| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/20/2011 | CN102024812A Semiconductor device and method of manufacturing the same |
| 04/20/2011 | CN102024809A Integrated circuit device with capacitor structure and manufacturing method thereof |
| 04/20/2011 | CN102024808A X-ray sensor and manufacturing method thereof |
| 04/20/2011 | CN102024807A Protection device and method for semiconductor apparatus |
| 04/20/2011 | CN102024802A 集成电路结构及其形成方法 Integrated circuit structure and method of forming |
| 04/20/2011 | CN102024801A Ultrathin chip perpendicular interconnection packaging structure and manufacture method thereof |
| 04/20/2011 | CN102024798A Packaging structure used for integrating surface adhesive type assembly |
| 04/20/2011 | CN102024790A Semiconductor device for interconnection process and manufacturing method thereof |
| 04/20/2011 | CN102024789A Glue layer and forming method thereof |
| 04/20/2011 | CN102024788A Semiconductor device for interconnection process and manufacturing method thereof |
| 04/20/2011 | CN102024786A Semiconductor device for interconnection process and manufacturing method thereof |
| 04/20/2011 | CN102024785A Semiconductor device |
| 04/20/2011 | CN102024783A Semiconductor element for use in interconnection process and manufacturing method thereof |
| 04/20/2011 | CN102024782A Three-dimensional vertical interconnecting structure and manufacturing method thereof |
| 04/20/2011 | CN102024781A 集成电路结构 Integrated circuit structure |
| 04/20/2011 | CN102024780A Electronic device, method of manufacturing electronic device, and electronic equipment |
| 04/20/2011 | CN102024777A Semiconductor chip encapsulation structure and encapsulation method |
| 04/20/2011 | CN102024775A Semiconductor structure and manufacturing method thereof |
| 04/20/2011 | CN102024773A Resin-sealed semiconductor device and method of manufacturing the same |
| 04/20/2011 | CN102024772A Heat-dissipating substrate and fabricating method thereof |
| 04/20/2011 | CN102024771A Packaging structure and method |
| 04/20/2011 | CN102024770A Semiconductor chip package structure and package method |
| 04/20/2011 | CN102024768A Manufacturing method of semiconductor device and semiconductor structure |
| 04/20/2011 | CN102024767A Wafer edge film structure and formation method thereof |
| 04/20/2011 | CN102024766A Integrated circuit package system with through semiconductor vias and method of manufacture thereof |
| 04/20/2011 | CN102024765A Method for manufacturing storage |
| 04/20/2011 | CN102024764A Method for manufacturing flash memory control grid |
| 04/20/2011 | CN102024763A method for manufacturing NOR flash memory with phosphorus and arsenic ion injection |
| 04/20/2011 | CN102024762A Method for manufacturing NOR semiconductor storage structure |
| 04/20/2011 | CN102024761A Method for forming semiconductor integrated circuit device |
| 04/20/2011 | CN102024760A Method for manufacturing semiconductor device |
| 04/20/2011 | CN102024759A 半导体装置及其制造方法 Semiconductor device and manufacturing method |
| 04/20/2011 | CN102024758A Method for manufacturing Schottky diode |
| 04/20/2011 | CN102024757A 像素结构及其制造方法 Pixel structure and its manufacturing method |
| 04/20/2011 | CN102024756A Method for forming nanometer crystalline silicon structure used for manufacturing integrated circuit devices |
| 04/20/2011 | CN102024755A Cmos image sensor and forming method thereof |
| 04/20/2011 | CN102024754A Method for manufacturing semiconductor device |
| 04/20/2011 | CN102024753A Laser processing method for workpiece |
| 04/20/2011 | CN102024752A Method for improving chip cutting |
| 04/20/2011 | CN102024751A Novel manufacturing method of TFT (Thin Film Transistor) active matrix |
| 04/20/2011 | CN102024750A Chip-level eco shrink |
| 04/20/2011 | CN102024749A Forming method of through hole |
| 04/20/2011 | CN102024748A Method for reducing critical dimension of contact hole |
| 04/20/2011 | CN102024747A Method for manufacturing aluminium plug of power device |
| 04/20/2011 | CN102024746A Method for copper interconnection wiring manufacture process |
| 04/20/2011 | CN102024745A Method for improving uniformity of contact resistance |
| 04/20/2011 | CN102024744A Semiconductor device and manufacture method thereof |
| 04/20/2011 | CN102024743A Semiconductor structures and methods for forming isolation between fin structures of finfet devices |
| 04/20/2011 | CN102024742A Substrate processing method and substrate processing apparatus |
