| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/07/2011 | US20110079853 Liquid crystal display and fabrication method thereof |
| 04/07/2011 | US20110079852 Method of fabricating a semiconductor device |
| 04/07/2011 | US20110079851 Split level shallow trench isolation for area efficient body contacts in soi mosfets |
| 04/07/2011 | US20110079848 Semiconductor device with dummy gate electrode and corresponding integrated circuit and manufacturing method |
| 04/07/2011 | US20110079846 High voltage devices, systems, and methods for forming the high voltage devices |
| 04/07/2011 | US20110079844 Trench mosfet with high cell density |
| 04/07/2011 | US20110079842 Semiconductor device |
| 04/07/2011 | US20110079840 Memory cell and manufacturing method thereof and memory structure |
| 04/07/2011 | US20110079837 Capacitor, method of increasing a capacitance area of same, and system containing same |
| 04/07/2011 | US20110079836 Dram cell with double-gate fin-fet, dram cell array and fabrication method thereof |
| 04/07/2011 | US20110079831 Metal Oxide Semiconductor Field Effect Transistors (MOSFETS) Including Recessed Channel Regions |
| 04/07/2011 | US20110079829 Finfets and methods for forming the same |
| 04/07/2011 | US20110079828 Metal gate fet having reduced threshold voltage roll-off |
| 04/07/2011 | US20110079827 Structure and method to create a damascene local interconnect during metal gate deposition |
| 04/07/2011 | US20110079826 Semiconductor device, method for fabricating the same and apparatus for fabricating the same |
| 04/07/2011 | US20110079825 Cascoded high voltage junction field effect transistor |
| 04/07/2011 | US20110079822 Compound semiconductor device and manufacturing method |
| 04/07/2011 | US20110079820 Device with self aligned stressor and method of making same |
| 04/07/2011 | US20110079819 Igbt with fast reverse recovery time rectifier and manufacturing method thereof |
| 04/07/2011 | US20110079814 Light emitted diode substrate and method for producing the same |
| 04/07/2011 | US20110079804 Polarized light emitting diode device and method for manufacturing the same |
| 04/07/2011 | US20110079792 Semiconductor device and method of fabricating the semiconductor device |
| 04/07/2011 | US20110079784 Thin film transistor, method of manufacturing the thin film transistor and organic light emitting display device having thin film transistor |
| 04/07/2011 | US20110079782 Display substrate, method of manufacturing the display substrate, and display device having the display substrate |
| 04/07/2011 | US20110079780 Method of crystallizing amorphous semiconductor film, thin-film transistor, semiconductor device, display device, and method of manufacturing the same |
| 04/07/2011 | US20110079779 Shape characterization with elliptic fourier descriptor for contact or any closed structures on the chip |
| 04/07/2011 | US20110079778 Semiconductor device and manufacturing method thereof |
| 04/07/2011 | US20110079777 Semiconductor device and method for manufacturing the same |
| 04/07/2011 | US20110079771 Compound semiconductor device and method of manufacturing the same |
| 04/07/2011 | US20110079770 Preparation of Thin Film Transistors (TFTs) or Radio Frequency Identification (RFID) Tags or Other Printable Electronics Using Ink-Jet Printer and Carbon Nanotube Inks |
| 04/07/2011 | US20110079764 Information recording medium, manufacturing method therefor, and sputtering target |
| 04/07/2011 | US20110079581 Plasma etching apparatus |
| 04/07/2011 | US20110079357 Adhesive tape joining apparatus |
| 04/07/2011 | US20110079273 Photovoltaic devices |
| 04/07/2011 | US20110079262 Diffusing agent composition, method of forming impurity diffusion layer, and solar battery |
| 04/07/2011 | DE202010012763U1 Festgeklemmte monolithische Gasverteilungselektrode Clamped monolithic gas distribution electrode |
| 04/07/2011 | DE112009001476T5 Verfahren zum Herstellen von Halbleiterstrukturen und mittels solcher Verfahren erhaltene Halbleiterstrukturen A method for manufacturing semiconductor structures and obtained by means of such methods semiconductor structures |
