Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2010
05/12/2010EP2184381A1 Dry etching method for magnetic material
05/12/2010EP2184380A1 Dry etching method for magnetic material
05/12/2010EP2184331A1 Pressure sensitive adhesive sheet and process for manufacturing electronic part
05/12/2010EP2184288A2 Method for producing borazine compound
05/12/2010EP2183792A1 Gallium nitride light-emitting device with ultra-high reverse breakdown voltage
05/12/2010EP2183781A1 Method for forming gate structures
05/12/2010EP2183777A1 Flexible joint
05/12/2010EP2183774A2 Wire saw process
05/12/2010EP2183773A1 Improved buried isolation layer
05/12/2010EP2183772A1 Device and method for transporting substrates
05/12/2010EP2183769A1 Copper metallization of through silicon via
05/12/2010EP2183767A2 Preparation method of electroconductive copper patterning layer by laser irradiation
05/12/2010EP2183766A1 Apparatus and method of improving beam shaping and beam homogenization
05/12/2010EP2183765A1 Apparatuses and methods of substrate temperature control during thin film solar manufacturing
05/12/2010EP2183764A1 Transfer chuck for transferring flat materials, particularly wafers
05/12/2010EP2183333A2 Compositions and methods for chemical-mechanical polishing of phase change materials
05/12/2010EP2183185A2 Wafer joining method, wafer assemblage, and chip
05/12/2010EP2050140B1 Method of manufacturing a double gate transistor
05/12/2010EP2018676B1 Method for production of a multi-layered object
05/12/2010EP1759420B1 Semiconductor on insulator semiconductor device and method of manufacture
05/12/2010EP1749310B1 Substrate for electronic application comprising a flexible support and method for production thereof
05/12/2010EP1703548B1 Exposure apparatus, exposure method, and device producing method
05/12/2010EP1658394B1 Method to manufacture indium nitride quantum dots and product containing these dots
05/12/2010EP1548804B1 Illuminating optical system, exposure system and exposure method
05/12/2010EP1410110B1 Real time analysis of periodic structures on semiconductors
05/12/2010EP1143496B1 Plasma etching method
05/12/2010EP1125167B1 Methods of reducing proximity effects in lithographic processes
05/12/2010EP1114457B1 Method for producing integrated circuits
05/12/2010EP1114456B1 Collective method for conditioning a plurality of components initially formed in a common substrate
05/12/2010EP0956597B1 Semiconductor diodes having low forward conduction voltage drop and low reverse current leakage
05/12/2010DE202010000637U1 Bondmaschine mit Spule Bonding machine with coil
05/12/2010DE202009017765U1 Silicium-Wafer Silicon wafer
05/12/2010DE202009017763U1 Vorrichtung zum Auffinden von Fehlstellen in Halbleiterbauelementen A device for finding defects in semiconductor devices
05/12/2010DE112008000304T5 Integration elektronischer und optischer Schaltungen mittels Waferbonden Integration of electronic and optical circuits using wafer bonding
05/12/2010DE10359493B4 Integrationsverfahren für eine Halbleitervorrichtung mit einer vertieften Gate-Elektrode Integration process for a semiconductor device with a recessed gate electrode
05/12/2010DE10347464B4 Vorrichtung und Verfahren zum Reinigen und Trocknen von Halbleitererzeugnissen oder von bei der Herstellung von Halbleitererzeugnissen verwendeten Handhabungskörben Apparatus and method for cleaning and drying of semiconductor products or the materials used in the manufacture of semiconductor products handling baskets
05/12/2010DE10307537B4 Integrierter Baustein mit einem Verzögerungselement und Verfahren zum Einstellen einer zeitlichen Lage eies Signals Integrated module with a delay element and method for adjusting a timing signal eies
05/12/2010DE102009043520A1 Halbleiterbauelement Semiconductor device
05/12/2010DE102009034449A1 Verfahren zum Herstellen eines Halbleiterchips und eines Halbleitermoduls A method of manufacturing a semiconductor chip and a semiconductor module
