Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2010
05/27/2010US20100128966 Pattern shape evaluation method and pattern shape evaluation apparatus utilizing the same
05/27/2010US20100128749 Vertical-Cavity Surface-Emitting Semiconductor Laser Diode And Method For The Manufacture Thereof
05/27/2010US20100128518 Novel spin momentum transfer MRAM design
05/27/2010US20100128409 Aluminum nitride sintered product, method for producing the same, and electrostatic chuck including the same
05/27/2010US20100128337 Stiction mitigation with integrated mech micro-cantilevers through vertical stress gradient control
05/27/2010US20100128235 Lithographic apparatus and device manufacturing method
05/27/2010US20100128205 Display substrate and method for manufacturing the same
05/27/2010US20100128192 Liquid crystal display and method of manufacturing the same
05/27/2010US20100128190 Liquid Crystal Display and Manufacturing Method of the Same
05/27/2010US20100127937 Antenna Integrated in a Semiconductor Chip
05/27/2010US20100127798 Micro-Electromechanical Resonators Having Electrically-Trimmed Resonator Bodies Therein and Methods of Fabricating Same Using Joule Heating
05/27/2010US20100127727 Protection layers for media protection during fabrication of probe memory device
05/27/2010US20100127596 Micro-Electromechanical Resonators Having Boron-Doped and Boron-Assisted Aluminum-Doped Resonator Bodies Therein
05/27/2010US20100127409 Microelectronic device wafers including an in-situ molded adhesive, molds for in-situ molding adhesives on microelectronic device wafers, and methods of molding adhesives on microelectronic device wafers
05/27/2010US20100127408 Bonding pad structure for back illuminated optoelectronic device and fabricating method thereof
05/27/2010US20100127407 Two-sided substrateless multichip module and method of manufacturing same
05/27/2010US20100127403 Semiconductor apparatus manufacturing method and semiconductor apparatus
05/27/2010US20100127400 Semiconductor module and process for its fabrication
05/27/2010US20100127399 Wiring structure between steps and wiring method thereof
05/27/2010US20100127396 Integrated circuit module and method of packaging same
05/27/2010US20100127395 Methods for selective reverse mask planarization and interconnect structures formed thereby
05/27/2010US20100127394 Through substrate vias for back-side interconnections on very thin semiconductor wafers
05/27/2010US20100127386 Device including a semiconductor chip
05/27/2010US20100127385 Method for manufacturing an element having electrically conductive members for application in a microelectronic package
05/27/2010US20100127384 Semiconductor device and connection checking method for semiconductor device
05/27/2010US20100127380 Leadframe free leadless array semiconductor packages
05/27/2010US20100127377 Method for Producing a MEMS Package
05/27/2010US20100127376 System and method to provide rf shielding for a mems microphone package
05/27/2010US20100127375 Wafer level chip scale semiconductor packages
05/27/2010US20100127372 Semiconductor packages
05/27/2010US20100127369 Lead frame, method for manufacturing the same and semiconductor device
05/27/2010US20100127367 Chip package and manufacturing method thereof
05/27/2010US20100127366 Integrated Leadframe And Bezel Structure And Device Formed From Same
05/27/2010US20100127365 Leadframe-based chip scale semiconductor packages
05/27/2010US20100127363 Very extremely thin semiconductor package
05/27/2010US20100127361 Encapsulant interposer system with integrated passive devices and manufacturing method therefor
05/27/2010US20100127360 Semiconductor Device and Method of Forming WLCSP Using Wafer Sections Containing Multiple Die
05/27/2010US20100127359 Die-To-Die Power Consumption Optimization
05/27/2010US20100127358 Integration of damascene type diodes and conductive wires for memory device
05/27/2010US20100127356 Structures and methods for reducing junction leakage in semiconductor devices
05/27/2010US20100127355 Semiconductor device and method
05/27/2010US20100127354 Silicon single crystal and method for growing thereof, and silicon wafer and method for manufacturing thereof
05/27/2010US20100127353 Strain engineered composite semiconductor substrates and methods of forming same
05/27/2010US20100127350 Semiconductor device and method of manufacturing the semiconductor device
05/27/2010US20100127346 Power distribution for cmos circuits using in-substrate decoupling capacitors and back side metal layers
05/27/2010US20100127345 3-d circuits with integrated passive devices
05/27/2010US20100127344 Contact over isolator
05/27/2010US20100127343 Glass-Ceramic-Based Semiconductor-On-Insulator Structures and Method For Making The Same
05/27/2010US20100127340 Mems package and method of manufacturing the mems package
