Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2011
04/21/2011WO2011046203A1 Substrate, group-3b element nitride crystals, and process for producing same
04/21/2011WO2011046191A1 Jig for semiconductor production and method for producing same
04/21/2011WO2011046174A1 Exposure apparatus, exposure method, maintenance method, and method for manufacturing device
04/21/2011WO2011046171A1 Carrier transfer facilitating device
04/21/2011WO2011046129A1 Apparatus for holding thin-board-like material and method for holding thin-board-like material
04/21/2011WO2011046091A1 Magnet device
04/21/2011WO2011046090A1 Magnet device
04/21/2011WO2011046075A1 Method for producing transfer mask and method for manufacturing semiconductor device
04/21/2011WO2011046073A1 Transfer mask, method for producing transfer mask, and method for manufacturing semiconductor device
04/21/2011WO2011046071A1 Multilayer semiconductor integrated circuit device
04/21/2011WO2011046052A1 Method for forming ventilation holes in an electrode plate
04/21/2011WO2011046048A1 Semiconductor device and manufacturing method thereof
04/21/2011WO2011046025A1 Logic circuit and semiconductor device
04/21/2011WO2011046021A1 Silicon carbide substrate manufacturing method and silicon carbide substrate
04/21/2011WO2011046020A1 Silicon carbide substrate manufacturing method, silicon carbide substrate, and semiconductor device
04/21/2011WO2011046017A1 Polishing pad
04/21/2011WO2011046012A1 Method for manufacturing transistor evaluation device, and transistor evaluation device
04/21/2011WO2011046003A1 Semiconductor device and manufacturing method thereof
04/21/2011WO2011045988A1 Method, apparatus, and program for manufacturing silicon structural body
04/21/2011WO2011045962A1 Light reflecting conductive particles, anisotropic conductive adhesive, and light emitting device
04/21/2011WO2011045960A1 Thin-film transistor, process for production of same, and display device equipped with same
04/21/2011WO2011045956A1 Semiconductor device, display device provided with same, and method for manufacturing semiconductor device
04/21/2011WO2011045667A1 System for and method of cleaning of copper wire using plasma, activated or reduced gas atmosphere
04/21/2011WO2011045551A1 Apparatus and method for processing long, continuous flexible substrates
04/21/2011WO2011045442A2 Switching system and method
04/21/2011WO2011045398A1 Method and installation for producing a semiconductor device, and semiconductor device
04/21/2011WO2011045178A1 Retaining device for thin, planar substrates
04/21/2011WO2011045153A1 Semiconductor component having a plated through-hole and method for the production thereof
04/21/2011WO2011044871A1 Method and device for removing substrates
04/21/2011WO2011044794A1 Electrostatic chuck and method for removing remaining charges thereof
04/21/2011WO2011044776A1 Forming method for semiconductor device
04/21/2011WO2011026218A9 Using interrupted through-silicon-vias in integrated circuits adapted for stacking
04/21/2011WO2011025800A3 Maintaining integrity of a high-k gate stack by passivations using an oxygen plasma
04/21/2011WO2011022635A3 Methods and system for patterning a substrate
04/21/2011WO2011022121A3 Analyte sensor fabrication
04/21/2011WO2011019215A3 Apparatus for forming layer
04/21/2011WO2011016641A3 Substrate for ball grid array semiconductor package and fabrication method thereof
04/21/2011WO2011015942A3 Ohmic electrode and method of forming the same
04/21/2011WO2011013961A3 Method for forming a gapless semiconductor thin film
04/21/2011WO2011011298A3 Method of operating a clamping system of a wire bonding machine
04/21/2011WO2011011266A3 System and method for plasma arc detection, isolation and prevention
04/21/2011WO2011011139A3 Method and materials for reverse patterning
04/21/2011WO2011010819A3 Multi-selective polishing slurry composition and a semiconductor element production method using the same
04/21/2011WO2011008015A3 Wafer-dicing method
04/21/2011WO2011005456A3 Cmp compositions and methods for suppressing polysilicon removal rates
04/21/2011WO2010151844A3 Metal oxide structures, devices, & fabrication methods
04/21/2011WO2010151604A3 Methods for fabricating passivated silicon nanowires and devices thus obtained
04/21/2011WO2010149762A3 Biocompatible packaging
04/21/2011WO2010126893A3 Method and apparatus for controlling ion energy distribution
04/21/2011WO2010070454A3 Helium recovery from semiconductor cluster tools
04/21/2011WO2010058009A3 Method for rotating a sawed wafer block and device therefor
04/21/2011WO2009014587A8 Wet etching of the edge and bevel of a silicon wafer
04/21/2011US20110092661 Polyhedral oligomeric silsesquioxanes and metallized polyhedral oligomeric silsesquioxanes as coatings, composites and additives
