Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2010
06/08/2010US7732330 Semiconductor device and manufacturing method using an ink-jet method of the same
06/08/2010US7732329 Method and apparatus for workpiece surface modification for selective material deposition
06/08/2010US7732328 Method of fabricating semiconductor package structure
06/08/2010US7732327 depositing tungsten silicide layer on substrate within chamber during vapor deposition process, exposing to continuous flow of silicon precursor gas, and exposing to intermittent pulses of tungsten precursor gas, depositing tungsten nitride layer and nucleation layer
06/08/2010US7732326 Semiconductor device having a second level of metallization formed over a first level with minimal damage to the first level and method
06/08/2010US7732325 Plasma-enhanced cyclic layer deposition process for barrier layers
06/08/2010US7732324 Semiconductor device having improved adhesion and reduced blistering between etch stop layer and dielectric layer
06/08/2010US7732323 Methods of manufacturing semiconductor devices having contact plugs in insulation layers
06/08/2010US7732322 Dielectric material with reduced dielectric constant and methods of manufacturing the same
06/08/2010US7732321 Method for shielding integrated circuits
06/08/2010US7732320 Apparatus and method for semiconductor wafer bumping via injection molded solder
06/08/2010US7732319 Interconnection structure of integrated circuit chip
06/08/2010US7732318 Fabricating method for flat display device
06/08/2010US7732317 Methods of forming contact structures for memory cells using both anisotropic and isotropic etching
06/08/2010US7732316 Method for manufacturing a semiconductor device
06/08/2010US7732315 Methods of fabricating semiconductor devices and structures thereof
06/08/2010US7732314 Method for depositing a diffusion barrier for copper interconnect applications
06/08/2010US7732313 FUSI integration method using SOG as a sacrificial planarization layer
06/08/2010US7732312 FUSI integration method using SOG as a sacrificial planarization layer
06/08/2010US7732311 Methods of manufacturing semiconductor devices
06/08/2010US7732310 Sidewall memory with self-aligned asymmetrical source and drain configuration
06/08/2010US7732309 Plasma immersed ion implantation process
06/08/2010US7732308 Process for depositing layers containing silicon and germanium
06/08/2010US7732307 Method of forming amorphous TiN by thermal chemical vapor deposition (CVD)
06/08/2010US7732306 Methods for producing improved epitaxial materials
06/08/2010US7732305 Use of Cl2 and/or HCl during silicon epitaxial film formation
06/08/2010US7732304 Method of manufacturing semiconductor device
06/08/2010US7732303 Method for recycling of ion implantation monitor wafers
06/08/2010US7732302 Integrated sensor and circuitry and process therefor
06/08/2010US7732301 Bonded intermediate substrate and method of making same
06/08/2010US7732300 Method of bonding aluminum electrodes of two semiconductor substrates
06/08/2010US7732299 Process for wafer bonding
06/08/2010US7732298 Metal salicide formation having nitride liner to reduce silicide stringer and encroachment
06/08/2010US7732297 Method of manufacturing an insulating layer and method of manufacturing a semiconductor device using the insulating layer
06/08/2010US7732296 Method of fabricating metal-insulator-metal capacitor and metal-insulator-metal capacitor manufactured by the method
06/08/2010US7732295 Post last wiring level inductor using patterned plate process
06/08/2010US7732294 Post last wiring level inductor using patterned plate process
06/08/2010US7732293 Tunable semiconductor diodes
06/08/2010US7732292 Bipolar transistor with self-aligned retrograde extrinsic base implant profile and self-aligned silicide
06/08/2010US7732291 Semiconductor device having stressed etch stop layers of different intrinsic stress in combination with PN junctions of different design in different device regions
06/08/2010US7732290 Carbon nanotube transistor process with transferred carbon nanotubes
06/08/2010US7732289 Method of forming a MOS device with an additional layer
06/08/2010US7732287 Method of forming a body-tie
06/08/2010US7732286 Buried biasing wells in FETs (Field Effect Transistors)
06/08/2010US7732285 Semiconductor device having self-aligned epitaxial source and drain extensions
06/08/2010US7732284 Post high-k dielectric/metal gate clean
06/08/2010US7732283 Fabricating method of semiconductor device
06/08/2010US7732282 Transistor of the I-MOS type comprising two independent gates and method of using such a transistor
