Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2011
04/21/2011US20110089473 Method for improved mobility using hybrid orientation technology (HOT) in conjunction with selective epitaxy and related apparatus
04/21/2011US20110089472 Integrated mos sensor having temperature sensor
04/21/2011US20110089469 Method for Manufacturing a Low Defect Interface Between a Dielectric and a III-V Compound
04/21/2011US20110089467 Ohmic contact of iii-v semiconductor device and method of forming the same
04/21/2011US20110089462 Method for low temperature bonding of electronic components
04/21/2011US20110089447 Light-emiting device chip with micro-lenses and method for fabricating the same
04/21/2011US20110089445 Method for preparing a semiconductor
04/21/2011US20110089439 Integrated cmos porous sensor
04/21/2011US20110089438 Opto-electrical assemblies and associated apparatus and methods
04/21/2011US20110089434 Display panel and rework method of gate insulating layer of thin film transistor
04/21/2011US20110089430 Compound semiconductor device and method for fabricating the same
04/21/2011US20110089429 Systems, methods and materials involving crystallization of substrates using a seed layer, as well as products produced by such processes
04/21/2011US20110089428 Semiconductor device and manufacturing method thereof
04/21/2011US20110089427 Securities, chip mounting product, and manufacturing method thereof
04/21/2011US20110089426 Integrated Circuit, Semiconductor Device Comprising the Same, Electronic Device Having the Same, and Driving Method of the Same
04/21/2011US20110089424 Display substrate, method of manufacturing the same, and display apparatus having the same
04/21/2011US20110089421 Thin film transistor array panel and method for manufacturing the same
04/21/2011US20110089418 Zinc oxide based compound semiconductor device
04/21/2011US20110089416 Semiconductor device and method for manufacturing the same
04/21/2011US20110089415 Epitaxial growth of single crystalline mgo on germanium
04/21/2011US20110089413 High-performance diode device structure and materials used for the same
04/21/2011US20110089404 Microfabrication of Carbon-based Devices Such as Gate-Controlled Graphene Devices
04/21/2011US20110089403 Electronic device using a two-dimensional sheet material, transparent display and methods of fabricating the same
04/21/2011US20110089396 Field emission array having carbon microstructure and method of manufacturing the same
04/21/2011US20110089393 Memory and Method of Fabricating the Same
04/21/2011US20110089392 Memory using tunneling field effect transistors
04/21/2011US20110089391 Punch-through diode steering element
04/21/2011US20110089321 Ion beam apparatus and method employing magnetic scanning
04/21/2011US20110088850 Plasma processing apparatus, plasma processing method, and storage medium
04/21/2011US20110088848 Microwave plasma-treating apparatus
04/21/2011US20110088846 Plasma source
04/21/2011US20110088257 Mounting apparatus
04/21/2011DE202009016849U1 Vorrichtung zum Bearbeiten von Dünnschicht-Solarmodulen und Bearbeitungsanlage für Dünnschicht-Solarmodule Apparatus for machining of thin-film solar modules and processing equipment for thin-film solar modules
04/21/2011DE202004021800U1 Halbleiterfilme aus einer quartären oder höheren Legierung der Gruppe I-III-VI Semiconductor films of a quaternary or higher alloy of group I-III-VI
04/21/2011DE112009001477T5 Kostengünstige Substrate mit Hochwiderstands-Eigenschaften und Verfahren zum Herstellen derselben -Cost substrates with high-resistance properties and method of making same
04/21/2011DE112009001014T5 AlxGa(1-x)As-Substrat, Epitaxialwafer für Infrarot-LEDs, Infrarot-LED, Verfahren zur Herstellung eines AlxGa(1-x)AS-Substrats, Verfahren zur Herstellung eines Epitaxialwafers für Infrarot-LEDs und Verfahren zur Herstellung von Infrarot-LEDs Al x Ga (1-x) As substrate, epitaxial wafer for infrared LEDs, infrared LEDs, process for preparing a Al x Ga (1-x) As substrate, process for producing an epitaxial wafer for infrared LEDs and method for the production of infrared LEDs
