Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2010
05/20/2010US20100123134 Method of producing semiconductor device and soq (silicon on quartz) substrate used in the method
05/20/2010US20100123133 Spin-polarised charge-carrier device
05/20/2010US20100123132 Thin film device and manufacturing method of the same
05/20/2010US20100123130 Semiconductor device and method for manufacturing the same
05/20/2010US20100123129 ZnO-CONTAINING SEMICONDUCTOR LAYER AND DEVICE USING THE SAME
05/20/2010US20100123122 Select devices including an open volume, memory devices and systems including same, and methods for forming same
05/20/2010US20100123116 Switching materials comprising mixed nanoscopic particles and carbon nanotubes and method of making and using the same
05/20/2010US20100123115 Interconnect And Method For Mounting An Electronic Device To A Substrate
05/20/2010US20100123069 Backside illuminated imaging sensor with improved angular response
05/20/2010US20100122840 Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board
05/20/2010US20100122774 Substrate mounting table and substrate processing apparatus having same
05/20/2010US20100122772 Substrate treatment apparatus and substrate treatment method
05/20/2010US20100122771 Chemical treatment apparatus
05/20/2010US20100122724 Four Junction Inverted Metamorphic Multijunction Solar Cell with Two Metamorphic Layers
05/20/2010US20100122711 wet clean method for semiconductor device fabrication processes
05/20/2010US20100122578 Micromechanical component
05/20/2010US20100122457 Application method and apparatus for resin
05/20/2010DE202009017691U1 Vorrichtung zur Detektion von Defekten in einem Objekt An apparatus for detecting defects in an object
05/20/2010DE112005002350B4 Ein Verfahren zur Herstellung eines Halbleiterbauelements mit High-k-Gate-Dielektrikumschicht und Silizid-Gate-Elektrode A method of manufacturing a semiconductor device with high-k gate dielectric layer and silicide gate electrode
05/20/2010DE112004002409B4 Verfahren zum Verbessern der Transistorleistung durch Reduzieren des Salizidgrenzflächenwiderstandes und Transistor A method for improving transistor performance by reducing the transistor and Salizidgrenzflächenwiderstandes
05/20/2010DE102009044474A1 Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements A semiconductor device and method of manufacturing a semiconductor device
05/20/2010DE102009044391A1 Verfahren zum Strukturieren von Strukturmerkmalen und Strukturen davon Method for structuring of structural features and structures thereof
05/20/2010DE102009044377A1 Kontaktstrukturierungsverfahren mit Übergangsätzrückkopplung Contact structuring method with Übergangsätzrückkopplung
05/20/2010DE102008058003A1 Halbleitermodul und Verfahren zu dessen Herstellung Semiconductor module and method for its production
05/20/2010DE102008054075A1 Abgesenkter Drain- und Sourcebereich in Verbindung mit einer komplexen Silizidherstellung in Transistoren Lowered drain and source region in combination with a complex Silizidherstellung in transistors
05/20/2010DE102008053180A1 Teilchenstrahlschreibverfahren, Teilchenstrahlschreibvorrichtung und Wartungsverfahren für selbige Teilchenstrahlschreibverfahren, Teilchenstrahlschreibvorrichtung and maintenance procedures for selbige
05/20/2010DE102008043858A1 Verfahren zur Passivierung eines Feldeffekttransistors A method for passivation of a field effect transistor
05/20/2010DE102008043773A1 Electrical and/or micromechanical component, has base substrate whose main side is provided with portions, where portions exceeding over region of cap are decoupled from material of package
05/20/2010DE102008043735A1 Anordnung von mindestens zwei Wafern mit einer Bondverbindung und Verfahren zur Herstellung einer solchen Anordnung Arrangement of at least two wafers with a bonding compound and method for producing such an arrangement
05/20/2010DE102007048306A1 Integrierter Schaltkreis mit Schalteinheit zur Speicherzellen-Kopplung, und Verfahren zur Herstellung eines integrierten Schaltkreises zur Speicherzellen-Kopplung An integrated circuit comprising switching unit for coupling the memory cells, and methods of making an integrated circuit for the memory cell coupling
05/20/2010DE102007022095B4 Integrierter Schaltkreis mit einer Speicherzellenanordnung, integrierter Schaltkreis mit einer NAND-Speicherzellenanordnung und Verfahren zum Herstellen eines integrierten Schaltkreises mit einer Speicherzellenanordnung An integrated circuit comprising a memory cell array, an integrated circuit having a NAND memory cell array and method of manufacturing an integrated circuit having a memory cell arrangement
05/20/2010DE102006024214B4 Verfahren zum Herstellen einer dielektrischen Zwischenschicht und Verfahren zum Herstellen eines Speicherkondensators A method for manufacturing an interlayer dielectric layer and method of making a storage capacitor
05/20/2010DE102005014619B4 Integriertes Schaltkreisbauelement mit Gatestruktur und zugehöriges Herstellungsverfahren Integrated circuit device having gate structure and manufacturing method thereof
05/19/2010EP2187717A1 Circuit board, circuit module and circuit board manufacturing method
05/19/2010EP2187434A1 Aerostatically guided table system for vacuum application