05/27/2010US20100127339 Micromechanical component having an anti-adhesive layer
05/27/2010US20100127338 Semiconductor device and method for manufacturing the same
05/27/2010US20100127337 Inverter structure and method for fabricating the same
05/27/2010US20100127336 Structure and method for metal gate stack oxygen concentration control using an oxygen diffusion barrier layer and a sacrificial oxygen gettering layer
05/27/2010US20100127335 Methods to Enhance Effective Work Function of Mid-Gap Metal by Incorporating Oxygen and Hydrogen at a Low Thermal Budget
05/27/2010US20100127332 Integrated circuit transistors
05/27/2010US20100127330 Semiconductor device and method of manufacturing the same
05/27/2010US20100127328 Semiconductor-on-insulator (soi) devices using void spaces
05/27/2010US20100127324 Trench MOSFET with terrace gate and self-aligned source trench contact
05/27/2010US20100127323 Trench MOSFET with trench source contact having copper wire bonding
05/27/2010US20100127321 Semiconductor and Manufacturing Method for the Same
05/27/2010US20100127318 Bicmos integration of multiple-times-programmable non-volatile memories
05/27/2010US20100127317 Semiconductor device and method for manufacturing the same
05/27/2010US20100127313 Pixel for picking up image signal and method of manufacturing the pixel
05/27/2010US20100127312 Graphene deposition and graphenated substrates
05/27/2010US20100127311 Semiconductor device and method for fabricating the same
05/27/2010US20100127310 Semiconductor device and method for producing the same
05/27/2010US20100127308 Non-volatile memory cell with self aligned floating and erase gates, and method of making same
05/27/2010US20100127307 Field effect transistor and method of manufacturing the same
05/27/2010US20100127306 Semiconductor device and manufacturing method of the same
05/27/2010US20100127304 Bipolar semiconductor device and manufacturing method
05/27/2010US20100127299 Actively Cooled LED Lighting System and Method for Making the Same
05/27/2010US20100127292 Wafer level led package structure for increasing light-emitting efficiency and method for making the same
05/27/2010US20100127290 Light emitting diode package and manufacturing method thereof
05/27/2010US20100127278 Semiconductor device and method for fabricating the same
05/27/2010US20100127275 Gan-based field effect transistor and method of manufacturing the same
05/27/2010US20100127272 Thin film transistor array panel and manufacturing method thereof
05/27/2010US20100127271 Electronic circuit structure and method for forming same
05/27/2010US20100127269 Method and structure for establishing contacts in thin film transistor devices
05/27/2010US20100127268 Thin film transistors and high fill factor pixel circuits and methods for forming same
05/27/2010US20100127266 Thin film transistor, method for manufacturing same, display device, and method for manufacturing same
05/27/2010US20100127265 Thin Film Transistor Array Substrate and Manufacturing Method Thereof
05/27/2010US20100127263 Liquid crystal display device and method of manufacturing the same
05/27/2010US20100127256 Semiconductor thin film, semiconductor thin film manufacturing method and semiconductor element
05/27/2010US20100127255 Contact and method of fabrication
05/27/2010US20100127253 Tft substrate and method for manufacturing tft substrate
05/27/2010US20100127242 Transparent electronics based on transfer printed carbon nanotubes on rigid and flexible substrates
05/27/2010US20100127241 Electronic Devices with Carbon Nanotube Components
05/27/2010US20100127234 Phase change memory device having an increased sensing margin for cell efficiency and method for manufacturing the same
05/27/2010US20100127233 Method for controlled formation of the resistive switching material in a resistive switching device and device obtained thereof
05/27/2010US20100127232 Non-volatile memory
05/27/2010US20100127172 Use of noble metal nanoparticles as light absorbers and heat generators in thermal photodetectors, sensors and microelecromechanical devices
05/27/2010US20100127046 High temperature, stable sic device interconnects and packages having low thermal resistance
05/27/2010US20100126904 Thin-plate container
05/27/2010US20100126669 Vacuum treatment apparatus
05/27/2010US20100126666 Plasma processing apparatus
05/27/2010US20100126568 Nanowires, Nanowire Junctions, and Methods of Making the Same
05/27/2010US20100126565 Conductive paste for solar cell electrode
05/27/2010US20100126548 Thermoelectric device, thermoelectic device module, and method of forming the thermoelectric device
05/27/2010US20100126532 Substrate processing apparatus and substrate processing method
05/27/2010US20100126527 Apparatus for and method of processing substrate subjected to exposure process
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