Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2011
04/28/2011DE112009000792T5 Tintenstrahldiffusionsmittelzusammensetzung und Verfahren zur Herstellung einer Elektrode oder Solarbatterie mittels dieser Zusammensetzung An ink jet diffusing agent composition and method of manufacturing a solar battery electrode or by means of this composition,
04/28/2011DE112005000529B4 Verbindungshalbleiter-Vorrichtung, Herstellungsverfahren der Verbindungshalbleiter-Vorrichtung und Diode A compound semiconductor device production method of the compound semiconductor device, and diode
04/28/2011DE10359248B4 Verfahren, bei dem eine Aktivmatrixvorrichtung mit organischen Lichtemissionsdioden hergestellt wird Method in which an active matrix device is fabricated with organic light emitting diodes
04/28/2011DE102010042971A1 Transistorbauelement mit einer Feldelektrode Transistor device having a field electrode
04/28/2011DE102010037941A1 Verfahren und Vorrichtung zur Halbleiterbauelementfabrikation unter Verwendung eines rekonstituierten Wafer Method and apparatus for semiconductor device fabrication using a reconstituted wafer
04/28/2011DE102010037120A1 Verfahren zur Herstellung eines Halbleiterbauelements A process for producing a semiconductor device
04/28/2011DE102009051688A1 Verfahren zur lichtinduzierten galvanischen Pulsabscheidung zur Ausbildung einer Saatschicht für einen Metallkontakt einer Solarzelle und zur nachfolgenden Verstärkung dieser Saatschicht bzw. dieses Metallkontakts sowie Anordnung zur Durchführung des Verfahrens A method of light-induced pulse galvanic deposition to form a seed layer for a metal contact of a solar cell and for subsequent amplification of the seed layer and the metal contact, and this arrangement for performing the method
04/28/2011DE102009051567A1 Bernoulli-Düse, Greifervorrichtung mit Bernoulli-Düse und Verfahren zur Herstellung Bernoulli nozzle gripper device with Bernoulli nozzle and process for preparing
04/28/2011DE102009051565A1 Ansaug-Greifervorrichtung für flache Substrate Suction gripper device for flat substrates
04/28/2011DE102009050680A1 Verfahren und Vorrichtung zum Kristallisieren einer amorphen Halbleiterschicht mit einem Laserstrahl Method and device for crystallizing an amorphous semiconductor layer with a laser beam
04/28/2011DE102009050199A1 Herstellung von Leiterstrukturen auf Kunststoff-Folien mittels Nanotinten Production of conductor structures on plastic films by means of nanoinks
04/28/2011DE102009049806A1 Method for electrically isolation testing of thin film photovoltaic module, involves applying test voltage between edges and electrical connections, and adapting mechanical contact device to different sizes of photovoltaic module
04/28/2011DE102009049704A1 Device for testing insulation characteristics of photovoltaic module plate utilized for directly converting sunlight into electricity, has industrial robot positioning testing units in test position on photovoltaic module plate
04/28/2011DE102009045948A1 Method for producing application-specific integrated circuit of layer composite, involves applying conductive material by ink jet printing process or dispensation such that material continuously passes from contact points up to substrate
04/28/2011DE102009045885A1 Method for producing component e.g. micro-mechanical component, involves filling recess with flowable insulation material by dispensation device such that insulation material enters from recess into trench through channel
04/28/2011DE102009045184A1 Bondverbindung zwischen einem Bonddraht und einem Leistungshalbleiterchip Bond between a bonding wire and a power semiconductor chip
04/28/2011DE102009031111B4 Kontaktoptimierung zur Verbesserung der Verspannungsübertragung in dicht liegenden Transistoren Contact optimization to improve the stress transfer in closely spaced transistors
04/28/2011DE102009029577B3 Verfahren zur Herstellung eines hochtemperaturfesten Leistungshalbleitermoduls A method for producing a high temperature resistant power semiconductor module
04/28/2011DE102006030262B4 Verfahren zum Strukturieren von Gateelektroden durch Reduzieren der Seitenwandwinkel einer Maskenschicht Method of patterning of gate electrodes by reducing the sidewall angle of a mask layer
04/28/2011DE102004060821B4 Verfahren zur Herstellung einer Deep-Trench-Struktur in einer STI-Struktur eines Halbleiterkörpers A method of manufacturing a deep trench structure in a STI structure of a semiconductor body
04/28/2011DE102004025976B4 EEPROM-Zellenstruktur mit ungleichmäßiger Kanaldielektrikumdicke und Herstellungsverfahren EEPROM cell structure with non-uniform Kanaldielektrikumdicke and manufacturing processes
04/28/2011DE102004025422B4 Resistiver Kreuzpunktspeicher Resistive cross point memory
04/28/2011DE102004025279B4 Anlage für ein Bestücken von Substraten mit Kugelkontakten und Verfahren zum Bestücken von Substraten mit Kugelkontakten System for a loading substrates with ball contacts, and method for loading substrates with ball contacts
04/28/2011CA2778262A1 3d-trench electrode detectors
04/28/2011CA2778207A1 Method and device for treating a substrate surface of a substrate
04/27/2011EP2315508A1 Collective ceramic substrate, manufacturing method for the substrate, ceramic substrate, and ceramic circuit substrate
04/27/2011EP2315289A2 Laser patterning of devices
04/27/2011EP2315268A2 Supporting substrate for producing a vertically structured semiconductor light-emitting element, and a vertically structured semiconductor light-emitting element employing the same
04/27/2011EP2315247A1 Trench DMOS transistor with embedded trench schottky rectifier
04/27/2011EP2315246A1 Integrated circuit