| 04/07/2011 | DE112009001297T5 ALXGA(1-X)AS-Substrat, Epitaxialwafer für Infrarot-LED, Infrarot-LED, Verfahren zur Herstellung eines ALXGA(1-X) AS-Substrats, Verfahren zur Herstellung eines Epitaxialwafers für eine Infrarot-LED und Verfahren zur Herstellung einer Infrarot-LED Al x Ga (1-x) As substrate, epitaxial wafer for infrared LED, infrared LED, methods for the preparation of a Al x Ga (1-x) As substrate, process for producing an epitaxial wafer for an infrared LED and methods of manufacturing an infra -LED |
| 04/07/2011 | DE102010041547A1 Halbleitervorrichtung mit einem SOI-Substrat und Verfahren zur Herstellung derselben A semiconductor device comprising an SOI substrate and method of manufacturing the same |
| 04/07/2011 | DE102010037426A1 Halbleiterstruktur und Verfahren zu deren Herstellung Semiconductor structure and process for their preparation |
| 04/07/2011 | DE102009049775A1 Vertikal integriertes elektronisches Bauelement, Verfahren zu dessen Herstellung und Finnen-Bipolartransistor Vertically integrated electronic component, to processes for its preparation and fin bipolar transistor |
| 04/07/2011 | DE102009047891A1 Verbesserte Füllbedingungen in einem Austauschgateverfahren durch Eckenverrundung vor dem vollständigen Entfernen eines Platzhaltermaterials Improved filling conditions in an exchange gate process by corner rounding before complete removal of a placeholder material |
| 04/07/2011 | DE102009045385A1 Method for closing trench of e.g. microelectronic-electromechanical system component, involves applying lattice on micromechanical component over trench to be formed, and closing openings of lattice by separating filling layer on lattice |
| 04/07/2011 | DE102009045291A1 Vorrichtung zur Konditionierung von Halbleiterchips und Testverfahren unter Verwendung der Vorrichtung A device for conditioning semiconductor chip and test method using the apparatus |
| 04/07/2011 | DE102009045270A1 Method for separating microelectronic or micromechanical components i.e. chips, involves producing separating trench in output component, and expanding film for breaking output component along separating trench |
| 04/07/2011 | DE102009044933A1 Power semiconductor module, has metal foil with section connected with carrier and connecting section spaced from carrier, where metal foil is electrical-conductively connected with another metal foil at connecting section |
| 04/07/2011 | DE102009043740A1 Rückseitenmetallisierung mit besserer Haftung in Hochleistungshalbleiterbauelementen Backside metallization with improved adhesion in high power semiconductor components |
| 04/07/2011 | DE102009042912A1 Transportvorrichtung Transport device |
| 04/07/2011 | DE102009038709A1 Halbleiterbauelement mit dielektrischem Schichtstapel Semiconductor device with dielectric layer stack |
| 04/07/2011 | DE102009029374A1 Silicon wafer holes coating method for microlithography application, involves bringing particles with center diameter into prepared holes of substrate, and melting particles brought into prepared holes |
| 04/07/2011 | DE102009029373A1 Silicon wafer holes coating method for use during manufacturing of microelectronic elements for microlithography application, involves producing beam from particles with center diameter and minimum diameter, which is larger than 5 nanometer |
| 04/07/2011 | DE102006025960B4 Verfahren zur Herstellung einer integrierten Halbleitereinrichtung A method of manufacturing an integrated semiconductor device |
| 04/07/2011 | DE102006011706B4 Halbleiter-Bauelement, sowie Halbleiter-Bauelement-Test-Verfahren A semiconductor device, and semiconductor device testing method |
| 04/07/2011 | DE102005058680B4 Herstellungsverfahren eines TFT-Array-Substrats Manufacturing method of a TFT array substrate |
| 04/07/2011 | DE102004038339B4 Waferbearbeitungsverfahren Wafer processing method |
| 04/07/2011 | DE10101568B4 Halbleitervorrichtung und Verfahren zur Herstellung derselben A semiconductor device and method of manufacturing the same |
