| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 05/05/2011 | DE102009051745A1 Hochvolt-Transistor mit Mehrfach-Dielektrikum und Herstellungsverfahren High-voltage transistor with multiple dielectric and manufacturing processes |
| 05/05/2011 | DE102009051520A1 Verfahren zur Herstellung von Siliziumhalbleiterscheiben mit Schichtstrukturen zur Integration von III-V Halbleiterbauelementen A process for the production of silicon semiconductor wafers having multilayer structures for the integration of III-V semiconductor devices |
| 05/05/2011 | DE102009051173A1 Modul für modular aufgebaute Reinraumanlagen Module for modular cleanroom systems |
| 05/05/2011 | DE102009051009A1 Method for polishing semiconductor wafer made of mono-crystalline silicon, involves polishing front and rear sides of semiconductor wafer after removing deposited polycrystalline silicon layer from front and rear sides of wafer |
| 05/05/2011 | DE102009051008A1 Verfahren zur Herstellung einer Halbleiterscheibe A process for producing a semiconductor wafer |
| 05/05/2011 | DE102009051007A1 Verfahren zum Polieren einer Halbleiterscheibe A method of polishing a semiconductor wafer |
| 05/05/2011 | DE102009047808A1 Bipolar semiconductor constituent e.g. semiconductor diode has electric current path that is arranged extending only through n dope zone in semiconductor main portion from one metal covering to another metal covering |
| 05/05/2011 | DE102009046259A1 Stärkere Haftung eines PECVD-Kohlenstoffs auf dielektrischen Materialien durch Vorsehen einer Haftungsgrenzfläche Greater liability of a PECVD carbon on dielectric materials by providing an adhesion interface |
| 05/05/2011 | DE102009046246A1 Verformungstechnologie in dreidimensionalen Transistoren auf der Grundlage global verformter Halbleiterbasisschichten Deformation technology in three-dimensional transistors based on globally deformed semiconductor base layers |
| 05/05/2011 | DE102009046172A1 Metallic cooling element i.e. metal plate, for use in circuit housing of printed circuit board, has outer side whose portion is covered with thin layer formed from plastic material, where outer side of layer provides radiation surface |
| 05/05/2011 | DE102009043328A1 Herstellung von Halbleiterwiderständen in einem Halbleiterbauelement mit Metallgatestrukturen durch Erhöhen der Ätzwiderstandsfähigkeit der Widerstände Fabrication of semiconductor resistors in a semiconductor device with metal gate structures by increasing the etch resistivity of the resistors |
| 05/05/2011 | DE102009019127A1 Ofen zur Herstellung von photovoltaischen Dünnschichtzellen Furnace for the manufacture of thin film photovoltaic cells |
| 05/05/2011 | DE102008046862B4 Halbleiterstruktur mit Halbleiterchip und mit Induktionsspule und Verfahren zum Ausbilden einer solchen Semiconductor structure with the semiconductor chip and with the induction coil and method for forming such a |
| 05/05/2011 | DE102008019599B4 Verfahren zur Herstellung eines Bauelementes durch lokales Erwärmen einer oder mehrerer Metallisierungsschichten und mittels selektiven Ätzens, Bauelemente gemäß den Verfahren und Kaskodenschaltung mit einem Bauelement gemäß dem Verfahren A method for producing a component by locally heating one or more metal layers and by means of selective etching, components according to the methods and cascode circuit with a device according to the method |
| 05/05/2011 | DE102006061994B4 Ladungskompensationsbauelement mit einer Driftstrecke zwischen zwei Elektroden und Verfahren zur Herstellung desselben Charge compensation component thereof with a drift path between the two electrodes and methods for making |
| 05/05/2011 | DE102006037045B4 Herstellungsverfahren zum Erzeugen einer Halbleitervorrichtung Preparation process for producing a semiconductor device |
| 05/05/2011 | DE102006025408B4 Verfahren zur Steigerung des Transistorsleitungsvermögens durch Dotierstoffaktivierung nach der Silizidierung A method for increasing the transistor conducting power by dopant after the silicidation |
| 05/05/2011 | DE102004059232B4 Halbleiterbauteil mit einem Kunststoffgehäuse, einem Halbleiterchip und einer Zwischenplatte, Verfahren zur Herstellung desselben sowie Verwendung einer Moldform bei diesen Verfahren A semiconductor device with a plastic housing, a semiconductor chip and an intermediate plate, method for producing the same as well as use of a Moldform in these processes |
| 05/05/2011 | DE102004021075B4 Halbleiterbauelement mit anisotrop thermisch leitender Radiatorbasis und Verfahren zu seiner Herstellung A semiconductor device comprising anisotropically thermally conductive radiator base, and process for its preparation |
| 05/05/2011 | DE10133369B4 Elektroden mit Konzentrationsprofil für Plasmaanzeigeplatte Electrodes with concentration profile for plasma display panel |
| 05/05/2011 | DE10055280B4 Phasenverschiebungs-Photomaskenrohling, Phasenverschiebungs-Photomaske und Verfahren zur Herstellung von Halbleiterbauelementen Phase shift photomask blank, phase shift photomask and method for the production of semiconductor devices |
