| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/05/2011 | CN101939833A Apparatus and methods for predicting a semiconductor parameter across an area of a wafer |
| 01/05/2011 | CN101939832A Thermal mechanical flip chip die bonding |
| 01/05/2011 | CN101939831A Apparatus and method for mounting electronic component |
| 01/05/2011 | CN101939830A Finfet with separate gates and method for fabricating a FinFET with separate gates |
| 01/05/2011 | CN101939829A Method of producing thin film transistor and thin film transistor |
| 01/05/2011 | CN101939828A Semiconductor device |
| 01/05/2011 | CN101939827A Liquid material carburetor, and filming device using the carburetor |
| 01/05/2011 | CN101939826A Method for cleaning semiconductor wafer and device for cleaning semiconductor wafer |
| 01/05/2011 | CN101939825A Film for semiconductor, method for manufacturing semiconductor device and semiconductor device |
| 01/05/2011 | CN101939824A EEPROM cell with charge loss |
| 01/05/2011 | CN101939823A Ethane implantation with a dilution gas |
| 01/05/2011 | CN101939822A Techniques for cold implantation of carbon-containing species |
| 01/05/2011 | CN101939821A Plasma immersion ion implantation method using a pure or nearly pure silicon seasoning layer on the chamber interior surfaces |
| 01/05/2011 | CN101939820A Substrate for epitaxial growth, process for producing gan-base semiconductor film, gan-base semiconductor film, process for producing gan-base semiconductor luminescent element, and gan-base semiconductor luminescent element |
| 01/05/2011 | CN101939819A Semiconductor component comprising a polycrystalline semiconductor layer |
| 01/05/2011 | CN101939818A Elimination of photoresist material collapse and poisoning in 45-nm feature size using dry or immersion lithography |
| 01/05/2011 | CN101939817A System and methods for conservation of exhaust heat energy |
| 01/05/2011 | CN101939816A Chip supply pallet and chip supply apparatus |
| 01/05/2011 | CN101939465A Material for chemical vapor deposition, silicon-containing insulating film and process for production thereof |
| 01/05/2011 | CN101939396A Adhesive composition for electronic components and adhesive sheet for electronic components using the same |
| 01/05/2011 | CN101939390A Process for polishing a silicon surface by means of a cerium oxide-containing dispersion |
| 01/05/2011 | CN101939379A Flux activator, adhesive resin composition, adhesive paste, adhesive film, semiconductor device fabrication method, and semiconductor device |
| 01/05/2011 | CN101939262A Process and apparatus for producing ultrapure water, and method and apparatus for cleaning electronic component members |
| 01/05/2011 | CN101939136A Work duplex-head grinding apparatus, and work duplex-head grinding method |
| 01/05/2011 | CN101937950A Fabrication method of flip chip type gallium nitride light emitting diode |
| 01/05/2011 | CN101937932A Thin film transistor and method for manufacturing the same |
| 01/05/2011 | CN101937931A High performance field effect transistor and manufacturing method thereof |
| 01/05/2011 | CN101937930A High-performance field effect transistor and formation method thereof |
| 01/05/2011 | CN101937929A Deep groove super PN junction structure and formation method thereof |
| 01/05/2011 | CN101937928A Silicon controlled rectifier structure capable of eliminating hazards of punching through lithography pinholes and production method thereof |
| 01/05/2011 | CN101937927A Deep groove super PN junction structure and manufacturing method thereof |
| 01/05/2011 | CN101937922A Method of manufacturing photoelectric conversion device |
| 01/05/2011 | CN101937921A Image sensor device and fabrication method thereof |
| 01/05/2011 | CN101937920A Miniature-sized storage device |
| 01/05/2011 | CN101937919A Three-dimensional nonvolatile memory device and method for fabricating the same |
| 01/05/2011 | CN101937918A Semiconductor structure and manufacture method thereof |
| 01/05/2011 | CN101937915A Semiconductor device and method of manufacturing the semiconductor device |
| 01/05/2011 | CN101937914A Electronic device including an integrated circuit with transistors coupled to each other |
| 01/05/2011 | CN101937913A Electronic device including a well region |
| 01/05/2011 | CN101937910A LED light source, its manufacturing method, and LED-based photolithography apparatus and method |
| 01/05/2011 | CN101937909A An electrical module |
| 01/05/2011 | CN101937907A Chip stacking package structure and manufacture method thereof |
| 01/05/2011 | CN101937905A Semiconductor encapsulating part and manufacture method thereof |
| 01/05/2011 | CN101937904A Semiconductor device and method of manufacturing the same |
| 01/05/2011 | CN101937903A Semiconductor device and method of manufacturing the same |
| 01/05/2011 | CN101937902A Semiconductor device and method for manufacturing same |
