Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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03/30/2011 | CN101996992A Diode structure and manufacture method |
03/30/2011 | CN101996991A Fast testable wafer and wafer test method |
03/30/2011 | CN101996990A Electronic component and manufacturing method thereof |
03/30/2011 | CN101996989A Light-emitting device and manufacturing method thereof |
03/30/2011 | CN101996988A Electronic device and manufacturing method thereof |
03/30/2011 | CN101996985A Light-emitting diode (LED) encapsulation structure capable of positioning heat-conducting adhesive material and manufacturing method thereof |
03/30/2011 | CN101996984A Light-emitting diode packing structure of forming filling type convex lens and manufacturing method thereof |
03/30/2011 | CN101996982A Electronic device and method of manufacturing the same |
03/30/2011 | CN101996981A Module comprising semiconductor devices and module manufacturing method |
03/30/2011 | CN101996980A Power semiconductor module and method for assembling the same |
03/30/2011 | CN101996979A Interposer, module and electronic device including the same |
03/30/2011 | CN101996978A Chip package body and forming method thereof |
03/30/2011 | CN101996977A Contact type test device of integrated circuit and method of manufacturing the same |
03/30/2011 | CN101996976A Semiconductor device and method of manufacturing the same |
03/30/2011 | CN101996975A Interposer chip and manufacturing method thereof |
03/30/2011 | CN101996974A Ball grid array printed circuit board and packaging structure and process thereof |
03/30/2011 | CN101996973A Lead frame for carrying out ceramic double in-line package (CDIP) on chips |
03/30/2011 | CN101996971A Semiconductor device and manufacture method thereof |
03/30/2011 | CN101996970A Integrated circuit device and electronic equipment |
03/30/2011 | CN101996969A Semiconductor device and on-vehicle AC generator |
03/30/2011 | CN101996968A Power semiconductor module with circuit holder and load connection element and method for manufacturing same |
03/30/2011 | CN101996960A Chip encapsulating structure realizing electrical connection without routing and manufacturing method thereof |
03/30/2011 | CN101996959A Chip encapsulation structure capable of realizing electrical connection without routing and manufacture method thereof |
03/30/2011 | CN101996958A Chip package and fabrication method thereof |
03/30/2011 | CN101996957A Semiconductor device having semiconductor chip and metal plate and method for manufacturing the same |
03/30/2011 | CN101996956A Semiconductor device and method for production of semiconductor device |
03/30/2011 | CN101996955A Chip package and fabrication method thereof |
03/30/2011 | CN101996954A 芯片 Chip |
03/30/2011 | CN101996953A Chip package and fabrication method thereof |
03/30/2011 | CN101996951A Nonvolatile memory structure and forming method thereof |
03/30/2011 | CN101996950A Semiconductor device and method of fabricating the same |
03/30/2011 | CN101996949A Method for manufacturing semiconductor device |
03/30/2011 | CN101996948A Method for forming semiconductor device |
03/30/2011 | CN101996947A Method for integrating silicon-based photoelectric device |
03/30/2011 | CN101996946A Method for fabricating semiconductor device |
03/30/2011 | CN101996945A Method for forming semiconductor device |
03/30/2011 | CN101996944A Manufacture method of nano metal plug electrode array |
03/30/2011 | CN101996943A Method for separating material layer |
03/30/2011 | CN101996942A Semiconductor device and production method thereof |
03/30/2011 | CN101996941A Method of manufacturing semiconductor device |
03/30/2011 | CN101996940A Semiconductor device and method of manufacturing the same |
03/30/2011 | CN101996939A Method for producing metal plug |
03/30/2011 | CN101996938A Method for manufacturing word lines of storage |
03/30/2011 | CN101996937A Contact hole forming method |
03/30/2011 | CN101996936A Manufacturing method for semiconductor structure |
03/30/2011 | CN101996935A Production method of nano metal plug electrode array applied to conductive bridge memory |
03/30/2011 | CN101996934A Method for manufacturing semiconductor device |
03/30/2011 | CN101996933A Method for manufacturing top copper interconnection layer |
03/30/2011 | CN101996932A Method for forming interconnection structure |