05/12/2010DE102009004902B3 Verfahren zur simultanen Mikrostrukturierung und Passivierung Method for the simultaneous microstructuring and passivation
05/12/2010DE102008057005A1 Verfahren zum Positionieren und/oder Führen mindestens eines beliebigen Prozesskopfes für die Metallisierung von dünnen Substraten in einem definierten Abstand über der Substratoberfläche A method for positioning and / or guiding at least one head any process for the metallization of thin substrates at a defined distance above the substrate surface
05/12/2010DE102008056175A1 Verfahren zur Herstellung eines Strahlung emittierenden Dünnschichtbauelements und Strahlung emittierendes Dünnschichtbauelement A process for producing a radiation-emitting thin film component and radiation-emitting thin film device
05/12/2010DE102008054077A1 Verfahren und Vorrichtung zur Herstellung von Bonddrähten auf der Grundlage mikroelektronischer Herstellungstechniken Method and apparatus for the production of bonding wires on the basis of microelectronic fabrication techniques
05/12/2010DE102008054074A1 Verfahren zum Verringern von Ungleichmäßigkeiten während des chemisch-mechanischen Polierens von Mikrostrukturbauelementen durch Verwenden von CMP-Belägen in einem glasierten Zustand A method for reducing non-uniformities during the chemical-mechanical polishing of microstructure devices by using CMP pads in a glazed state
05/12/2010DE102008054072A1 Selbstkorrigierendes Substrathaltesystem für die Fokussteuerung in Belichtungssystemen Self-Corrective substrate support system for focus control in imaging systems
05/12/2010DE102008054069A1 Reduzierte Scheibendurchbiegung in Halbleitern durch Verspannungstechniken im Metallisierungssystem Reduced disk deflection in semiconductors by bracing techniques metallization
05/12/2010DE102008054054A1 Halbleiterbauelement mit einem Aufbau für reduzierte Verspannung von Metallsäulen A semiconductor device having a structure for reduced strain of metal columns
05/12/2010DE102008053956A1 Halbleiterbauelement mit einer aufgeteilten intern verbundenen Sensorstruktur für chipinterne Überwachungszwecke A semiconductor device having a divided structure for internally connected sensor chip monitoring purposes
05/12/2010DE102008053955A1 Verbesserung der Verspannungsübertragung in Transistoren durch eine späte Gaterekristallisierung Improvement of stress transfer in transistors by a late Gaterekristallisierung
05/12/2010DE102008053684A1 Rear lighting device for semiconductor products i.e. solar cell, has scattering units arranged at edges of interruptions, so that semiconductor products are backlighted in region of interruptions of common formed surface
05/12/2010DE102008051403A1 Thyristor arrangement has semiconductor body, where p-dopped emitter and n-dopped basis are arranged in vertical direction between back side and front side
05/12/2010DE102008051245A1 Hochvolttransistor mit hoher Stromtragfähigkeit und Verfahren zur Herstellung High-voltage transistor having a high current-carrying capacity and process for preparing
05/12/2010DE102008043517A1 Sensormodul und Verfahren zur Herstellung eines Sensormoduls Sensor module and method of manufacturing a sensor module
05/12/2010DE102008026182B4 Verfahren zur Herstellung eines Mikrostrukturbauelements mit einem kompressiv verspannten Material mit kleinem ε und Halbleiterbauelement bzw. MOS-Transistor A process for producing a microstructure device having a compressively stressed material with small ε and semiconductor device or MOS transistor
05/12/2010DE102008011932B4 Verfahren zur Erhöhung der Eindringtiefe von Drain- und Sourceimplantationssorten für eine gegebene Gatehöhe A method for increasing the penetration depth of the drain and source implantation species for a given gate height
05/12/2010DE102007051177B4 Verfahren zur Herstellung einer Siliziumkarbid-Halbleitervorrichtung A process for producing a silicon carbide semiconductor device
