Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2011
04/13/2011CN102016129A Electroplating composition and process for coating a semiconductor substrate using said composition
04/13/2011CN102016119A Heat treatment apparatus
04/13/2011CN102016116A Vaporizer and deposition system using the same
04/13/2011CN102016102A Water-reactive Al composite material, water-reactive Al film, method for production of the Al film, and structural member for film-forming chamber
04/13/2011CN102015812A Polyurethane foam and polishing pad
04/13/2011CN102015522A Integrated carrier for microfluidic device
04/13/2011CN102015222A New method and loader apparatus for TEM machine work chamber device
04/13/2011CN102015127A Methods of manufacturing capacitive electromechanical transducer and capacitive electromechanical transducers
04/13/2011CN102015050A Compositions and methods containing fluorine substituted olefins
04/13/2011CN102014568A Workpiece de-chucking device of plasma reactor and workpiece de-chucking method using the same
04/13/2011CN102013450A COB integrated encapsulation technology of special technology
04/13/2011CN102013438A Groove MOSFET (Metal-Oxide Semiconductor Field Effect Transistor) device and making method thereof
04/13/2011CN102013437A Semiconductor device and making method thereof
04/13/2011CN102013436A Low-voltage transient-voltage suppression device having bi-directional breakdown protection and manufacturing method thereby
04/13/2011CN102013435A Semiconductor device
04/13/2011CN102013434A Bipolar complementary metal oxide semiconductor and preparation method thereof
04/13/2011CN102013432A Organic light emitting diode display and method of manufacturing the same
04/13/2011CN102013431A Mushroom type memory cell having self-aligned bottom electrode and diode access device
04/13/2011CN102013428A Metal oxide semiconductor chip and making method thereof
04/13/2011CN102013427A Avalanche breakdown diode structure and production method thereof
04/13/2011CN102013424A Integrated circuit and manufacturing method thereof
04/13/2011CN102013423A Semiconductor device and method of manufacturing the same
04/13/2011CN102013420A Semiconductor encapsulating structure and encapsulating method thereof
04/13/2011CN102013419A Carrier band for packaging minitype radio-frequency module
04/13/2011CN102013418A Novel PCB (Printed Circuit Board) carrier tape for SIM card package
04/13/2011CN102013417A Novel PCB carrier tape for package of micro radio-frequency module
04/13/2011CN102013415A Substrate structure applied to flexible electronic component and manufacture method thereof
04/13/2011CN102013414A Making method of flexible display assembly
04/13/2011CN102013413A Semiconductor apparatus and breakdown voltage control method of the same
04/13/2011CN102013412A Methods of forming field effect transistors and methods of forming integrated circuitry
04/13/2011CN102013411A Manufacture method for shallow trench isolation structure
04/13/2011CN102013410A Inductance element and forming method thereof
04/13/2011CN102013409A Resistance element and forming method thereof
04/13/2011CN102013408A Susceptor structure and processing apparatus
04/13/2011CN102013407A Film-coating hook and silicon wafer loader adopting same
04/13/2011CN102013406A Wire-bonding machine and cover-gas supply device applicable for the same
04/13/2011CN102013405A Welding needle heating structure and method of chip wire bonding device
04/13/2011CN102013404A Protective film covering method and apparatus
04/13/2011CN102013403A Wafer level chip size packaging structure and manufacturing method thereof
04/13/2011CN102013402A Lamination method of adhesive tape and lead frame
04/13/2011CN102013401A Non-destructive arc moulding mechanism for integrated circuit pin, and method thereof
04/13/2011CN102013400A Method for producing low-temperature polysilicon thin film transistor with crystallized bottom metals
04/13/2011CN102013399A Manufacturing method of field effect transistor
04/13/2011CN102013398A Method for manufacturing power MOS (Metal Oxide Semiconductor) transistor
04/13/2011CN102013397A Method for processing a target object
04/13/2011CN102013396A Plasma etching method
04/13/2011CN102013395A Method for treating groove and forming UMOS (U-shaped groove Metal Oxide Semiconductor) transistor
04/13/2011CN102013394A Method for forming a thick bottom oxide (tbo) in a trench mosfet
04/13/2011CN102013393A Manufacturing method of semiconductor structure
