Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2011
01/27/2011US20110018187 Apparatus for manufacture of pv solar cells or thin film solar modules
01/27/2011US20110018146 Spacer double patterning for lithography operations
01/27/2011US20110018143 Wafer level packaging
01/27/2011US20110018140 Electric via comprising lateral outgrowths
01/27/2011US20110018139 Scalloped tubular electric via
01/27/2011US20110018138 Nano-interconnects for atomic and molecular scale circuits
01/27/2011US20110018137 Method of manufacturing semiconductor device, semiconductor device thus manufactured, and semiconductor manufacturing apparatus
01/27/2011US20110018134 Increasing reliability of copper-based metallization structures in a microstructure device by using aluminum nitride
01/27/2011US20110018133 Electric via with a rough lateral surface
01/27/2011US20110018132 Object including a graphic element transferred on a support and method for making such an object
01/27/2011US20110018128 Package structure and method for reducing dielectric layer delamination
01/27/2011US20110018127 Multilayer UV-Curable Adhesive Film
01/27/2011US20110018126 Low noise high thermal conductivity mixed signal package
01/27/2011US20110018124 Semiconductor Device Packages, Redistribution Structures, and Manufacturing Methods Thereof
01/27/2011US20110018123 Semiconductor package and method of manufacturing the same
01/27/2011US20110018122 Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device
01/27/2011US20110018118 Semiconductor Device Packages, Redistribution Structures, and Manufacturing Methods Thereof
01/27/2011US20110018117 Sealed joint structure of device and process using the same
01/27/2011US20110018116 Chip scale surface mounted semiconductor device package and process of manufacture
01/27/2011US20110018115 Pop precursor with interposer for top package bond pad pitch compensation
01/27/2011US20110018114 Semiconductor Device and Method of Embedding Thermally Conductive Layer in Interconnect Structure for Heat Dissipation
01/27/2011US20110018113 Method for packaging micromachined devices
01/27/2011US20110018112 Semiconductor package and method for manufacturing the same
01/27/2011US20110018111 Leadframe feature to minimize flip-chip semiconductor die collapse during flip-chip reflow
01/27/2011US20110018109 Deep silicon via for grounding of circuits and devices, emitter ballasting and isolation
01/27/2011US20110018105 Nitride-based compound semiconductor device, compound semiconductor device, and method of producing the devices
01/27/2011US20110018104 METHOD FOR PRODUCING A LAMINATED BODY HAVING Al-BASED GROUP-III NITRIDE SINGLE CRYSTAL LAYER, LAMINATED BODY PRODUCED BY THE METHOD, METHOD FOR PRODUCING Al-BASED GROUP-III NITRIDE SINGLE CRYSTAL SUBSTRATE EMPLOYING THE LAMINATED BODY, AND ALUMINUM NITRIDE SINGLE CRYSTAL SUBSTRATE
01/27/2011US20110018103 System and method for transferring substrates in large scale processing of cigs and/or cis devices
01/27/2011US20110018100 Capacitor, semiconductor device comprising the same, method for manufacturing the capacitor, and method for manufacturing the semiconductor device
01/27/2011US20110018097 Integrated circuit and manufacturing method therefor
01/27/2011US20110018095 Three dimensional integrated deep trench decoupling capacitors
01/27/2011US20110018094 Bias-controlled deep trench substrate noise isolation integrated circuit device structures
01/27/2011US20110018093 Programmable anti-fuse structure with dlc dielectric layer
01/27/2011US20110018091 Fuse link structures using film stress for programming and methods of manufacture
01/27/2011US20110018084 Encapsulant cavity integrated circuit package system and method of fabrication thereof
01/27/2011US20110018078 Manufacturing method for a micromechanical component having a thin-layer capping
01/27/2011US20110018077 Semiconductor pressure sensor and its manufacturing method
01/27/2011US20110018076 MEMS Component, Method for Producing a MEMS Component, and Method for Handling a MEMS Component
01/27/2011US20110018074 Semiconductor device, an electronic device and an electronic apparatus
01/27/2011US20110018073 Substrate device having a tuned work function and methods of forming thereof
01/27/2011US20110018068 Integrated device incorporating low-voltage components and power components, and process for manufacturing such device
01/27/2011US20110018067 Semiconductor device and method of manufacturing the same
01/27/2011US20110018065 Method for manufacturing semiconductor device and semiconductor device
01/27/2011US20110018064 Sram cell comprising finfets
01/27/2011US20110018062 Fabrication of single or multiple gate field plates
01/27/2011US20110018060 Method and structures for improving substrate loss and linearity in soi substrates
01/27/2011US20110018059 Shield Contacts in a Shielded Gate MOSFET
01/27/2011US20110018058 High-voltage vertical transistor with edge termination structure
