Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2010
06/03/2010US20100135080 Fabrication method and structure of semiconductor non-volatile memory device
06/03/2010US20100135060 Memory device and storage apparatus
06/03/2010US20100135058 Magnetic memory, driving method thereof, and manufacturing method thereof
06/03/2010US20100134772 Exposure apparatus, method for cleaning member thereof, maintenance method for exposure apparatus, maintenance device, and method for producing device
06/03/2010US20100134744 Liquid crystal display device and manufacturing method thereof
06/03/2010US20100134735 Photosensor and display device
06/03/2010US20100134734 Substrate for a display apparatus
06/03/2010US20100134727 Distortion tolerant pixel design
06/03/2010US20100134568 MEMS Device with Uniform Membrane
06/03/2010US20100134182 Apparatus and Method for Improving Drive-Strength and Leakage of Deep Submicron MOS Transistors
06/03/2010US20100134126 Probe and method for manufacturing the same
06/03/2010US20100133991 Organic Light Emitting Diode Display and Manufacturing Method Thereof
06/03/2010US20100133990 Organic light emitting device and manufacturing method thereof
06/03/2010US20100133952 Complex Microdevices and Apparatus and Methods for Fabricating Such Devices
06/03/2010US20100133722 Semiconductor device manufacturing method
06/03/2010US20100133705 Apparatus and method for reducing pitch in an integrated circuit
06/03/2010US20100133704 Semiconductor Device and Method of Forming an Interposer Package with Through Silicon Vias
06/03/2010US20100133702 Method for eliminating loading effect using a via plug
06/03/2010US20100133701 Semiconductor device and method for manufacturing semiconductor device
06/03/2010US20100133700 Performance enhancement in metallization systems of microstructure devices by incorporating grain size increasing metal features
06/03/2010US20100133699 Microstructure device including a metallization structure with air gaps formed commonly with vias
06/03/2010US20100133698 Semiconductor device and method of manufacturing semiconductor device
06/03/2010US20100133697 Low resistance through-wafer via
06/03/2010US20100133693 Semiconductor Package Leads Having Grooved Contact Areas
06/03/2010US20100133692 Process for producing silicic coating, silicic coating and semiconductor device
06/03/2010US20100133689 Copper (i) compounds useful as deposition precursors of copper thin films
06/03/2010US20100133686 Chip package structure
06/03/2010US20100133684 Power semiconductor module and manufacturing method thereof
06/03/2010US20100133683 System and apparatus for venting electronic packages and method of making same
06/03/2010US20100133682 Semiconductor device
06/03/2010US20100133680 Wafer level package and method of manufacturing the same and method of reusing chip
06/03/2010US20100133678 Semiconductor device and method for manufacturing semiconductor device
06/03/2010US20100133677 Semiconductor chip stacked body and method of manufacturing the same
06/03/2010US20100133676 A power semiconductor arrangement and a semiconductor valve provided therewith
06/03/2010US20100133675 Package-on-package device, semiconductor package and method for manufacturing the same
06/03/2010US20100133674 Compact Semiconductor Package with Integrated Bypass Capacitor and Method
06/03/2010US20100133672 Dual-sided substate integrated circuit package including a leadframe having leads with increased thickness
06/03/2010US20100133671 Flip-chip package structure and the die attach method thereof
06/03/2010US20100133670 Top-side Cooled Semiconductor Package with Stacked Interconnection Plates and Method
06/03/2010US20100133669 Crack stopping structure and method for fabricating the same
06/03/2010US20100133668 Semiconductor device and manufacturing method thereof
06/03/2010US20100133666 Device including a semiconductor chip and metal foils
06/03/2010US20100133665 Integrated circuit packaging system with lead frame and method of manufacture thereof
06/03/2010US20100133663 Technique for the growth of planar semi-polar gallium nitride
06/03/2010US20100133661 Methods for forming conductive vias in semiconductor device components
06/03/2010US20100133660 Method for producing interconnect structures for integrated circuits
06/03/2010US20100133659 Semiconductor device and method of manufacturing semiconductor integrated circuit chip
06/03/2010US20100133658 Nitride semiconductor component layer structure on a group iv substrate surface
06/03/2010US20100133657 Group iii nitride semiconductor substrate production method, and group iii nitride semiconductor substrate
06/03/2010US20100133656 Method Using Multiple Layer Annealing Cap for Fabricating Group III-Nitride Semiconductor Device Structures and Devices Formed Thereby
06/03/2010US20100133654 Method for manufacturing capacitor of semiconductor