04/13/2011CN102013392A Forming method of diffusion zone
04/13/2011CN102013391A Method of manufacturing semiconductor device
04/13/2011CN102013390A Sorting apparatus for semiconductor device
04/13/2011CN102013389A Substrate processing apparatus and substrate processing method
04/13/2011CN102013388A Chamber cleaning method
04/13/2011CN102013387A Metal disc winding for etching equipment and assembly method thereof
04/13/2011CN102013386A Heating tool in semiconductor encapsulating and routing process and method thereof
04/13/2011CN102013043A Optimization method and system for dispatching in semiconductor manufacture
04/13/2011CN102012644A Method for reducing characteristic dimension of photoresist pattern
04/13/2011CN102012637A Accurately-aligned correction model in photolithographic process
04/13/2011CN102012592A Liquid crystal display device and manufacturing method thereof
04/13/2011CN102012590A FFS type TFT-LCD array substrate and manufacturing method thereof
04/13/2011CN102012589A TFT-LCD array substrate and manufacturing method thereof
04/13/2011CN102012574A Manufacturing method of liquid crystal display panel and liquid crystal display substrate
04/13/2011CN102011191A Gan single crystal substrate and method of manufacturing thereof and gan-based semiconductor device and method of manufacturing thereof
04/13/2011CN102011099A Deposition doped polysilicon machine board
04/13/2011CN102010677A Thermosetting die bonding film, dicing die bonding film and semiconductor device
04/13/2011CN102010566A Method for preparing epoxy moulding compound for packaging integrated circuit
04/13/2011CN102009385A Chemical mechanical polishing method for semiconductor wafer
04/13/2011CN102009384A Grinding head device for chemically mechanical polishing equipment
04/13/2011CN102009383A Chemical machinery grinding equipment and grinding method
04/13/2011CN101707189B Using multi-layer/multi-input/multi-output (mlmimo) models for metal-gate structures
04/13/2011CN101699551B Active element array substrate and repair method thereof
04/13/2011CN101681876B Infrared laser wafer scribing using short pulses
04/13/2011CN101651113B Automatic feed traying device
04/13/2011CN101647111B Capacitor cell, integrated circuit, integrated circuit designing method, and integrated circuit manufacturing method
04/13/2011CN101640168B Substrate processing control method
04/13/2011CN101632153B Method for silicon thin film formation
04/13/2011CN101630657B Integrated circuit chip and manufacturing method for integrated circuit device
04/13/2011CN101622692B Method of cleaning plasma-treating apparatus, plasma-treating apparatus where the cleaning method is practiced
04/13/2011CN101612719B Polishing apparatus and polishing method
04/13/2011CN101609792B Microwave plasma processing apparatus and method of supplying microwaves using the apparatus
04/13/2011CN101604645B Reciprocating fetching device
04/13/2011CN101599474B Integrated circuit module and manufacture method thereof
04/13/2011CN101599469B Semiconductor chip encapsulation structure with back surface electricity conductivity and producing method thereof
04/13/2011CN101593922B Semiconductor lead processing device
04/13/2011CN101589449B Technique for improving the performance and extending the lifetime of an ion source with gas dilution
04/13/2011CN101587869B Reversible leadless package and methods of making and using same
04/13/2011CN101582415B Semiconductor device
04/13/2011CN101582378B Substrate processing apparatus and control method thereof
04/13/2011CN101578688B Apparatus and method for processing substrate
04/13/2011CN101572483B Switching power supply device and semiconductor integrated circuit
04/13/2011CN101567373B Bi-direction element and its manufacturing method
04/13/2011CN101567308B Apparatus for manufacturing semiconductor package for wide lead frame and method of constructing semiconductor package using same
04/13/2011CN101556956B Discrete power MOSFET integrated with sense fet
04/13/2011CN101556382B TFT-LCD array substrate and methods for manufacturing and testing same
04/13/2011CN101552220B Substrate processing apparatus and substrate processing method
04/13/2011CN101552202B Methods of forming a shallow base region of a bipolar transistor
04/13/2011CN101546700B Electrode structure and substrate processing apparatus
04/13/2011CN101546696B Substrate processing apparatus and substrate processing method
04/13/2011CN101542692B Etching solution composition