Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2010
06/01/2010US7727879 Method of forming top electrode for capacitor and interconnection in integrated passive device (IPD)
06/01/2010US7727878 Method for forming passivation layer
06/01/2010US7727877 Method of manufacturing a wafer level package that uses the same seed layer for selectively electroplating a rewiring pattern and a conductive pillar
06/01/2010US7727876 Semiconductor device and method of protecting passivation layer in a solder bump process
06/01/2010US7727875 Grooving bumped wafer pre-underfill system
06/01/2010US7727874 Non-polar and semi-polar GaN substrates, devices, and methods for making them
06/01/2010US7727873 Production method of gallium nitride-based compound semiconductor multilayer structure
06/01/2010US7727872 Methods for fabricating semiconductor components with conductive interconnects
06/01/2010US7727871 having ozone dissolved into a liquid containing H2SO4, HF and H2O; selectively etch a CF deposit and an SiO2 deposit; forming a flash memory device
06/01/2010US7727870 Method of making a semiconductor device using a stressor
06/01/2010US7727869 Method of forming metal wiring and method of manufacturing active matrix substrate
06/01/2010US7727868 Apparatus and method for controlling diffusion
06/01/2010US7727867 Method for manufacturing SIMOX wafer
06/01/2010US7727866 Use of chained implants in solar cells
06/01/2010US7727865 Method for controlling conductivity of Ga2O3single crystal
06/01/2010US7727864 Controlled composition using plasma-enhanced atomic layer deposition
06/01/2010US7727863 Sonic irradiation during wafer immersion
06/01/2010US7727862 Semiconductor device including semiconductor constituent and manufacturing method thereof
06/01/2010US7727861 Method and device for contacting semiconductor chips
06/01/2010US7727860 Method for manufacturing bonded wafer and outer-peripheral grinding machine of bonded wafer
06/01/2010US7727859 Semiconductor device and manufacturing method thereof
06/01/2010US7727858 Method for fabricating a chip scale package using wafer level processing
06/01/2010US7727857 Manufacturing method of semiconductor device
06/01/2010US7727856 Selective STI stress relaxation through ion implantation
06/01/2010US7727855 Fabrication of aligned nanowire lattices
06/01/2010US7727854 Manufacturing method of semiconductor device
06/01/2010US7727853 Processing method, manufacturing method of semiconductor device, and processing apparatus
06/01/2010US7727852 Substrate with check mark and method of inspecting position accuracy of conductive glue dispensed on the substrate
06/01/2010US7727851 Method of measuring shifted epitaxy layer by buried layer
06/01/2010US7727850 Method for forming capacitor of semiconductor device
06/01/2010US7727849 Method for manufacturing semiconductor device having a capacitor
06/01/2010US7727848 Methods and semiconductor structures for latch-up suppression using a conductive region
06/01/2010US7727847 Method for manufacturing display device
06/01/2010US7727846 Method of manufacturing an SOI substrate and method of manufacturing a semiconductor device
06/01/2010US7727845 Ultra shallow junction formation by solid phase diffusion
06/01/2010US7727844 Gate structure of a semiconductor device
06/01/2010US7727843 Semiconductor element, semiconductor storage device using the same, data writing method thereof, data reading method thereof, and manufacturing method of those
06/01/2010US7727842 Method of simultaneously siliciding a polysilicon gate and source/drain of a semiconductor device, and related device
06/01/2010US7727841 Method of manufacturing semiconductor device with dual gates
06/01/2010US7727840 Forming integrated circuit devices
06/01/2010US7727839 Method of manufacturing NAND flash memory device
06/01/2010US7727838 Method to improve transistor Tox using high-angle implants with no additional masks
06/01/2010US7727837 Method of producing an integrated circuit having a capacitor with a supporting layer
06/01/2010US7727836 Semiconductor device and process for production thereof
06/01/2010US7727835 SOI device with charging protection and methods of making same
06/01/2010US7727834 Contact configuration and method in dual-stress liner semiconductor device
06/01/2010US7727833 Work function based voltage reference
06/01/2010US7727832 Semiconductor device and method for manufacturing the same
06/01/2010US7727831 Semiconductor device
06/01/2010US7727830 Fabrication of germanium nanowire transistors
