Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2011
03/31/2011US20110076799 Selenium/Group 1b ink and methods of making and using same
03/31/2011US20110076798 Dichalcogenide ink containing selenium and methods of making and using same
03/31/2011US20110076797 Method for producing localized patterns
03/31/2011US20110076792 Fabrication method of pixel structure and thin film transistor
03/31/2011US20110076790 Method for controlling threshold voltage of semiconductor element
03/31/2011US20110076789 Manufacturing method of semiconductor device and substrate processing apparatus
03/31/2011US20110076788 Method of making semiconductor light- emitting device
03/31/2011US20110076787 Method and apparatus for uniform microwave treatment of semiconductor wafers
03/31/2011US20110076786 Method and apparatus for controlled thermal processing
03/31/2011US20110076785 Process to fabricate bottom electrode for MRAM device
03/31/2011US20110076784 Fabrication of Magnetic Element Arrays
03/31/2011US20110076727 Penetrable cap
03/31/2011US20110076120 Substrate processing apparatus and substrate transfer method
03/31/2011US20110076119 Vacuum processing apparatus
03/31/2011US20110076118 Substrate transfer robot with chamber and substrate monitoring capability
03/31/2011US20110076117 Process module, substrate processing apparatus, and substrate transferring method
03/31/2011US20110075875 Mems microphone package
03/31/2011US20110075694 III-Nitride semiconductor laser device, and method of fabricating the III-Nitride semiconductor laser device
03/31/2011US20110075486 Charge trapping memory cell having bandgap engineered tunneling structure with oxynitride isolation layer
03/31/2011US20110075393 Semiconductor Die-Based Packaging Interconnect
03/31/2011US20110075376 Module substrate radiating heat from electronic component by intermediate heat transfer film and a method for manufacturing the same
03/31/2011US20110075322 Electrochemical capacitor
03/31/2011US20110075124 Source and Mask Optimization By Changing Intensity and Shape of the Illumination Source
03/31/2011US20110075119 Resist pattern forming method, semiconductor apparatus using said method, and exposure apparatus thereof
03/31/2011US20110074663 Array substrate and manufacturing method thereof
03/31/2011US20110074498 Electronic Devices and Systems, and Methods for Making and Using the Same
03/31/2011US20110074493 Configurable np channel lateral drain extended mos-based transistor
03/31/2011US20110074049 Method of manufacturing semiconductor device, mask and semiconductor device
03/31/2011US20110074048 Semiconductor device and method of manufacturing the same
03/31/2011US20110074047 Semiconductor Device and Method of Forming Pad Layout for Flipchip Semiconductor Die
03/31/2011US20110074046 Printed wiring board and manufacturing method thereof
03/31/2011US20110074044 Patternable low-k dielectric interconnect structure with a graded cap layer and method of fabrication
03/31/2011US20110074041 Circuit Board with Oval Micro Via
03/31/2011US20110074040 Semiconductor Device And Method For Making Same
03/31/2011US20110074039 Reliable interconnect for semiconductor device
03/31/2011US20110074036 Via contact structures and methods for integrated circuits
03/31/2011US20110074035 Semiconductor memory apparatus and method for fabricating the same
03/31/2011US20110074034 Method of manufacturing a semiconductor component and structure
03/31/2011US20110074031 Back side metallization with superior adhesion in high-performance semiconductor devices
03/31/2011US20110074030 METHOD FOR PREVENTING Al-Cu BOTTOM DAMAGE USING TiN LINER
03/31/2011US20110074028 Semiconductor Device and Method of Dissipating Heat From Thin Package-on-Package Mounted to Substrate
03/31/2011US20110074026 Semiconductor Device and Method of Forming Insulating Layer on Conductive Traces for Electrical Isolation in Fine Pitch Bonding
03/31/2011US20110074024 Semiconductor Device and Method of Forming Bump-on-Lead Interconnection
03/31/2011US20110074023 Apparatus And Methods Of Forming An Interconnect Between A Workpiece And Substrate
03/31/2011US20110074022 Semiconductor Device and Method of Forming Flipchip Interconnect Structure
03/31/2011US20110074020 Semiconductor device and method for mounting semiconductor device
03/31/2011US20110074018 Semiconductor device and method of manufacturing the same
03/31/2011US20110074017 Method of manufacturing semiconductor device, semiconductor device and multilayer wafer structure
03/31/2011US20110074016 Semiconductor device and manufacturing method therefor
03/31/2011US20110074015 Stacked semiconductor device and a method for manufacturing the same
03/31/2011US20110074014 Semiconductor Device and Method of Forming Adhesive Material to Secure Semiconductor Die to Carrier in WLCSP