05/12/2010DE102007014978B4 Integrierte Schaltkreise, Verfahren zum Herstellen integrierter Schaltkreise und integrierte Speicherarrays Integrated circuits, processes for manufacturing integrated circuits and integrated memory array
05/12/2010DE102007002961B4 Speichervorrichtung und Verfahren zu deren Herstellung Storage device and process for their preparation
05/12/2010DE102005030065B4 Festphasenepitaxie verwendendes Halbleiterbauelement und Verfahren zur Herstellung desselben Solid phase epitaxy-use semiconductor device and method of manufacturing the same
05/12/2010DE102005025951B4 Verfahren zum Herstellen einer Mehrschicht-Gatestapelstruktur mit einer Metallschicht und Gatestapelstruktur für eine FET-Vorrichtung A method of manufacturing a multilayer gate stack structure with a metal layer and gate stack structure for a FET device
05/12/2010DE102004006520B4 Verfahren zur Herstellung einer DRAM-Speicherzellenanordnung mit Trenchkondensatoren und Stegfeldeffekttransistoren (FinFET) sowie DRAM-Speicherzellenanordnung A method of manufacturing a DRAM memory cell array with trench capacitors and fin field-effect transistors (FinFET) and DRAM memory cell arrangement
05/12/2010CN201467622U Manual centering positioning system for chip
05/12/2010CN201467091U Optocoupler-driven protection device
05/12/2010CN201466047U Printing positioning device for silicon chips
05/12/2010CN201466031U Table type rectification chip capable of preventing high voltage discharge
05/12/2010CN201466018U Power semiconductor device
05/12/2010CN201466014U Crystal holding clamp for crystal holder
05/12/2010CN201466013U Wafer transmission device
05/12/2010CN201466012U Working platform travel mechanism
05/12/2010CN201466011U Device for automatically filling a plurality of chips
05/12/2010CN201466010U Full-automatic diode gilling machine
05/12/2010CN201466009U Sliver paste tray device
05/12/2010CN201466008U Heating device of gluing device for manufacture process of a semi-conductor packing gluing piece
05/12/2010CN201466007U Copper process equipment
05/12/2010CN201466006U Wafer cleaning and drying device
05/12/2010CN201465987U Plasma treatment device
05/12/2010CN201464508U Spring needle contact pad and probe card applying same
05/12/2010CN201458340U 一种基板立式挂架的装载装置 A substrate vertical rack loading device
05/12/2010CN201458205U Basket tool for glass substrates
05/12/2010CN201455993U Robot arm and wafer transferring disk using same
05/12/2010CN201455841U Double-head vacuum nozzle
05/12/2010CN201455812U Simple lapping liquid supply system
05/12/2010CN201455792U Chemical mechanical polishing head for square substrate
05/12/2010CN201455540U Ultrasonic conductor compression jointing machine
05/12/2010CN201454758U Device for chemical liquid sprinkling treatment of round lamelliform objects
05/12/2010CN1994713B Crystal grain separation device and separation method thereof
05/12/2010CN1992169B Method for implanting a wafer with an ion beam
05/12/2010CN1986872B Machine for treating substrates and method
05/12/2010CN1985335B Method for bilayer resist plasma etch
05/12/2010CN1983510B Method of manufacturing semiconductor device
05/12/2010CN1973358B Processing system and method for chemically treating a TERA layer
05/12/2010CN1971917B Non-volatile memory devices having floating gates and related methods of forming the same
05/12/2010CN1967776B Semiconductor processing system and vaporizer
05/12/2010CN1963666B Method and system for converting integrated circuit design into a plurality of masks
05/12/2010CN1963612B Display of initiative irradiance and passiveness reflection and manufacturing method thereof
05/12/2010CN1961055B Electrochemical-mechanical polishing composition and method for using the same
05/12/2010CN1959979B 半导体器件 Semiconductor devices
05/12/2010CN1959966B Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sink
05/12/2010CN1956173B Semiconductor device and method of manufacture thereof
05/12/2010CN1954967B Lapping pad and its manufacturing method
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