Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2011
04/20/2011CN101515566B Method for forming integrated circuit
04/20/2011CN101512727B Method for improving inversion layer mobility in a silicon carbide MOSFET
04/20/2011CN101504543B Extraction of key process parameter
04/20/2011CN101501838B Microelectronic assembly and method for forming the same
04/20/2011CN101496154B Method of making fully silicided gate electrodes
04/20/2011CN101488474B System and method for scribing substrate
04/20/2011CN101488445B Method for reducing Ioff scattering of nodes above 65 nanometers
04/20/2011CN101485002B Lighting device package with frame and optical transmission components
04/20/2011CN101477974B Glue sealing method of conductive wire frame strip, and semiconductor encapsulation construction having the conductive wire frame
04/20/2011CN101473416B Substrate processing system and substrate conveyance method
04/20/2011CN101471276B Flat suction nozzle and chip fetching/laying machine as well as semiconductor test method thereof
04/20/2011CN101465333B Lead wire frame and producing method thereof
04/20/2011CN101465327B Semiconductor element substrate, ink jet head employing semiconductor element substrate, and method for bonding semiconductor element substrate
04/20/2011CN101465273B Wet-type etching method for reducing wafer surface blemish and device thereof
04/20/2011CN101461055B Producing soi structure using high-purity ion shower
04/20/2011CN101459164B 功率半导体模块及其组合方法 Power semiconductor module and a combination method
04/20/2011CN101459147B Heat radiation fin, encapsulation piece comprising the heat radiation fin and encapsulation method
04/20/2011CN101452907B Vertical interconnecting through-hole for three-dimensional systematic encapsulation, and preparation thereof
04/20/2011CN101452892B Method of making a finfet device structure
04/20/2011CN101452862B Encapsulation method with grains reconfigured
04/20/2011CN101452837B Semiconductor element manufacture method
04/20/2011CN101447483B Calibration technique for measuring power device at wafer level and semiconductor wafer
04/20/2011CN101443887B Pulsed growth of GAN nanowires and applications in group III nitride semiconductor substrate materials and devices
04/20/2011CN101442060B Pixel array and method of manufacturing the same
04/20/2011CN101442008B Insulated gate semiconductor device and novel self-alignment manufacture method thereof
04/20/2011CN101438406B Light-emitting device with inorganic housing
04/20/2011CN101436558B Method of compression-molding electronic components and mold
04/20/2011CN101427348B Methods to reduce the minimum pitch in a pattern
04/20/2011CN101425503B Semiconductor device and method for manufacturing the same
04/20/2011CN101421823B Aberration evaluation pattern,aberration evaluation method,aberration correction method
04/20/2011CN101419984B Semiconductor structure and method for fabricating same
04/20/2011CN101419913B Method for manufacturing semiconductor thin film
04/20/2011CN101419902B Multi-chamber vacuum processing apparatus
04/20/2011CN101416293B Method to improve the step coverage and pattern loading for dielectric films
04/20/2011CN101416280B Method of forming an atomic layer thin film out of the liquid phase and microelectronic structure
04/20/2011CN101414553B Method of processing semiconductor wafer
04/20/2011CN101393883B Substrate transport system
04/20/2011CN101393881B System and method for checking construction formed on semi-conductor wafer
04/20/2011CN101390194B Maintenance method, exposure method and apparatus and device manufacturing method
04/20/2011CN101388367B Wafer stage package method and package construction
04/20/2011CN101388363B Non-volatile memory and preparation thereof
04/20/2011CN101385121B Pattern forming apparatus, pattern forming method, mobile object driving system, mobile body driving method, exposure apparatus, exposure method and device manufacturing method
04/20/2011CN101383338B First inter-metal medium capable of improving flash memory performance and preparation thereof
04/20/2011CN101383321B Method for forming isolation layer in semiconductor device
04/20/2011CN101383296B Method of manufacturing semiconductor device
04/20/2011CN101379605B A semiconductor process system having an optical instrument comprising an apparatus for aligning an optical device with an object
04/20/2011CN101379407B An integrated circuit package, and a method for producing an integrated circuit package
04/20/2011CN101375382B Semiconductor device package and method for manufacturing same
04/20/2011CN101371344B 场效应晶体管 FET
04/20/2011CN101364543B Semiconductor device and method for manufacturing same