03/31/2011US20110074013 Film forming method of silicon oxide film, silicon oxide film, semiconductor device, and manufacturing method of semiconductor device
03/31/2011US20110074011 Mechanical coupling in a multi-chip module using magnetic components
03/31/2011US20110074009 Isostress grid array and method of fabrication thereof
03/31/2011US20110074007 Thermally enhanced low parasitic power semiconductor package
03/31/2011US20110074006 Rf transistor packages with internal stability network including intra-capacitor resistors and methods of forming rf transistor packages with internal stability networks including intra-capacitor resistors
03/31/2011US20110074005 Semiconductor device, method for fabricating a semiconductor device and lead frame, comprising a bent contact section
03/31/2011US20110074004 Package process and package structure
03/31/2011US20110074003 Foil based semiconductor package
03/31/2011US20110074002 Stacking devices at finished package level
03/31/2011US20110074001 Chip card having a plurality of components
03/31/2011US20110074000 Optoelectronic component and method for producing an optoelectronic component
03/31/2011US20110073999 Mixed alloy lead frame for packaging power semiconductor devices and its fabrication method
03/31/2011US20110073998 Adhesion Promotion Layer For A Semiconductor Device
03/31/2011US20110073997 Semiconductor Structure and Method for Making Same
03/31/2011US20110073995 Semiconductor device, fabrication method of the semiconductor devices
03/31/2011US20110073994 Trench capacitor and method for producing the same
03/31/2011US20110073993 Laminated thin-film device, manufacturing method thereof, and circuit
03/31/2011US20110073992 Manufacturing method of semiconductor device and semiconductor device
03/31/2011US20110073991 Redox capacitor and manufacturing method thereof
03/31/2011US20110073990 Capacitor and Method for Making Same
03/31/2011US20110073989 Optical modulator utilizing wafer bonding technology
03/31/2011US20110073987 Through Substrate Features in Semiconductor Substrates
03/31/2011US20110073986 Semiconductor integrated circuit device and manufacturing method thereof
03/31/2011US20110073985 Method of Generating Uniformly Aligned Well and Isolation Regions in a Substrate and Resulting Structure
03/31/2011US20110073981 Semiconductor device and method for manufacturing the same
03/31/2011US20110073972 Vertical mirror in a silicon photonic circuit
03/31/2011US20110073971 Solid-state imaging device and manufacturing method for the same
03/31/2011US20110073969 Sensor system and method for manufacturing same
03/31/2011US20110073968 Element array, electromechanical conversion device, and process for producing the same
03/31/2011US20110073967 Apparatus and method of forming a mems acoustic transducer with layer transfer processes
03/31/2011US20110073966 Indexing of electronic devices distributed on different chips
03/31/2011US20110073965 Gate pattern of semiconductor device and method for fabricating the same
03/31/2011US20110073964 Semiconductor device with oxygen-diffusion barrier layer and method for fabricating same
03/31/2011US20110073963 Superior fill conditions in a replacement gate approach by corner rounding prior to completely removing a placeholder material
03/31/2011US20110073961 Self-aligned well implant for improving short channel effects control, parasitic capacitance, and junction leakage
03/31/2011US20110073960 Integrated device with raised locos insulation regions and process for manufacturing such device
03/31/2011US20110073959 Stress engineering in a contact level of semiconductor devices by stressed conductive layers and an isolation spacer
03/31/2011US20110073958 Asymmetric silicon-on-insulator sram cell
03/31/2011US20110073956 Forming semiconductor resistors in a semiconductor device comprising metal gates by increasing etch resistivity of the resistors
03/31/2011US20110073951 Enhanced stress-retention fin-fet devices and methods of fabricating enhanced stress retention fin-fet devices
03/31/2011US20110073946 Ldmos transistor
03/31/2011US20110073945 Process for manufacturing an integrated device with "damascene" field insulation, and integrated device made by such process
03/31/2011US20110073944 Semiconductor device and method of manufacturing the semiconductor device
03/31/2011US20110073943 True csp power mosfet based on bottom-source ldmos
03/31/2011US20110073940 Semiconductor device with one-side-contact and method for fabricating the same
03/31/2011US20110073938 Field-effect semiconductor device and method of producing the same
03/31/2011US20110073936 Nanocrystal memory with differential energy bands and method of formation
03/31/2011US20110073933 Semiconductor device and method of manufacturing the same
03/31/2011US20110073931 Semiconductor device manufacturing method