Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2011
04/14/2011US20110086508 Semiconductor device having metal wirings of laminated structure
04/14/2011US20110086507 Method for providing oxide layers
04/14/2011US20110086506 Method for fabricating damascene interconnect structure having air gaps between metal lines
04/14/2011US20110086505 Metallic bump structure without under bump metallurgy and a manufacturing method thereof
04/14/2011US20110086504 Methods for forming integrated circuits
04/14/2011US20110086503 Method for fabricating semiconductor device with buried gates
04/14/2011US20110086502 Method for fabricating a gate structure
04/14/2011US20110086501 Technique for Processing a Substrate Having a Non-Planar Surface
04/14/2011US20110086500 Impurity implantation method and ion implantation apparatus
04/14/2011US20110086499 Method for removing photoresist
04/14/2011US20110086498 Quantum Tunneling Devices and Circuits with Lattice-Mismatched Semiconductor Structures
04/14/2011US20110086497 Method for producing semiconductor device
04/14/2011US20110086496 Metal organic chemical vapor deposition apparatus and method
04/14/2011US20110086495 Methods for protecting film layers while removing hardmasks during fabrication of semiconductor devices
04/14/2011US20110086494 Method of removing heavy metal in semiconductor substrate
04/14/2011US20110086493 Semiconductor chip having island dispersion structure and method for manufacturing the same
04/14/2011US20110086492 Reprocessing method of semiconductor substrate, manufacturing method of reprocessed semiconductor substrate, and manufacturing method of soi substrate
04/14/2011US20110086491 Growing a III-V Layer on Silicon using Aligned Nano-Scale Patterns
04/14/2011US20110086490 Single-side implanting process for capacitors of stack dram
04/14/2011US20110086489 Methods of manufacturing a hybrid electrical contact
04/14/2011US20110086488 Plasma etch for chromium alloys
04/14/2011US20110086487 Semiconductor Device with Reduced Capacitance Tolerance Value
04/14/2011US20110086486 Methods of Forming Integrated Circuit Chips Having Vertically Extended Through-Substrate Vias Therein
04/14/2011US20110086485 Method for manufacturing a mos semiconductor memory device, and plasma cvd device
04/14/2011US20110086484 Body tie test structure for accurate body effect measurement
04/14/2011US20110086483 Non-volatile memory device for 2-bit operation and method of fabricating the same
04/14/2011US20110086482 Apparatus and associated method for making a floating gate cell with increased overlay between the control gate and floating gate
04/14/2011US20110086481 Methods of forming non-volatile memory structure with crested barrier tunnel layer
04/14/2011US20110086480 Semiconductor device and manufacturing method of the same
04/14/2011US20110086479 Method for selective formation of trench
04/14/2011US20110086478 Systems and methods for integrated circuits comprising multiple body biasing domains
04/14/2011US20110086477 Method of manufacturing semiconductor device
04/14/2011US20110086476 Methods of Forming Field Effect Transistors on Substrates
04/14/2011US20110086475 Semiconductor device, and manufacturing method of semiconductor device
04/14/2011US20110086474 Method of manufacturing thin film transistor substrate
04/14/2011US20110086473 Hybrid orientation semiconductor structure with reduced boundary defects and method of forming same
04/14/2011US20110086472 Semiconductor device and method for forming the same
04/14/2011US20110086471 Method of producing a semiconductor device with an aluminum or aluminum alloy electrode
04/14/2011US20110086470 Additional metal routing in semiconductor devices
04/14/2011US20110086469 Modular low stress package technology
04/14/2011US20110086468 Assembly of semiconductor chips/wafers
04/14/2011US20110086456 Betavoltaic battery with a shallow junction and a method for making same
04/14/2011US20110086455 Gyroscope
04/14/2011US20110086446 Method of forming thermal bend actuator with connector posts connected to drive circuitry
04/14/2011US20110086445 Methods relating to capacitive monitoring of layer characteristics during back end-of-the-line processing
04/14/2011US20110086444 Process for producing substrates free of patterns using an alpha stepper to ensure results
04/14/2011US20110086443 Method of manufacturing semiconductor device
04/14/2011US20110086442 Copper contamination detection method and system for monitoring copper contamination
04/14/2011US20110086441 Laser annealing method and laser annealing apparatus
04/14/2011US20110086440 Method for manufacturing an extraordinary magnetoresistive (emr) device with novel lead structure