04/21/2011US20110092179 Switch Circuit and Method of Switching Radio Frequency Signals
04/21/2011US20110092079 Method and installation for producing an anti-reflection and/or passivation coating for semiconductor devices
04/21/2011US20110092078 Selective functionalization of doped group iv nanoparticle surfaces using lewis acid/lewis base interaction
04/21/2011US20110092077 Method to minimize wet etch undercuts and provide pore sealing of extreme low k (k<2.5) dielectrics
04/21/2011US20110092076 Apparatus and method of vapor coating in an electronic device
04/21/2011US20110092075 Manufacturing apparatus and method for semiconductor device
04/21/2011US20110092074 Texturing and cleaning agent for the surface treatment of wafers and use thereof
04/21/2011US20110092073 Plasma processing apparatus, plasma processing method, and method for manufacturing electronic device
04/21/2011US20110092072 Heating plate with planar heating zones for semiconductor processing
04/21/2011US20110092071 Method of producing silylated porous insulating film, method of producing semiconductor device, and silylated material
04/21/2011US20110092070 Method for film formation, apparatus for film formation, and computer-readable recording medium
04/21/2011US20110092069 Self-aligned patterned etch stop layers for semiconductor devices
04/21/2011US20110092068 Semiconductor device and method for fabricating the same
04/21/2011US20110092067 Air gap structure having protective metal silicide pads on a metal feature
04/21/2011US20110092066 Bumping Electronic Components Using Transfer Substrates
04/21/2011US20110092065 Semiconductor device suitable for a stacked structure
04/21/2011US20110092064 Preventing UBM Oxidation in Bump Formation Processes
04/21/2011US20110092063 Method of manufacturing silicon carbide semiconductor device
04/21/2011US20110092062 Transistor Gate Forming Methods and Transistor Structures
04/21/2011US20110092061 Methods of Forming Silicon Oxides and Methods of Forming Interlevel Dielectrics
04/21/2011US20110092060 Methods of forming wiring structures
04/21/2011US20110092059 Techniques for processing a substrate
04/21/2011US20110092058 Ion implanted substrate having capping layer and method
04/21/2011US20110092057 Methods of fabricating transistors using laser annealing of source/drain regions
04/21/2011US20110092056 Electrically conductive path forming below barrier oxide layer and integrated circuit
04/21/2011US20110092055 Compound semiconductor substrate grown on metal layer, method of manufacturing the same, and compound semiconductor device using the same
04/21/2011US20110092054 Methods for fixing graphene defects using a laser beam and methods of manufacturing an electronic device
04/21/2011US20110092053 Wire discharge-machining apparatus and wire discharge-machining method, semiconductor wafer manufacturing apparatus and semiconductor wafer manufacturing method, and solar-cell wafer manufacturing apparatus and solar-cell wafer manufacturing method
04/21/2011US20110092052 Method of fabricating single crystal gallium nitride semiconductor substrate, nitride gallium semiconductor substrate and nitride semiconductor epitaxial substrate
04/21/2011US20110092051 Process for the transfer of a thin film comprising an inclusion creation step
04/21/2011US20110092050 Method for manufacturing semiconductor device
04/21/2011US20110092049 Method and apparatus for substrate bonding
04/21/2011US20110092048 Method of forming active region structure
04/21/2011US20110092047 Strained Semiconductor Using Elastic Edge Relaxation, a Buried Stressor Layer and a Sacrificial Stressor Layer
04/21/2011US20110092046 Method of forming semiconductor devices in wafer assembly
04/21/2011US20110092045 Buried decoupling capacitors, devices and systems including same, and methods of fabrication
04/21/2011US20110092044 Method for manufacturing capacitor lower electrodes of semiconductor memory
04/21/2011US20110092043 Deep trench capacitor in a soi substrate having a laterally protruding buried strap
04/21/2011US20110092042 Monitor pattern of semiconductor device and method of manufacturing semiconductor device
04/21/2011US20110092041 Phase Change Memory with Diodes Embedded in Substrate
04/21/2011US20110092040 Semiconductor device and method for fabricating the same
04/21/2011US20110092039 Fin field effect transistor and method for forming the same
04/21/2011US20110092038 Three dimensional semiconductor memory device and method of fabricating the same
04/21/2011US20110092037 Semiconductor device
04/21/2011US20110092036 Method for manufacturing semiconductor device
04/21/2011US20110092035 Formation of high sheet resistance resistors and high capacitance capacitors by a single polysilicon process
04/21/2011US20110092034 Zero capacitor ram with reliable drain voltage application and method for manufacturing the same