| 04/20/2011 | CN102024741A Method for forming shallow trench isolation structure |
| 04/20/2011 | CN102024740A Method for manufacturing shallow trench isolation region |
| 04/20/2011 | CN102024739A Production method for shallow trench isolation area |
| 04/20/2011 | CN102024738A Isolation structure and manufacturing method thereof |
| 04/20/2011 | CN102024737A Method for improving shallow trench isolation corner rounding by sacrifice liner oxidation layer |
| 04/20/2011 | CN102024736A Mounting table structure and processing apparatus |
| 04/20/2011 | CN102024735A High speed substrate aligner apparatus |
| 04/20/2011 | CN102024734A Substrate processing apparatus and method |
| 04/20/2011 | CN102024733A Conveying mechanism and processing device |
| 04/20/2011 | CN102024732A Substrate exchanging module for substrate processing apparatus and substrate processing apparatus having the same |
| 04/20/2011 | CN102024731A Slice-bearing table device with internal hoistable support column |
| 04/20/2011 | CN102024730A Placing mechanism, transport method of wafer having dicing frame |
| 04/20/2011 | CN102024729A Bidirectional transmission wafer box mechanism |
| 04/20/2011 | CN102024728A Semiconductor chip holding tray |
| 04/20/2011 | CN102024727A Loader |
| 04/20/2011 | CN102024726A Detection method and manufacturing method of MOS device |
| 04/20/2011 | CN102024725A Detection method and system in semiconductor process |
| 04/20/2011 | CN102024724A Method of manufacturing semiconductor device and semiconductor device |
| 04/20/2011 | CN102024723A Transverse plastic-sealed diode lead wire straightening machine |
| 04/20/2011 | CN102024722A Lead soldering apparatus and method |
| 04/20/2011 | CN102024721A Method of forming solderable side-surface terminals of quad no-lead frame (qfn) integrated circuit packages |
| 04/20/2011 | CN102024720A Method for manufacturing semiconductor device |
| 04/20/2011 | CN102024719A Method for forming salient point |
| 04/20/2011 | CN102024718A Method for making aluminum soldering disc |
| 04/20/2011 | CN102024717A Eutectic method and eutectic structure of semiconductor chip |
| 04/20/2011 | CN102024716A Semiconductor device and method for manufacturing the same |
| 04/20/2011 | CN102024715A Method of producing and assembling electrical contact adopting conductive elastic material |
| 04/20/2011 | CN102024714A Ceramic column grid array packaging and column planting device |
| 04/20/2011 | CN102024713A Semiconductor packaging technology |
| 04/20/2011 | CN102024712A Packaging structure and method for manufacturing the same |
| 04/20/2011 | CN102024711A Method for improving qualification rate of PLCC encapsulated integrated circuit |
| 04/20/2011 | CN102024710A Method for manufacturing photoelectric element, encapsulation structure and encapsulation device thereof |
| 04/20/2011 | CN102024709A Lens assembly and method for forming the same |
| 04/20/2011 | CN102024708A 引线框及其形成方法 Leadframe and method for forming |
| 04/20/2011 | CN102024707A Method for manufacturing GaAs-based metal oxide semiconductor (MOS) device |
| 04/20/2011 | CN102024706A Method for manufacturing semiconductor device |
| 04/20/2011 | CN102024705A Semiconductor and method for producing same |
| 04/20/2011 | CN102024704A Method for manufacturing metal oxide semiconductor field effect transistor |
| 04/20/2011 | CN102024703A Doping method |
| 04/20/2011 | CN102024702A Method for improving negative bias temperature instability of semiconductor device |
| 04/20/2011 | CN102024701A P-channel metal oxide semiconductor transistor source-drain injection method |
| 04/20/2011 | CN102024700A Method for manufacturing trench double-diffuse metal oxide semiconductor transistor |
| 04/20/2011 | CN102024699A Quick thermal annealing method for semiconductor device |
| 04/20/2011 | CN102024698A Method of manufacturing semiconductor device and mask |
| 04/20/2011 | CN102024697A Etching method for low dielectric constant material |
| 04/20/2011 | CN102024696A Opening and forming method thereof |
| 04/20/2011 | CN102024695A Method of manufacturing semiconductor device and substrate processing apparatus |
| 04/20/2011 | CN102024694A Plasma processing apparatus |
| 04/20/2011 | CN102024693A Liquid processing apparatus for substrate, and method for generating processing liquid |
| 04/20/2011 | CN102024692A Manufacturing method of oxide layer between splitting grids |
| 04/20/2011 | CN102024691A Grid structure forming method |