Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2010
05/27/2010WO2010033318A3 Deposition systems, ald systems, cvd systems, deposition methods, als methods and cvd methods
05/27/2010WO2010030484A3 Methods utilizing microwave radiation during formation of semiconductor constructions
05/27/2010WO2010028112A3 Quantum dots, methods of making quantum dots, and methods of using quantum dots
05/27/2010WO2010025231A3 Methods, apparatus and articles of manufacture for testing a plurality of singulated die
05/27/2010WO2010024595A3 Shallow trench isolating structure having an air gap, a cmos image sensor employing the same, and a production method therefor
05/27/2010WO2010008257A3 A spring assembly and a test socket using the same
05/27/2010WO2010008212A3 Magazine for semiconductor package
05/27/2010WO2009154953A3 Sample inspection methods, systems and components
05/27/2010WO2009060766A9 Heating apparatus
05/27/2010US20100131915 Method, device, and program for predicting a manufacturing defect part of a semiconductor device
05/27/2010US20100131892 System and method for controlling semiconductor manufacturing equipment using user interface
05/27/2010US20100131093 Fabrication system and fabrication method
05/27/2010US20100130105 Substrate supporting unit, and apparatus and method for polishing substrate using the same
05/27/2010US20100130103 Polishing apparatus and program thereof
05/27/2010US20100130025 Method for forming a dielectric film and novel precursors for implementing said method
05/27/2010US20100130024 Method of manufacturing semiconductor device and substrate processing apparatus
05/27/2010US20100130023 Method of forming gate insulation film, semiconductor device, and computer recording medium
05/27/2010US20100130022 Nozzle and apparatus and method for processing substrate using the nozzle
05/27/2010US20100130021 Method for processing a silicon-on-insulator structure
05/27/2010US20100130020 Substrate chucking member, substrate processing, apparatus having the member, and method of processing substrate using the member
05/27/2010US20100130019 Manufacturing method of semiconductor device
05/27/2010US20100130018 Synchronous pulse plasma etching equipment and method of fabricating a semiconductor device
05/27/2010US20100130017 Front end of line plasma mediated ashing processes and apparatus
05/27/2010US20100130016 Methods of forming a masking pattern for integrated circuits
05/27/2010US20100130015 Patterning method
05/27/2010US20100130014 Texturing multicrystalline silicon
05/27/2010US20100130013 Slurry composition for gst phase change memory materials polishing
05/27/2010US20100130012 Method For Polishing A Semiconductor Wafer With A Strained-Relaxed Si1-xGex Layer
05/27/2010US20100130011 Semiconductor device fabrication method
05/27/2010US20100130010 Method of fabricating semiconductor device unconstrained by optical limit and apparatus of fabricating the semiconductor device
05/27/2010US20100130009 Substrate processing apparatus and method of manufacturing semiconductor device
05/27/2010US20100130008 Through-via and method of forming
05/27/2010US20100130007 Bottom up plating by organic surface passivation and differential plating retardation
05/27/2010US20100130006 Method and structure of a thick metal layer using multiple deposition chambers
05/27/2010US20100130005 filling carbon nanotubes in a recess; forming carbon nanotubes without using a metal catalyst; MEMS (Micro ElectroMechanical Systems)
05/27/2010US20100130004 Semiconductor device and method for manufacturing the same
05/27/2010US20100130003 Method of Forming Through-Silicon Vias
05/27/2010US20100130002 Multilayered through via
05/27/2010US20100130001 Semiconductor device and manufacturing method thereof
05/27/2010US20100130000 Method of manufacturing semiconductor device
05/27/2010US20100129999 Structures and methods for an application of a flexible bridge
05/27/2010US20100129998 Nonvolatile semiconductor storage device and manufacturing method thereof
05/27/2010US20100129997 Organic light emitting diode (oled) display panel and method of forming polysilicon channel layer thereof
05/27/2010US20100129996 Silicon material surface etching for large grain polysilicon thin film deposition and structure
05/27/2010US20100129994 Method for forming a film on a substrate
05/27/2010US20100129993 Method for manufacturing soi wafer
05/27/2010US20100129992 Method for manufacturing a semiconductor device
05/27/2010US20100129991 Nitride semiconductor device having a silicon-containing layer and manufacturing method thereof
05/27/2010US20100129990 Susceptor and method for manufacturing silicon epitaxial wafer
05/27/2010US20100129989 Dicing die-bonding film and process for producing semiconductor device
05/27/2010US20100129988 Dicing die-bonding film and process for producing semiconductor device