03/30/2011 | CN101996931A Method for forming semiconductor device |
03/30/2011 | CN101996930A Method for making contact joint gasket and semiconductor device |
03/30/2011 | CN101996929A Forming method of dual-damascene structure and semiconductor structure |
03/30/2011 | CN101996928A Method for forming semiconductor device |
03/30/2011 | CN101996927A Multilayer interconnection structure and forming method thereof |
03/30/2011 | CN101996926A Method and structure for self aligned contact of integrated circuit |
03/30/2011 | CN101996925A Method for forming through hole at bottom of groove |
03/30/2011 | CN101996924A Method for forming metal interconnecting layer |
03/30/2011 | CN101996923A Method for forming shallow trench isolation structure |
03/30/2011 | CN101996922A Silicon on insulator (SOI) wafer and formation method thereof |
03/30/2011 | CN101996921A STI forming method |
03/30/2011 | CN101996920A Method of manufacturing semiconductor device and semiconductor device |
03/30/2011 | CN101996919A Substrate holding apparatus, mask alignment method, and vacuum processing apparatus |
03/30/2011 | CN101996918A Method for aligning substrate |
03/30/2011 | CN101996917A Method of aligning substrate |
03/30/2011 | CN101996916A Apparatus and method for conveying silicon wafer frame |
03/30/2011 | CN101996915A Driving device and die bonder |
03/30/2011 | CN101996914A Liquid processing apparatus for substrate and liquid processing method |
03/30/2011 | CN101996913A System for post-processing of electronic components |
03/30/2011 | CN101996912A Method for wafer-level testing of integrated circuits, system and method for testing of semiconductor device |
03/30/2011 | CN101996911A Failure analysis method of gate oxide |
03/30/2011 | CN101996910A Method for detecting testing structure of semiconductor device |
03/30/2011 | CN101996909A Detection methods for ashing process and electrical characteristics of semiconductor device |
03/30/2011 | CN101996908A Method and device for detecting wafer |
03/30/2011 | CN101996907A Bumping device for pressing wafer-level elastomer into microsphere |
03/30/2011 | CN101996906A Method for implementing flip-chip soldering of solder during soldering in groove |
03/30/2011 | CN101996905A Method and system for bonding electrical devices using an electrically conductive adhesive |
03/30/2011 | CN101996904A Method for manufacturing terminal structure and method for manufacturing electronic device |
03/30/2011 | CN101996903A Wire bonding apparatus |
03/30/2011 | CN101996902A Method of manufacturing semiconductor device |
03/30/2011 | CN101996901A Method for manufacturing aluminum pad |
03/30/2011 | CN101996900A Method for forming redistribution structure |
03/30/2011 | CN101996899A Cmos image sensor and manufacturing method thereof |
03/30/2011 | CN101996898A Cmos image sensor and manufacturing method thereof |
03/30/2011 | CN101996897A Method for fabricating circuit substrate assembly and power electronics module |
03/30/2011 | CN101996896A Semiconductor device and method for manufacturing the same |
03/30/2011 | CN101996895A Semiconductor device and method for manufacturing the same |
03/30/2011 | CN101996894A Semiconductor device and method of forming dam material around periphery of die to reduce warpage |
03/30/2011 | CN101996893A Semiconductor device and method of forming cavity in build-up interconnect structure for short signal path between die |
03/30/2011 | CN101996892A System level photoelectric structure and manufacturing method thereof |
03/30/2011 | CN101996891A Metal-coated polyimide film and process for producing the same |
03/30/2011 | CN101996890A Preparation device and method of carbon nanotube radiators |
03/30/2011 | CN101996889A Ultrathin packaging process |
03/30/2011 | CN101996888A Method for forming bumps |
03/30/2011 | CN101996887A Method for forming bumps |
03/30/2011 | CN101996886A Method for manufacturing semiconductor device |
03/30/2011 | CN101996885A Metal oxide semiconductor (MOS) transistor and manufacturing method thereof |
03/30/2011 | CN101996884A Method for manufacturing source-drain region |
03/30/2011 | CN101996883A Manufacturing method of source-drain region of N-type metal oxide semiconductor |
03/30/2011 | CN101996882A Method for removing pollutant granules in barrier layer and metal layer |
03/30/2011 | CN101996881A Method for forming high-tensile stress film |