04/21/2011DE112009000670T5 Metallgatterstruktur und Verfahren zum Herstellen derselben Metal gate structure and method of manufacturing the same
04/21/2011DE10356880B4 Verfahren zur Herstellung eines flüssigkeits-, gas- und dampfdichten elektrischen und/oder optischen Bauelements A process for preparing a liquid-, gas- and vapor-tight electrical and / or optical component
04/21/2011DE102010047708A1 Gruppe-III-V-Halbleiterbauteil mit Zwischenschichten zur Verspannungsentlastung Group III-V semiconductor component with intermediate layers for bracing relief
04/21/2011DE102010046665A1 Waferbearbeitungsverfahren Wafer processing method
04/21/2011DE102010042383A1 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation
04/21/2011DE102010042381A1 Halbleitervorrichtung und Verfahren zur Herstellung einer Halbleitervorrichtung A semiconductor device and method of manufacturing a semiconductor device
04/21/2011DE102010042136A1 Verfahren zur Herstellung einer Siliciumcarbidhalbleitervorrichtung A process for preparing a Siliciumcarbidhalbleitervorrichtung
04/21/2011DE102010037703A1 Kondensator und Verfahren zu seiner Herstellung Capacitor and process for its preparation
04/21/2011DE102010037439A1 Bauelement mit einem Halbleiterchip und einem Träger und Fabrikationsverfahren Component having a semiconductor chip and a substrate and fabrication process
04/21/2011DE102010037292A1 Anordnung und Herstellungsverfahren Assembly and manufacturing processes
04/21/2011DE102009051585A1 Solar cells or solar cell strings transporting device, has handle device connected with arm and holding cells and/or cell strings, where connection of handle device is controlled with arm and force for holding cells is preserved
04/21/2011DE102009050845A1 Verfahren und Vorrichtung zur Behandlung einer Substratoberfläche eines Substrats Method and apparatus for treating a substrate surface of a substrate
04/21/2011DE102009050703B3 Verfahren zur Selbstassemblierung elektrischer, elektronischer oder mikromechanischer Bauelemente auf einem Substrat und damit hergestelltes Erzeugnis A method for self-assembly of electrical, electronic or micro-mechanical devices on a substrate and thereby product produced
04/21/2011DE102009049102A1 Halbleiterbauelement mit Durchkontaktierung und Verfahren zur Herstellung einer Durchkontaktierung in einem Halbleiterbauelement A semiconductor device having through-hole plating and method for making a via hole in a semiconductor device
04/21/2011DE102009048436A1 Verfahren zum Schleifen einer Halbleiterscheibe A method of grinding a semiconductor wafer
04/21/2011DE102009045181A1 Leistungshalbleitermodul und Verfahren zum Betrieb eines Leistungshalbleitermoduls The power semiconductor module and method of operating a power semiconductor module
04/21/2011DE102008025451B4 Halbleiterbauelement und Verfahren zum Platzieren von Halbleiterbauelementen A semiconductor device and method for placing semiconductor devices
04/21/2011DE102007028798B4 Leistungshalbleitervorrichtung Power semiconductor device
04/21/2011DE102007024355B4 Verfahren zum Herstellen einer Schutzstruktur A method for producing a protective structure
04/21/2011DE102006048409B4 Vorrichtung und Verfahren zur Herstellung von Schichten und/oder Kristallen aus Nitriden von Metallen der Gruppe III des PSE Device and method for the production of layers and / or crystals of nitrides of metals of group III of the PSE
04/21/2011DE102006043357B4 Photoempfindliche, hitzehärtbare Harzzusammensetzung und Verwendung derselben zur Herstellung einer Schaltungsplatine A photosensitive thermosetting resin composition and use thereof for the manufacture of a circuit board
04/21/2011DE102004043855B4 Verfahren zur Herstellung einer Magnet-Tunnel-Junction-Vorrichtung A method of manufacturing a magnetic tunnel junction device
04/21/2011DE10128577B4 Halbleiterdrucksensor mit Dehnungsmesser und Schaltungsabschnitt auf einem Halbleitersubstrat A semiconductor pressure sensor with strain gauges and circuit portion on a semiconductor substrate