06/03/2010US20100133653 Integrated circuit devices including passive device shielding structures and methods of forming the same
06/03/2010US20100133652 Semiconductor device and method of manufacturing the same
06/03/2010US20100133651 Semiconductor structure processing using multiple laterally spaced laser beam spots with joint velocity profiling
06/03/2010US20100133649 Contact efuse structure, method of making a contact efuse device containing the same, and method of making a read only memory containing the same
06/03/2010US20100133648 Microstructure device including a metallization structure with self-aligned air gaps between closely spaced metal lines
06/03/2010US20100133647 Semiconductor devices and semiconductor device manufacturing methods
06/03/2010US20100133646 Self-aligned si rich nitride charge trap layer isolation for charge trap flash memory
06/03/2010US20100133645 Method for stacking and interconnecting integrated circuits
06/03/2010US20100133644 Bottom anode Schottky diode structure and method
06/03/2010US20100133643 Image sensor pixel and method thereof
06/03/2010US20100133642 System and method for forming metal interconnection in image sensor
06/03/2010US20100133640 Packaging method and packaging structure
06/03/2010US20100133638 Image sensors and methods of manufacturing the same
06/03/2010US20100133630 Method for producing a micromechanical component having a trench structure for backside contact
06/03/2010US20100133629 Integrated sensor including sensing and processing die mounted on opposite sides of package substrate
06/03/2010US20100133628 High-k gate electrode structure formed after transistor fabrication by using a spacer
06/03/2010US20100133626 Semiconductor device and method of fabricating the same
06/03/2010US20100133623 Semiconductor device and method for manufacturing same
06/03/2010US20100133622 Semiconductor device including MOSFET with controlled threshold voltage, and manufacturing method of the same
06/03/2010US20100133621 Restricted stress regions formed in the contact level of a semiconductor device
06/03/2010US20100133620 Reduced topography-related irregularities during the patterning of two different stress-inducing layers in the contact level of a semiconductor device
06/03/2010US20100133618 Electrostatic discharge protection device and method for manufacturing the same
06/03/2010US20100133615 Multiple gate transistor having fins with a length defined by the gate electrode
06/03/2010US20100133614 Multiple gate transistor having homogenously silicided fin end portions
06/03/2010US20100133613 Semiconductor memory device and manufacturing method thereof
06/03/2010US20100133612 Electronic device with asymmetric gate strain
06/03/2010US20100133610 Method of forming an integrated power device and structure
06/03/2010US20100133609 Methods of providing electrical isolation and semiconductor structures including same
06/03/2010US20100133602 Non-volatile memory cell with buried select gate, and method of making same
06/03/2010US20100133600 Semiconductor devices having increased sensing margin
06/03/2010US20100133597 Semiconductor memory device and manufacturing method thereof
06/03/2010US20100133595 Field effect transistor structure with abrupt source/drain junctions
06/03/2010US20100133594 Semiconductor structure and method of fabricating the same
06/03/2010US20100133593 Junction Field Effect Transistor Having a Double Gate Structure and Method of Making Same
06/03/2010US20100133591 Method for passivating a field-effect transistor
06/03/2010US20100133587 Three-dimensional architecture for integration of cmos circuits and nano-material in hybrid digital circuits
06/03/2010US20100133586 Heterojunction bipolar transistor and method of forming the same
06/03/2010US20100133578 Solid state lighting device with improved heatsink
06/03/2010US20100133577 Method for producing electronic component and electronic component
06/03/2010US20100133575 Low optical loss electrode structures for leds
06/03/2010US20100133572 Display device and method for manufacturing the same
06/03/2010US20100133570 Semiconductor light emitting device and method of manufacturing the same
06/03/2010US20100133568 Light emitting device and method for manufacturing same
06/03/2010US20100133567 Semiconductor light emitting device and method of manufacturing the same
06/03/2010US20100133564 Method for Producing Semiconductor Components and Thin-Film Semiconductor Component
06/03/2010US20100133562 High Brightness LED Utilizing a Roughened Active Layer and Conformal Cladding
06/03/2010US20100133557 Metal-based photonic device package module and manufacturing method thereof
06/03/2010US20100133554 Solid state lighting device
06/03/2010US20100133553 Thermally conductive structure of led and manufacturing method thereof
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