05/19/2010EP2187433A1 Apparatus and method for transporting and processing substrates
05/19/2010EP2187432A1 P-type field-effect transistor and method of production
05/19/2010EP2187431A1 Semiconductor device and method for manufacturing the same
05/19/2010EP2187430A1 Position measuring system, exposure device, position measuring method, exposure method, device manufacturing method, tool, and measuring method
05/19/2010EP2187429A1 Bonding wafer manufacturing method
05/19/2010EP2186134A2 Reconstituted wafer stack packaging with after-applied pad extensions
05/19/2010EP2186131A2 Stack packages using reconstituted wafers
05/19/2010EP2186130A1 Tungsten digitlines and methods of forming and operating the same
05/19/2010EP2186129A2 Method for manufacturing a semiconductor die and a semiconductor device comprising the semiconductor die obtained thereby
05/19/2010EP2186128A1 Nano-interconnects for atomic and molecular scale circuits
05/19/2010EP2186127A2 Process for obtaining a hybrid substrate comprising at least one layer of a nitrided material
05/19/2010EP2186126A1 Semiconductor wafer re-use in an exfoliation process using heat treatment
05/19/2010EP2186125A1 Method of packaging an integrated circuit die
05/19/2010EP2186124A1 Formation of solder bumps
05/19/2010EP2186122A2 Intermetallic conductors
05/19/2010EP2186121A2 Compositions and methods for modifying a surface suited for semiconductor fabrication
05/19/2010EP2186119A1 High-k heterostructure
05/19/2010EP2186118A1 A method of manufacturing an organic electronic or optoelectronic device
05/19/2010EP2186117A1 Vapor based combinatorial processing
05/19/2010EP2186116A1 Multi-region processing system and heads
05/19/2010EP2186115A2 Combinatorial process system
05/19/2010EP2186114A2 Semiconductor component and method of manufacture
05/19/2010EP2185745A2 Thermocouple
05/19/2010EP2185308A1 Method for partitioning and incoherently summing a coherent beam
05/19/2010EP1610387B1 Memory cell, memory using the memory cell, memory cell manufacturing method, and memory recording/reading method
05/19/2010EP1501131B1 Stacked photovoltaic element and production method thereof
05/19/2010EP1497857B1 Method for handling semiconductor layers in such a way as to thin same
05/19/2010EP1407492B1 Single-electron transistors and fabrication methods
05/19/2010EP1364400B1 Method for producing thin layers on a specific support and an application thereof
05/19/2010EP1108267B1 Methods of forming roughened layers of platinum and methods of forming capacitors containing said roughened layers of platinum
05/19/2010EP1013792B1 Power supply unit for sputtering device
05/19/2010EP0982576B1 Sensor and method of producing the same
05/19/2010EP0738424B1 Integrated circuit passivation process
05/19/2010CN201478286U Liner plate used for plasma etching procedure
05/19/2010CN201478285U All-plastic high-speed mechanical hand being applied to semi-conductor etching washing device
05/19/2010CN201478284U Substrate conveying device
05/19/2010CN201478283U Multi-layer constant-temperature cooling conveyer table
05/19/2010CN201478282U Crystal boat
05/19/2010CN201478281U Crystal soldering terminal angle structure improvement
05/19/2010CN201478280U Pin shaping tool for QFP device
05/19/2010CN201478279U Electroplating leading-wire device of circuit packaging baseplate
05/19/2010CN201478278U Liquid supplement system for a polycrystal groove type fine-hair making device
05/19/2010CN201478277U Porous silicon removing system for a polycrystal groove type fine-hair making device
05/19/2010CN201478276U Treatment device, transport device and mobile transverse chamber for substrates
05/19/2010CN201476552U Diffusion furnace with purging treatment device
05/19/2010CN201471296U Polishing pad dresser
05/19/2010CN201471115U Graphite welding plate for lead frame
05/19/2010CN1996605B Complementary metal oxide semiconductor image sensor and method for fabricating the same
05/19/2010CN1996569B Method for manufacturing semiconductor device
05/19/2010CN1992315B Method for manufacturing a CMOS image sensor
05/19/2010CN1992275B High performance circuit with metal and polygate electrodes and method for fabricating the same
05/19/2010CN1992209B Method for manufacturing CMOS image sensor
05/19/2010CN1991873B Wiring substrate plate and manufacturing method of memory card
05/19/2010CN1991872B Manufacturing method for memory card
05/19/2010CN1991592B Object stage device
05/19/2010CN1983555B Method of making semiconductor element
05/19/2010CN1979194B Electrical test apparatus for testing an electrical test piece and corresponding method
05/19/2010CN1975439B Probe card transfer assist apparatus and inspection equipment using same
05/19/2010CN1971970B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/19/2010CN1971903B Semiconductor device having align mark layer and method of fabricating the same
05/19/2010CN1967783B Laser processing apparatus and laser processing method
05/19/2010CN1953149B Semiconductor integrated circuit device and a manufacturing method for the same
05/19/2010CN1932075B Substrate processing device, chemical oxide removing processing module and substrate lifting device
05/19/2010CN1929087B Appearance detection device
05/19/2010CN101711430A assemblage of radiofrequency chips
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