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND DISPLAY DEVICE
05/27/2010WO2010058820A1 Nitride semiconductor
05/27/2010WO2010058813A1 Substrate processing method and substrate processing apparatus
05/27/2010WO2010058812A1 Substrate processing apparatus
05/27/2010WO2010058771A1 Plasma processing apparatus
05/27/2010WO2010058746A1 Semiconductor device and manufacturing method thereof
05/27/2010WO2010058739A1 Display panel substrate and display panel
05/27/2010WO2010058738A1 Substrate for display panel, and display panel
05/27/2010WO2010058727A1 Electronic component manufacturing method
05/27/2010WO2010058694A1 Semiconductor integrated circuit device
05/27/2010WO2010058689A1 Non-contact conveying device
05/27/2010WO2010058672A1 Substrate processing method and substrate processing apparatus
05/27/2010WO2010058662A1 Method for manufacturing organic thin film transistor, and organic thin film transistor
05/27/2010WO2010058656A1 Interface apparatus
05/27/2010WO2010058645A1 Ion implantation device and deflection electrode
05/27/2010WO2010058642A1 Plasma processing device and plasma processing method
05/27/2010WO2010058619A1 Circuit substrate, display panel, and display device
05/27/2010WO2010058610A1 Silicon carbide semiconductor device and method for manufacturing the same
05/27/2010WO2010058606A1 Retaining member management device, stacked semiconductor manufacturing equipment, and retaining member management method
05/27/2010WO2010058581A1 Shift register
05/27/2010WO2010058561A1 Field effect transistor
05/27/2010WO2010058560A1 Plasma processing apparatus
05/27/2010WO2010058541A1 Flexible semiconductor device and method for manufacturing same
05/27/2010WO2010058532A1 Semiconductor device, method for manufacturing same, and display device using semiconductor device
05/27/2010WO2010058528A1 Semiconductor layer and method for forming same
05/27/2010WO2010058516A1 Method for mounting member
05/27/2010WO2010058494A1 Semiconductor device
05/27/2010WO2010058481A1 Wafer bonding apparatus
05/27/2010WO2010058389A1 Method and device for facilitating separation of sliced wafers
05/27/2010WO2010058379A2 Bicmos integration of multiple-times-programmable non-volatile memories
05/27/2010WO2010058264A1 P-TYPE SiC SEMICONDUCTOR
05/27/2010WO2010058049A1 Preparation of biocompatible materials from waste from the process for manufacturing beer and uses thereof
05/27/2010WO2010058009A2 Method for rotating a sawed wafer block and device therefor
05/27/2010WO2010057941A1 A method of producing a silicon-on-sapphire type heterostructure.
05/27/2010WO2010057842A1 Preparing a surface of a sapphire substrate for fabricating heterostructures
05/27/2010WO2010057837A1 Device and method for coating a substrate using cvd
05/27/2010WO2010057836A1 Device and method for coating a substrate using cvd
05/27/2010WO2010057835A2 Radiation detector use of a radiation detector and method for producing a radiation detector
05/27/2010WO2010057808A1 Semiconductor device having stacked components
05/27/2010WO2010057671A2 Method and device for handling a cut wafer block
05/27/2010WO2010057613A2 Tandem solar cell made from crystalline silicon and crystalline silicon carbide and method for the production thereof
05/27/2010WO2010039177A3 A semiconductor device having a multi-layer substrate and a method of forming the semiconductor device
05/27/2010WO2010036489A3 Microwave plasma containment shield shaping
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