| 04/07/2011 | DE10051049B4 Aluminium-Nickel-Kontaktmetallisierung für p-dotiertes SiC und Herstellungsverfahren dafür Aluminum-nickel contact metallization for p-doped SiC and production method thereof |
| 04/06/2011 | EP2306626A1 Voltage conversion circuit |
| 04/06/2011 | EP2306543A1 Functionalized molecular element, manufacturing method thereof, and functionalized molecular device |
| 04/06/2011 | EP2306527A1 Light-emitting device and method for manufacturing the same |
| 04/06/2011 | EP2306521A2 Method for manufacturing cmos image sensors using a double hard mask coating |
| 04/06/2011 | EP2306518A1 Method of protecting an integrated circuit chip against spying by laser attacks |
| 04/06/2011 | EP2306515A2 IC chip package with directly connected leads |
| 04/06/2011 | EP2306513A2 IC chip package with directly connected leads |
| 04/06/2011 | EP2306510A1 Magnetic memory element and its driving method and nonvolatile memory device |
| 04/06/2011 | EP2306509A1 Process for manufacturing an integrated device with "damascene" field insulation, and integrated device made by such process |
| 04/06/2011 | EP2306508A1 Integrated device with raised LOCOS insulation regions and process for manufacturing such device |
| 04/06/2011 | EP2306507A2 Semiconductor device |
| 04/06/2011 | EP2306506A1 Method of producing a semiconductor device and semiconductor device having a through-wafer interconnect |
| 04/06/2011 | EP2306505A1 Bipolar electrostatic chuck |
| 04/06/2011 | EP2306504A1 Support body and substrate storage container |
| 04/06/2011 | EP2306503A2 Semiconductor electronic device and method of manufacturing thereof |
| 04/06/2011 | EP2306502A1 Method for manufacturing light-emitting diode devices |
| 04/06/2011 | EP2306501A2 Ceramic wiring board and method of manufacturing thereof |
| 04/06/2011 | EP2306500A2 Compound semiconductor device and method of manufacturing the same |
| 04/06/2011 | EP2306499A2 Non-thermal process for forming porous low dielectric constant films |
| 04/06/2011 | EP2306498A1 Method for manufacturing multistep substrate |
| 04/06/2011 | EP2306497A1 Method for manufacturing a low defect interface between a dielectric and a III/V compound |
| 04/06/2011 | EP2306496A2 Method and device for detaching a component which is attached to a flexible film |
| 04/06/2011 | EP2306495A1 Very high efficiency organic light emitting devices based on electrophosphorescence |
| 04/06/2011 | EP2306442A1 EL display device and electronic device |
| 04/06/2011 | EP2306372A1 Method for manufacturing RFID labels |
| 04/06/2011 | EP2306242A2 Method of forming a pattern on a substrate |
| 04/06/2011 | EP2305859A1 III-V Nitride substrate boule and method of making and using the same |
| 04/06/2011 | EP2305754A1 Epoxy-containing polymer photo-curable resin composition, patterning process and electric/electronic part protective film |
| 04/06/2011 | EP2305600A1 A selenium/ group 1B ink and methods of making and using same |
| 04/06/2011 | EP2305511A1 Traveling vehicle system |
| 04/06/2011 | EP2304794A1 Structure and process for fabricating a microelectronic 3d nand flash memory device |
| 04/06/2011 | EP2304788A1 Semiconductor-on-insulator substrate coated with intrinsic and doped diamond films |
| 04/06/2011 | EP2304787A1 Nitrogen-plasma surface treatment in a direct bonding method |
| 04/06/2011 | EP2304786A1 Ball grid array cleaning system |
| 04/06/2011 | EP2304785A1 Device and method for processing and handling process products |
| 04/06/2011 | EP2304784A2 Fixture drying apparatus and method |
| 04/06/2011 | EP2304783A1 Maskless process for solder bumps production |
| 04/06/2011 | EP2304782A1 An integrated circuit comprising light absorbing adhesive |
| 04/06/2011 | EP2304781A1 Methods for coating the backside of semiconductor wafers |
| 04/06/2011 | EP2304780A1 Zinc-oxide based epitaxial layers and devices |
| 04/06/2011 | EP2304779A1 Method and apparatus for achieving low resistance contact to a metal based thin film solar cell |
| 04/06/2011 | EP2304778A1 Selective activation of hydrogen passivated silicon and germanium surfaces |
| 04/06/2011 | EP2304777A1 Process for the manufacture of etched items |