04/27/2011EP2315241A1 Semiconductor memory device
04/27/2011EP2315240A1 Aluminum ribbon for ultrasonic bonding
04/27/2011EP2315239A1 A method of forming monocrystalline germanium or silicon germanium
04/27/2011EP2315238A1 Heterojunction Bipolar Transistor
04/27/2011EP2315237A1 Vertical heat treatment apparatus and heat treatment method
04/27/2011EP2315236A1 Flap transfer valve
04/27/2011EP2315235A1 Method and apparatus for cleaning a semiconductor substrate
04/27/2011EP2315234A1 Method and installation for producing an anti-reflection and/or passivation coating for semiconductor devices
04/27/2011EP2315215A1 Conductive adhesive and led substrate using the same
04/27/2011EP2315078A1 Upper layer film forming composition for liquid immersion and method of forming photoresist pattern
04/27/2011EP2315077A1 An orientation stage for achieving fine movement and alignment of a template in an imprint lithography process
04/27/2011EP2315076A1 A process and a system for orienting a template in imprint lithography
04/27/2011EP2314737A2 Method of producing high purity semi-insulating single crystal silicon carbide wafer
04/27/2011EP2314733A1 Apparatus
04/27/2011EP2314389A1 Cleaning sheet and method of cleaning a substrate
04/27/2011EP2313926A2 Methods of preparing photovoltaic modules
04/27/2011EP2313925A2 Methods of making capacitors, dram arrays and electronic systems
04/27/2011EP2313919A1 Through wafer via and method of making same
04/27/2011EP2313918A1 Method and apparatus for thermally processing plastic discs, in particular mould wafers
04/27/2011EP2313917A2 Binding of constituents having a high mobility in an electronic connection
04/27/2011EP2313916A2 Heat cycle-able connection
04/27/2011EP2313915A1 A lithographic process using a nanowire mask, and nanoscale devices fabricated using the process
04/27/2011EP2313914A1 Method for electron beam induced etching
04/27/2011EP2313913A1 Method for electron beam induced etching of layers contaminated with gallium
04/27/2011EP2313912A2 Substrate preparation for enhanced thin film fabrication from group iv semiconductor nanoparticles
04/27/2011EP2313543A2 Growth of planar non-polar {1-1 0 0} m-plane and semi-polar {1 1-2 2} gallium nitride with hydride vapor phase epitaxy (hvpe)
04/27/2011EP2313233A2 Wire slicing system
04/27/2011EP2217385B1 Device and method for coating a surface
04/27/2011EP1752725B1 Vertical heat treatment equipment and method for transferring object to be treated
04/27/2011EP1680949B1 Method for producing a solder stop barrier
04/27/2011EP1639629B1 Apparatus for thin-layer chemical processing of semiconductor wafers
04/27/2011EP1636840B1 Micro lead frame substrate and method for its manufacture
04/27/2011EP1630128B1 Process for producing a carbon nanotube device
04/27/2011EP1561239B1 Atomic layer deposition methods
04/27/2011EP1485757B1 Method of producing an etch-resistant polymer structure using electron beam lithography
04/27/2011EP1430520B1 Chemical mechanical polishing pad with micro-holes
04/27/2011EP1329769B1 Positive photosensitive polyimide resin composition
04/27/2011EP1328975B1 Method of fabricating heterojunction photodiodes integrated with cmos
04/27/2011EP0873542B1 Three-dimensional etching process
04/27/2011CN201812842U Silicon chip clamp for plasma etching
04/27/2011CN201812806U Wafer bearing device
04/27/2011CN201812805U Base plate transmission device
04/27/2011CN201812804U Crystal boat shifter used in semiconductor production
04/27/2011CN201812803U Atmospheric transmission unit and wafer transmission system with the same
04/27/2011CN201812802U Strip rollover prevention device
04/27/2011CN201812801U Large-power modularized LED light source packaging device
04/27/2011CN1998079B Module integration integrated circuits
04/27/2011CN1977361B Substrate processing apparatus
04/27/2011CN1930262B Heat-peelable pressure-sensitive adhesive sheet and method of processing adhered with the heat-peelable pressure-sensitive adhesive sheet
04/27/2011CN1873998B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
04/27/2011CN1835825B Flexible formed sheets for treating surfaces
04/27/2011CN1798836B Methods for preventing gluconoylation of proteins
04/27/2011CN1776412B Determination of radiation parameters for inspecting surface
04/27/2011CN1616326B Transfer chamber for flat display device manufacturing apparatus
04/27/2011CN1570219B Electroplating compositions and methods
04/27/2011CN1540692B 镀覆接线端 Plated terminals
04/27/2011CN1536615B System and method for conveying small batch of substrate carrier between processing tools
04/27/2011CN102037791A Plasma processing apparatus
04/27/2011CN102037790A Clamped monolithic showerhead electrode
04/27/2011CN102037576A Semiconductor light emitting element, method for manufacturing semiconductor light emitting element, and lamp
04/27/2011CN102037563A Semiconductor device and manufacturing method thereof
04/27/2011CN102037561A Memory cells, memory cell constructions and memory cell programming methods
04/27/2011CN102037560A Method for making microstructures by converting porous silicon into porous metal or ceramics
04/27/2011CN102037558A Isolated CMOS and bipolar transistors, isolation structures therefor and methods of fabricating the same
04/27/2011CN102037557A Non-volatile semiconductor storage device and method of manufacturing the same
04/27/2011CN102037556A Semiconductor device
04/27/2011CN102037555A Next generation screen printing system
04/27/2011CN102037554A Electrical and optical system and methods for monitoring erosion of electrostatic chuck edge bead materials
04/27/2011CN102037553A Method and apparatus for manufacturing semiconductor device
04/27/2011CN102037552A Stage