06/01/2010US7727829 Method of forming a semiconductor device having a removable sidewall spacer
06/01/2010US7727828 Method for fabricating a gate dielectric of a field effect transistor
06/01/2010US7727827 Method of forming a semiconductor structure
06/01/2010US7727826 Method for manufacturing a semiconductor device
06/01/2010US7727825 Polyconductor line end formation and related mask
06/01/2010US7727824 Liquid crystal display device and fabricating method thereof
06/01/2010US7727823 Flat panel display and method for driving the same
06/01/2010US7727822 Active matrix substrate and liquid crystal display device, production methods thereof and electronic device
06/01/2010US7727821 Image sensing cell, device, method of operation, and method of manufacture
06/01/2010US7727820 Misalignment-tolerant methods for fabricating multiplexing/demultiplexing architectures
06/01/2010US7727819 Process for producing a functional device-mounted module
06/01/2010US7727818 Substrate process for an embedded component
06/01/2010US7727817 Semiconductor integrated circuit package and method of packaging semiconductor integrated circuit
06/01/2010US7727816 Integrated circuit package system with offset stacked die
06/01/2010US7727815 Reactive gettering in phase change solders to inhibit oxidation at contact surfaces
06/01/2010US7727814 Microelectronic package interconnect and method of fabrication thereof
06/01/2010US7727813 Method for making a device including placing a semiconductor chip on a substrate
06/01/2010US7727812 Singulation method of semiconductor device
06/01/2010US7727811 Photopolymerizable mixture of an acrylic polymer, a multifunctional acrylate oligomer with molecular weight of 1000-2500, and a multifunctional acrylate with molecular weight of 200-700; good for uneven surfaces such as laser printed surfaces; can be released without leaving residue
06/01/2010US7727810 Wafer dividing method
06/01/2010US7727809 Attachment method, attachment apparatus, manufacturing method of semiconductor device, and manufacturing apparatus of semiconductor device
06/01/2010US7727808 Ultra thin die electronic package
06/01/2010US7727807 Semiconductor device
06/01/2010US7727806 Systems and methods for high density multi-component modules
06/01/2010US7727805 Reducing stress in a flip chip assembly
06/01/2010US7727804 Method and apparatus for fabricating self-assembling microstructures
06/01/2010US7727803 Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device
06/01/2010US7727802 Method for fabricating an electronic component embedded substrate
06/01/2010US7727801 Apparatus for improved power distribution in wirebond semiconductor packages
06/01/2010US7727800 High precision die bonding apparatus
06/01/2010US7727799 Integrated circuit package
06/01/2010US7727798 Method for production of diamond-like carbon film having semiconducting property
06/01/2010US7727795 Exponentially doped layers in inverted metamorphic multijunction solar cells
06/01/2010US7727794 Photodiode array, method for manufacturing same, and radiation detector
06/01/2010US7727793 Physical quantity sensor and manufacturing method therefor
06/01/2010US7727792 Laser diode epitaxial wafer and method for producing same
06/01/2010US7727791 Semiconductor layer, process for forming the same, and semiconductor light emitting device
06/01/2010US7727790 Method for fabricating light emitting diodes
06/01/2010US7727788 Method of manufacturing display device using LED chips formed in a porous template
06/01/2010US7727787 Nitride semiconductor light emitting device and method of manufacturing the same
06/01/2010US7727786 Photon-based memory device
06/01/2010US7727785 Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive
06/01/2010US7727784 Display device and fabrication method thereof
06/01/2010US7727783 Method of measuring minority carrier diffusion length and method of manufacturing silicon wafer
06/01/2010US7727782 Apparatus for improving incoming and outgoing wafer inspection productivity in a wafer reclaim factory
06/01/2010US7727781 Manufacture of devices including solder bumps
06/01/2010US7727780 Substrate processing method and semiconductor manufacturing apparatus
06/01/2010US7727779 Method of fabricating and/or repairing a light emitting device
06/01/2010US7727778 Magnetoresistive element and method of manufacturing the same
06/01/2010US7727777 Forming ferroelectric polymer memories
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