04/20/2011CN101361164B Apparatus for degassing a disc-like substrate
04/20/2011CN101356636B Reduced capacity carrier, transport, load port, buffer system
04/20/2011CN101354490B Half-transmission half-reflection type liquid crystal display and manufacturing method thereof
04/20/2011CN101350309B Plane double diffusion metal oxide semiconductor device and preparation method
04/20/2011CN101346805B Abrasive grain-free polishing liquid and CMP polishing method
04/20/2011CN101339957B Power FET with low on-resistance using merged metal layers
04/20/2011CN101331590B Methods for oriented growth of nanowires on patterned substrates
04/20/2011CN101326623B Case and method for accepting semiconductor chip
04/20/2011CN101325149B Device, system and method for manufacturing semiconductor
04/20/2011CN101322233B Method for bonding between electrical devices using ultrasonic vibration
04/20/2011CN101312139B Polycrystalline silicon film resistance value test method
04/20/2011CN101308849B Semi-conductor apparatus and forming method thereof
04/20/2011CN101308775B Method and system for introducing process fluid through a chamber component
04/20/2011CN101299418B Semiconductor device and manufacture method thereof
04/20/2011CN101297390B Systems, masks, and methods for photolithography
04/20/2011CN101289284B Process for effectively controlling air bubble producing in forming process of fluorine-containing silex glass interlayer medium layer
04/20/2011CN101283447B Structure and method to increase strain enhancement with spacerless FET and dual liner process
04/20/2011CN101279710B Method for judging wafer backside alignment overlay accuracy and wafer thereof
04/20/2011CN101276154B Lithographic apparatus and method
04/20/2011CN101273472B Method for manufacturing semiconductor light-emitting device
04/20/2011CN101262004B Phase change storage unit and method for dual shallow groove separated bipolar transistor selection
04/20/2011CN101258591B Method for making a semiconductor-on-insulation heterostructure
04/20/2011CN101256946B Heat processing furnace and vertical-type heat processing apparatus
04/20/2011CN101251903B RFID tag
04/20/2011CN101232776B Printed circuit board
04/20/2011CN101226930B Semiconductor structure with layer or structure identification mark and manufacturing method and application thereof
04/20/2011CN101221947B Semiconductor component including a semiconductor chip and a passive component and its manufacture method
04/20/2011CN101211977B Transistor having recess channel and fabricating method thereof
04/20/2011CN101211855B Shallow impurity drain domain logical operation method suitable for active region read only memory
04/20/2011CN101189730B Bulk non-planar transistor having strained enhanced mobility and methods of fabrication
04/20/2011CN101188226B Chip package structure and fabricating process thereof
04/20/2011CN101183641B Method for cutting protective tape of semiconductor wafer and apparatus for cutting the protective tape
04/20/2011CN101176192B Method for forming high-resolution pattern and pre-pattern substrate formed therefor
04/20/2011CN101168851B Epitaxial silicon wafer and fabrication method thereof
04/20/2011CN101165862B High pressure stress film and stress silicon metal oxide semiconductor transistor and its manufacture method
04/20/2011CN101156219B Ink composition and metallic material
04/20/2011CN101145521B Semiconductor device manufacturing method, semiconductor wafer, and semiconductor device
04/20/2011CN101138075B Adhesive tape for wafer dicing and chip manufacturing method using same
04/20/2011CN101135047B Gasification device and semiconductor processing system
04/20/2011CN101133363B Colored alkali-developable photosensitive resin composition and color filters made by using the same
04/20/2011CN101128556B Method for felting underlay
04/20/2011CN101112940B Container conversion device for semi-conductor packaging element
04/20/2011CN101111930B A method of manufacturing a semiconductor device
04/20/2011CN101110433B Semiconductor device and manufacturing method thereof
04/20/2011CN101110429B Electronic device, display device, image display system and method for fabricating the same
04/20/2011CN101097903B Overlay vernier key and method for fabricating the same
04/20/2011CN101095223B A method for making a semiconductor device having a high-k gate dielectric layer and a metal gate electrode
04/20/2011CN101092276B Baking method of quartz products and the quartz products
04/20/2011CN101073149B Methodology for recovery of hot carrier induced degradation in bipolar devices
04/20/2011CN101064247B Method for manufacturing semiconductor device