01/27/2011US20110018057 Semiconductor memory device and method for fabricating the same
01/27/2011US20110018056 Semiconductor device and method for manufacturing the same
01/27/2011US20110018055 Power semiconductor device and method for manufacturing same
01/27/2011US20110018054 Method for Preventing Gate Oxide Damage of a Trench MOSFET during Wafer Processing while Adding an ESD Protection Module Atop
01/27/2011US20110018053 Memory cell and methods of manufacturing thereof
01/27/2011US20110018052 Nonvolatile semiconductor memory device and method for manufacturing same
01/27/2011US20110018050 Nonvolatile semiconductor memory device and method for manufacturing same
01/27/2011US20110018049 Charge trapping device and method for manufacturing the same
01/27/2011US20110018047 Nonvolatile semiconductor memory device and method of manufacturing the same
01/27/2011US20110018044 Etch stop layers and methods of forming the same
01/27/2011US20110018041 Semiconductor Device and Method of Driving the Same
01/27/2011US20110018040 Methods of fabricating transistors including self-aligned gate electrodes and source/drain regions
01/27/2011US20110018039 Lithography for printing constant line width features
01/27/2011US20110018038 Ion sensitive field effect transistor and production method thereof
01/27/2011US20110018035 Offset Geometries for Area Reduction in Memory Arrays
01/27/2011US20110018034 Heterogeneous integration of low noise amplifiers with power amplifiers or switches
01/27/2011US20110018033 Semiconductor wafer, semiconductor device, and method of manufacturing a semiconductor device
01/27/2011US20110018031 Transistor gate electrode having conductor material layer
01/27/2011US20110018030 Semiconductor wafer, semiconductor wafer manufacturing method, and electronic device
01/27/2011US20110018019 Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making the same
01/27/2011US20110018018 Semiconductor chip package structure for achieving electrical connection without using wire-bonding process and method for making the same
01/27/2011US20110018017 Led with molded reflective sidewall coating
01/27/2011US20110018016 Reduced color over angle variation leds
01/27/2011US20110018015 Contact for a semiconductor light emitting device
01/27/2011US20110018011 Solid-state light source
01/27/2011US20110018007 Electronic device, display apparatus, and electronic device manufacturing method
01/27/2011US20110018005 Semiconductor device and manufacturing method thereof
01/27/2011US20110018004 Semiconductor device with large blocking voltage and manufacturing method thereof
01/27/2011US20110018003 Group iii nitride semiconductor substrate and manufacturing method thereof
01/27/2011US20110018002 Transistors and rectifiers utilizing hybrid electrodes and methods of fabricating the same
01/27/2011US20110018000 Display device and method of fabricating the same
01/27/2011US20110017999 Array substrate and method of fabricating the same
01/27/2011US20110017997 Diffusion Barrier Coated Substrates and Methods of Making the Same
01/27/2011US20110017995 Semiconductor device and method for manufacturing the same
01/27/2011US20110017993 Tft substrate and method of manufacturing the same
01/27/2011US20110017990 Thin-film transistor and method of manufacturing the same
01/27/2011US20110017980 Process and materials for making contained layers and devices made with same
01/27/2011US20110017979 High-performance gate oxides such as for graphene field-effect transistors or carbon nanotubes
01/27/2011US20110017978 Strain-inducing semiconductor regions
01/27/2011US20110017975 Organic optoelectronic device electrodes with nanotubes
01/27/2011US20110017604 Method for making semiconductor electrodes
01/27/2011US20110017586 Method for forming silicon oxide film, storage medium, and plasma processing apparatus
01/27/2011US20110017424 Heat exchange pedestal with coating of diamond-like material
01/27/2011US20110017298 Multi-junction solar cell devices
01/27/2011US20110017286 Composite nanorods with distinct regions
01/27/2011US20110017258 Solar cell and fabrication method thereof
01/27/2011US20110017127 Apparatus and method for producing epitaxial layers
01/27/2011DE4431847C5 Substrat mit bondfähiger Beschichtung Substrate with bondable coating
01/27/2011DE112008003347T5 Verfahren zum Herstellen einer Halbleiter-pn-Sperrschicht unter Verwendung wässriger Phosphorsäure und Vorrichtung zum Aufbringen derselben A method of manufacturing a semiconductor pn junction using aqueous phosphoric acid, and apparatus for applying the same
01/27/2011DE112008002817T5 Verfahren zum Herstellen eines elektronischen Bauelements A method for fabricating an electronic device
01/27/2011DE112008002813T5 Prüfvorrichtung für scheibenförmige Substrate Tester for disc-shaped substrates
01/27/2011DE112004000060B4 Schaltelemente Switching elements