04/21/2011DE10024749B4 Verfahren zur automatischen Steuerung eines Halbleiterherstellungsprozesses in einem Halbleiterfabrikautomatisierungssystem A method for automatically controlling a semiconductor fabrication process in a semiconductor factory automation system
04/21/2011DE10023379B4 Membranmeßfühler und Membranmessfühleraufbauten, Verfahren zu ihrer Herstellung und mit ihnen angewandte Testverfahren Membranmeßfühler and membrane probe structures, processes for their preparation and applied them test method
04/21/2011CA2777544A1 High growth rate deposition for group iii/v materials
04/21/2011CA2759861A1 Method for manufacturing silicon carbide substrate and silicon carbide substrate
04/21/2011CA2759856A1 Method for manufacturing silicon carbide substrate, silicon carbide substrate, and semiconductor device
04/20/2011EP2312704A1 Connector incorporating electronic component, method for manufacturing connector incorporating electronic component, and apparatus for manufacturing connector incorporating electronic component
04/20/2011EP2312664A2 Electronic devices
04/20/2011EP2312662A1 A method for patterning
04/20/2011EP2312651A1 Gan semiconductor optical element, method for manufacturing gan semiconductor optical element, epitaxial wafer and method for growing gan semiconductor film
04/20/2011EP2312637A1 Organic transistor and method for manufacturing the same
04/20/2011EP2312636A1 Organic thin film transistor, method for manufacturing the same, display member using the organic thin film transistor, and display
04/20/2011EP2312635A2 Transistors with fluorine treatment
04/20/2011EP2312634A2 Transistors with fluorine treatment
04/20/2011EP2312633A1 Method and installation for producing a semiconductor device, and semiconductor device
04/20/2011EP2312630A1 Leadframe and method of manufacturing the same
04/20/2011EP2312624A1 NOR EEPROM device comprising memory cells with one memory transistor and one selection transistor
04/20/2011EP2312622A2 Power semiconductor element bonded to a substrate by a Sn-Sb-Cu solder and manufacturing method therefor
04/20/2011EP2312621A1 MOS transistor including extended LDD source-drain regions
04/20/2011EP2312620A1 Flexible semiconductor device and method for manufacturing same
04/20/2011EP2312619A1 Method for manufacturing semiconductor device
04/20/2011EP2312618A2 Method of cleaning and micro-etching semiconductor wafers
04/20/2011EP2312617A1 Vacuum processing device and gas supply method
04/20/2011EP2312616A1 Film deposition method
04/20/2011EP2312560A1 Active matrix substrate, display panel, display device, and active matrix substrate manufacturing method
04/20/2011EP2312395A1 Exposure apparatus, exposure method, and method for producing a device
04/20/2011EP2312301A1 System and method for supporting finding of defect in object to be inspected
04/20/2011EP2311921A1 Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device
04/20/2011EP2311915A1 Composition for insulating layer
04/20/2011EP2311095A2 Normally-off semiconductor devices and methods of fabricating the same
04/20/2011EP2311084A2 Flip chip overmold package
04/20/2011EP2311083A1 Method of making multiple implantations in a substrate
04/20/2011EP2311082A1 Method for making a structure comprising a step for implanting ions in order to stabilize the adhesive bonding interface
04/20/2011EP2311081A2 Cylindrical magnetic levitation stage
04/20/2011EP2311080A1 Low thermal mass semiconductor wafer support
04/20/2011EP2311079A2 Improved metrology through use of feed forward feed sideways and measurement cell re-use
04/20/2011EP2311078A1 Patterned integrated circuit and method of production thereof
04/20/2011EP2311077A1 Method of forming finned semiconductor devices with trench isolation
04/20/2011EP2311076A2 Rapid thermal processing chamber with shower head
04/20/2011EP2311075A1 A method to increase yield and reduce down time in semiconductor fabrication units by preconditioning components using sub-aperture reactive atom etch
04/20/2011EP2311074A2 Method of polishing nickel-phosphorous
04/20/2011EP2311073A1 Reinforced composite stamp for dry transfer printing of semiconductor elements