04/14/2011US20110086439 Method and apparatus for manufacturing magnetoresistive element
04/14/2011US20110086218 Composite material, having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methods
04/14/2011US20110085760 Optical devices and methods of fabricating the same
04/14/2011US20110085381 Charge carrier device
04/14/2011US20110085377 Nonvolatile semiconductor storage device, and method for controlling nonvolatile semiconductor storage device
04/14/2011US20110085368 Non-volatile memory device and method of manufacturing the same
04/14/2011US20110085119 Active device array substrate, display panel and manufacturing method of display panel
04/14/2011US20110084781 Method For Temperature Compensation In MEMS Resonators With Isolated Regions Of Distinct Material
04/14/2011US20110084721 Manufacturing method and wafer unit for testing
04/14/2011US20110084713 Chloride detection
04/14/2011US20110084412 Indexing of electronic devices with multiple weight markers
04/14/2011US20110084403 Pad bonding employing a self-aligned plated liner for adhesion enhancement
04/14/2011US20110084402 Packaged semiconductor assemblies and methods for manufacturing such assemblies
04/14/2011US20110084401 Package-on-package system with via z-interconnections and method for manufacturing thereof
04/14/2011US20110084400 Semiconductor device and manufacturing method thereof
04/14/2011US20110084397 3d integrated circuit layer interconnect
04/14/2011US20110084392 Electronic Structures Including Conductive Layers Comprising Copper and Having a Thickness of at Least 0.5 Micrometers
04/14/2011US20110084387 Designs and methods for conductive bumps
04/14/2011US20110084386 Semiconductor Device and Method of Self-Confinement of Conductive Bump Material During Reflow Without Solder Mask
04/14/2011US20110084384 Semiconductor device and method for manufacturing the same
04/14/2011US20110084383 Semiconductor device and manufacturing method thereof
04/14/2011US20110084382 Chip package and fabrication method thereof
04/14/2011US20110084378 Semiconductor package with integrated interference shielding and method of manufacture thereof
04/14/2011US20110084377 System for separating a diced semiconductor die from a die attach tape
04/14/2011US20110084375 Semiconductor device package with integrated stand-off
04/14/2011US20110084373 Integrated circuit package system employing an offset stacked configuration and method for manufacturing thereof
04/14/2011US20110084372 Package carrier, semiconductor package, and process for fabricating same
04/14/2011US20110084370 Semiconductor package and process for fabricating same
04/14/2011US20110084369 Device including a semiconductor chip and a carrier and fabrication method
04/14/2011US20110084368 Overmolded semiconductor package with a wirebond cage for emi shielding
04/14/2011US20110084367 Epitaxial wafer and method of producing the same
04/14/2011US20110084366 Epitaxial Wafer and Production Method Thereof
04/14/2011US20110084363 Compound Semiconductor Substrate, Semiconductor Device, and Processes for Producing Them
04/14/2011US20110084362 Active Diode Having No Gate and No Shallow Trench Isolation
04/14/2011US20110084360 Embedded series deep trench capacitors and methods of manufacture
04/14/2011US20110084358 Apparatus and Method for Through Silicon via Impedance Matching
04/14/2011US20110084356 Local buried layer forming method and semiconductor device having such a layer
04/14/2011US20110084355 Isolation Structure For Semiconductor Device
04/14/2011US20110084354 Semiconductor device and method of manufacturing a semiconductor device
04/14/2011US20110084353 Trench schottky rectifier device and method for manufacturing the same
04/14/2011US20110084348 Magnetoresistance element, method of manufacturing the same, and storage medium used in the manufacturing method
04/14/2011US20110084346 Pressure sensor and method of manufacturing the same
04/14/2011US20110084344 Mems device with a composite back plate electrode and method of making the same
04/14/2011US20110084343 Monolithic IC and MEMS microfabrication process
04/14/2011US20110084340 Voids in STI Regions for Forming Bulk FinFETs
04/14/2011US20110084337 Semiconductor device and method for manufacturing the same
04/14/2011US20110084336 Semiconductor device with stressed fin sections, and related fabrication methods
04/14/2011US20110084335 Semiconductor device with drain voltage protection and manufacturing method thereof
04/14/2011US20110084334 Bilateral conduction semiconductor device and manufacturing method thereof
04/14/2011US20110084333 Power devices with super junctions and associated methods manufacturing