05/27/2010US20100129987 Dicing die-bonding film and process for producing semiconductor device
05/27/2010US20100129986 Dicing die-bonding film and process for producing semiconductor device
05/27/2010US20100129985 Dicing die-bonding film and process for producing semiconductor device
05/27/2010US20100129984 Wafer singulation in high volume manufacturing
05/27/2010US20100129983 Method of Fabricating Semiconductor Device
05/27/2010US20100129982 Integration sequences with top surface profile modification
05/27/2010US20100129981 Through-via and method of forming
05/27/2010US20100129980 Methods Of Forming Diodes
05/27/2010US20100129979 Semiconductor device having increased active region width and method for manufacturing the same
05/27/2010US20100129978 Method of fabricating semiconductor device having MIM capacitor
05/27/2010US20100129977 Integrated circuit with capacitor and method for the production thereof
05/27/2010US20100129976 Methods of Fabricating Electromechanical Non-Volatile Memory Devices
05/27/2010US20100129975 Base for a npn bipolar transistor
05/27/2010US20100129974 Method for manufacturing a semiconductor integrated circuit device circuit device
05/27/2010US20100129973 Method of manufacturing flash memory device
05/27/2010US20100129972 Bit line structure and method for the production thereof
05/27/2010US20100129971 Semiconductor device and production method thereof
05/27/2010US20100129970 Method of fabricating polycrystalline silicon thin film for improving crystallization characteristics and method of fabricating liquid crystal display device using the same
05/27/2010US20100129969 Semiconductor device and method for manufacturing the same
05/27/2010US20100129968 Semiconductor Devices and Methods of Manufacture Thereof
05/27/2010US20100129967 Method for fabricating thin film transistors and array substrate including the same
05/27/2010US20100129966 Fabrication methods for electronic devices with via through holes and thin film transistor devices
05/27/2010US20100129965 Metal substrate having electronic devices formed thereon
05/27/2010US20100129964 Method of manufacturing a semiconductor package with a bump using a carrier
05/27/2010US20100129963 Integrated circuit package and fabricating method thereof
05/27/2010US20100129962 Electronic package structure and method
05/27/2010US20100129961 Multi chip stacking with reliable joining
05/27/2010US20100129960 Method for bonding semiconductor wafers and method for manufacturing semiconductor device
05/27/2010US20100129959 Semiconductor Chip Package Fixture
05/27/2010US20100129958 Method and apparatus for trench and via profile modification
05/27/2010US20100129956 Method for forming a GexSi1-x buffer layer of solar-energy battery on a silicon wafer
05/27/2010US20100129954 Photographic modules and methods of forming the same
05/27/2010US20100129951 Method and Structure for Fabricating Multiple Tiled Regions Onto a Plate Using a Controlled Cleaving Process
05/27/2010US20100129950 Method and Structure for Fabricating Multiple Tiled Regions Onto a Plate Using a Controlled Cleaving Process
05/27/2010US20100129948 Method for manufacturing semiconductor substrate and method for manufacturing semiconductor device
05/27/2010US20100129947 Resistance-variable memory device, method for fabricating the same and memory system including the same
05/27/2010US20100129945 Metal substrate having electronic devices formed thereon
05/27/2010US20100129943 Thin film light emitting diode
05/27/2010US20100129942 Nondestructive testing method for oxide semiconductor layer and method for making oxide semiconductor layer
05/27/2010US20100129941 Processing method for uniformizing film thickness distribution of layer having predetermined film thickness formed on surface of silicon wafer and processing method for uniformizing thickness distribution of silicon wafer
05/27/2010US20100129940 Vibration monitoring of electronic substrate handling systems
05/27/2010US20100129939 Using optical metrology for within wafer feed forward process control
05/27/2010US20100129938 Semiconductor device and method of manufacturing the same
05/27/2010US20100129925 Semiconductor nanowires charge sensor
05/27/2010US20100129761 Wafer support jig, vertical heat treatment boat including wafer support jig, and method for manufacturing wafer support jig
05/27/2010US20100129738 Positive resist composition and pattering process
05/27/2010US20100129737 Development method, method of manufacturing photomask, method of manufacturing semiconductor device and development device
05/27/2010US20100129182 Substrate processing system
05/27/2010US20100129025 Mems device fabricated on a pre-patterned substrate
1 ... 1796 1797 1798 1799 1800 1801 1802 1803 1804 1805 1806 1807 1808 1809 1810 1811 1812 1813 1814 1815 1816 ... 6590