06/08/2010US7732281 Methods for fabricating dual bit flash memory devices
06/08/2010US7732280 Semiconductor device having offset spacer and method of forming the same
06/08/2010US7732279 Semiconductor device with improved overlay margin and method of manufacturing the same
06/08/2010US7732278 Split gate memory cell and method therefor
06/08/2010US7732277 Semiconductor device and method of fabricating the same
06/08/2010US7732276 Self-aligned patterning method by using non-conformal film and etch back for flash memory and other semiconductor applications
06/08/2010US7732275 Methods of forming NAND flash memory with fixed charge
06/08/2010US7732274 High voltage deep trench capacitor
06/08/2010US7732273 Semiconductor device manufacturing method and semiconductor device
06/08/2010US7732272 Method of manufacturing semiconductor element
06/08/2010US7732271 Method for manufacturing NAND-type semiconductor storage device
06/08/2010US7732270 Device having enhanced stress state and related methods
06/08/2010US7732269 Method of ultra-shallow junction formation using Si film alloyed with carbon
06/08/2010US7732268 Manufacturing method of display device
06/08/2010US7732267 Flat panel display device and fabricating method thereof
06/08/2010US7732266 Thin film array panel and manufacturing method thereof
06/08/2010US7732265 Thin film transistor, method for manufacturing the same and film formation apparatus
06/08/2010US7732264 Fabrication methods of thin film transistor substrates
06/08/2010US7732263 Semiconductor device
06/08/2010US7732262 Semiconductor device and method of manufacturing the same
06/08/2010US7732261 Semiconductor device and a method of manufacturing the same
06/08/2010US7732260 Semiconductor device power interconnect striping
06/08/2010US7732259 Non-leaded semiconductor package and a method to assemble the same
06/08/2010US7732258 Lead frame and method for fabricating semiconductor package employing the same
06/08/2010US7732257 Semiconductor device and method of fabricating the same
06/08/2010US7732256 Fabrication method of non-volatile memory
06/08/2010US7732255 Flip chip mounting method by no-flow underfill
06/08/2010US7732254 Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages
06/08/2010US7732253 Flip-chip assembly with improved interconnect
06/08/2010US7732252 Multi-chip package system incorporating an internal stacking module with support protrusions
06/08/2010US7732251 Method of making a semiconductor device having a multicomponent oxide
06/08/2010US7732250 Methods of forming phase changeable layers including protruding portions in electrodes thereof
06/08/2010US7732247 Isolation techniques for reducing dark current in CMOS image sensors
06/08/2010US7732246 Method for fabricating vertical CMOS image sensor
06/08/2010US7732245 Photodiode of CMOS image sensor and method for manufacturing the same
06/08/2010US7732244 Method for forming light-transmitting regions
06/08/2010US7732243 Substrate structures for integrated series connected photovoltaic arrays and process of manufacture of such arrays
06/08/2010US7732242 Composite board with semiconductor chips and plastic housing composition and method
06/08/2010US7732241 Microstructure and manufacturing method thereof and microelectromechanical system
06/08/2010US7732240 Formation of through-wafer electrical interconnections and other structures using a thin dielectric membrane
06/08/2010US7732239 Method for manufacturing solid-state image sensor
06/08/2010US7732238 Method of manufacturing an image sensing apparatus in which two members are bonded together
06/08/2010US7732237 Quantum dot based optoelectronic device and method of making same
06/08/2010US7732236 III nitride semiconductor crystal and manufacturing method thereof, III nitride semiconductor device manufacturing method thereof, and light emitting device
06/08/2010US7732235 Method for fabricating high density pillar structures by double patterning using positive photoresist
06/08/2010US7732234 Fabrication process for package with light emitting device on a sub-mount
06/08/2010US7732233 Method for making light emitting diode chip package
06/08/2010US7732232 Series interconnected optoelectronic device module assembly
06/08/2010US7732231 Method of forming a dielectric layer on a semiconductor light emitting device
06/08/2010US7732230 Backlight including dot light emitting devices having at least two different brightness ranks and method for manufacturing same
06/08/2010US7732229 Formation of solar cells with conductive barrier layers and foil substrates
06/08/2010US7732228 Method for manufacturing printing head
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