| 01/05/2011 | CN101937901A Wire substrate as well as manufacturing method and packaging structure thereof |
| 01/05/2011 | CN101937899A Semiconductor packaging structure and packaging technology thereof |
| 01/05/2011 | CN101937897A Triode lead frame and manufacturing method thereof |
| 01/05/2011 | CN101937894A Semiconductor device including through-electrode and method of manufacturing the same |
| 01/05/2011 | CN101937892A Semiconductor chip, method of fabricating the same, and stack module and memory card |
| 01/05/2011 | CN101937889A Semiconductor element packaging structure and packaging method thereof |
| 01/05/2011 | CN101937887A Wafer structure and water processing method |
| 01/05/2011 | CN101937886A Thin chip package structure and method |
| 01/05/2011 | CN101937885A Semiconductor packaging piece and manufacture method thereof |
| 01/05/2011 | CN101937883A Semiconductor device and method for manufacturing the same |
| 01/05/2011 | CN101937881A Semiconductor packaging structure and packaging method thereof |
| 01/05/2011 | CN101937880A Thin wafer handling structure, and thin wafer bounding and releasing method |
| 01/05/2011 | CN101937879A Preparation technique of SiGe Bi-CMOS appliance |
| 01/05/2011 | CN101937878A Memory and method for manufacturing same |
| 01/05/2011 | CN101937877A Interconnection wiring structure of a semiconductor device and method for manufacturing same |
| 01/05/2011 | CN101937876A Manufacturing method of memory with double-layer stacking self-alignment grid structure |
| 01/05/2011 | CN101937875A Complementary metal-oxide-semiconductor (CMOS) transistor and manufacturing method thereof |
| 01/05/2011 | CN101937874A Method of creating asymmetric field-effect-transistors |
| 01/05/2011 | CN101937873A Method for making monolithic integrated device of bipolar transistor and semiconductor laser |
| 01/05/2011 | CN101937872A Semiconductor device and manufacturing method of semiconductor device, and display device |
| 01/05/2011 | CN101937871A Method for constructing surface morphology of low-dielectric-constant dielectric material |
| 01/05/2011 | CN101937870A Single Damascus process integration method |
| 01/05/2011 | CN101937869A Damascus process integration method without dielectric film palisade residual risks |
| 01/05/2011 | CN101937868A Method for making through hole in integrated circuit |
| 01/05/2011 | CN101937867A Method for improving membrane thickness homogeneity of dielectric layer in manufacturing process of semiconductor metal line |
| 01/05/2011 | CN101937866A Metal wiring method |
| 01/05/2011 | CN101937865A Method for forming groove |
| 01/05/2011 | CN101937864A Filling method of contact hole |
| 01/05/2011 | CN101937863A Method for making metal wiring |
| 01/05/2011 | CN101937862A Method for forming shallow trench isolation structure |
| 01/05/2011 | CN101937861A Method for manufacturing semiconductor substrate, and method for manufacturing semiconductor device |
| 01/05/2011 | CN101937860A Electrostatic chuck |
| 01/05/2011 | CN101937859A Method for detecting Cu content in oxide-nitride-oxide (ONO) manufacturing process |
| 01/05/2011 | CN101937858A Wafer level making method with flip-chip bump structure |
| 01/05/2011 | CN101937857A Manufacturing method of semiconductor device |
| 01/05/2011 | CN101937856A Semiconductor device and method of manufacturing the same |
| 01/05/2011 | CN101937855A Manufacture method for buried capsulation structure of component and capsulation structure thereof |
| 01/05/2011 | CN101937854A Substrate holder module and a substrate assembling device containing the same |
| 01/05/2011 | CN101937853A Method for forming integrated circuit structure |
| 01/05/2011 | CN101937852A Circuit substrate process |
| 01/05/2011 | CN101937851A Anisotropic conductive film and method for manufacturing conductive particle thereof |
| 01/05/2011 | CN101937850A 封装制造方法和半导体装置 The semiconductor package manufacturing method and apparatus |
| 01/05/2011 | CN101937849A Parasitic tube effect reduction method of self-aligned LDMOS |
| 01/05/2011 | CN101937848A MOS (Metal-oxide Semiconductor) transistor and making method thereof |
| 01/05/2011 | CN101937847A Manufacturing method of semiconductor device |
| 01/05/2011 | CN101937846A SiGe HBT (Heterostructure Bipolar Transistor) and manufacture method thereof |
| 01/05/2011 | CN101937845A Mesa treatment process of diode |
| 01/05/2011 | CN101937844A Insulating film forming method |
| 01/05/2011 | CN101937843A Pattern definition method of wet-method etching |
| 01/05/2011 | CN101937842A Method for processing a substrate and apparatus for performing the same |
| 01/05/2011 | CN101937841A Method and structure for reducing grid resistance of power MOSFET (metal oxide semiconductor field-effect transistor) |
| 01/05/2011 | CN101937840A Method for forming grid oxide layer |
| 01/05/2011 | CN101937839A System for manufacturing a flat panel type display |
| 01/05/2011 | CN101937838A Methods of forming electronic devices |