| 05/05/2011 | DE10032282B4 Lithografisches Belichtungs- und Strukturierungsverfahren unter Verwendung einer Antireflexionsschicht A lithographic exposure and patterning process using an antireflection film |
| 05/05/2011 | CA2764900A1 Method for manufacturing silicon carbide substrate and silicon carbide substrate |
| 05/05/2011 | CA2759852A1 Method for manufacturing silicon carbide substrate and silicon carbide substrate |
| 05/05/2011 | CA2758157A1 Bonding unit control unit and multi-layer bonding method |
| 05/04/2011 | EP2317555A2 Production method of a semiconductor device |
| 05/04/2011 | EP2317554A1 Method of manufacturing an integrated semiconductor substrate structure |
| 05/04/2011 | EP2317546A1 Method of making a support structure |
| 05/04/2011 | EP2317545A1 Substrate transport system and method |
| 05/04/2011 | EP2317544A1 Semiconductor device |
| 05/04/2011 | EP2317543A2 Gas for plasma reaction, process for producing the same and use |
| 05/04/2011 | EP2317542A1 Semiconductor device and method of manufacturing thereof |
| 05/04/2011 | EP2317541A2 A method of manufacturing semiconductor device |
| 05/04/2011 | EP2317384A2 Reflective mask blank, reflective mask and methods of producing the mask blank and the mask |
| 05/04/2011 | EP2317383A2 Reflective mask blank, reflective mask and methods of producing the mask blank and the mask |
| 05/04/2011 | EP2317382A2 Reflective mask blank, reflective mask and methods of producing the mask blank and the mask |
| 05/04/2011 | EP2317330A1 Pin connector and chip test fixture having the same |
| 05/04/2011 | EP2316989A2 Non-polar (Al, B, In, Ga) quantum well and heterostructure materials and devices |
| 05/04/2011 | EP2316986A1 Chemical vapor deposition system |
| 05/04/2011 | EP2316614A1 Polishing pad and method for manufacturing the polishing pad |
| 05/04/2011 | EP2316253A2 A composite showerhead electrode assembly for a plasma processing apparatus |
| 05/04/2011 | EP2316252A1 Plasma source and methods for depositing thin film coatings using plasma enhanced chemical vapor deposition |
| 05/04/2011 | EP2316139A2 Semiconductor device, light emitting device and method of manufacturing the same |
| 05/04/2011 | EP2316129A2 Enhanced reliability for semiconductor devices using dielectric encasement |
| 05/04/2011 | EP2316127A1 Method and system for detecting micro-cracks in wafers |
| 05/04/2011 | EP2316126A1 Transistor with gain variation compensation |
| 05/04/2011 | EP2316125A2 Phosphorous-comprising dopants and methods for forming phosphorous-doped regions in semiconductor substrates using phosphorous-comprising dopants |
| 05/04/2011 | EP2315638A1 Multi-element metal powders for silicon solar cells |
| 05/04/2011 | EP2232526B1 Method and device for treating silicon wafers |
| 05/04/2011 | EP2223006B1 Miniature gas cabinet |
| 05/04/2011 | EP1959487B1 Surface roughness tester |
| 05/04/2011 | EP1818723B1 Composition for forming antireflection film, layered product, and method of forming resist pattern |
| 05/04/2011 | EP1726419B1 Process for producing a ceramic sheet |
| 05/04/2011 | EP1565946B1 Transistors having buried p-type layers beneath the source region and methods of fabricating the same |
| 05/04/2011 | EP1561240B1 Organic light emitting materials and devices |
| 05/04/2011 | EP1369708B1 Method of producing an optical member for a projection aligner |
| 05/04/2011 | EP1254482B1 Method of manufacturing a bipolar transistor |
| 05/04/2011 | EP1186030B1 Capacitor for a semiconductor arrangement and method for producing a dielectric layer for the capacitor |
| 05/04/2011 | CN201820751U Passive device capsulation structure of single-ring pin with multiple exposed base islands |
| 05/04/2011 | CN201820745U Cutting type split die for IC products |
| 05/04/2011 | CN201820744U Solid crystal machine |
| 05/04/2011 | CN201820743U Shaping device of encapsulating device |
| 05/04/2011 | CN201816199U Control system of toggle-joint plastic encapsulating press |
| 05/04/2011 | CN201815509U Cleaning device and exhaust device with same |
| 05/04/2011 | CN1996151B Circuit pattern exposure method and mask |
| 05/04/2011 | CN1983545B Capillary for a bonding tool |
| 05/04/2011 | CN1964050B Non-volatile memory device and fabrication method thereof |
| 05/04/2011 | CN1956899B Substrate reception container, substrate reception body, and substrate conveyance device |
| 05/04/2011 | CN1937189B Method for attaching an optical filter to an encapsulated package |
| 05/04/2011 | CN1922719B Semiconductor device and method of manufacturing a semiconductor device |
| 05/04/2011 | CN1901149B Semiconductor device and method of manufacturing the same |
| 05/04/2011 | CN1892438B Lithographic apparatus and device manufacturing method |
| 05/04/2011 | CN1870276B Semiconductor device and manufacturing method of the same |
| 05/04/2011 | CN1862376B Mask blank transparent substrate manufacturing method, mask blank manufacturing method, and exposure mask manufacturing method |
| 05/04/2011 | CN1840602B Method for preparing a polishing slurry having high dispersion stability |
| 05/04/2011 | CN1744314B Semiconductor device having laminated structure and manufacturing method |
| 05/04/2011 | CN1697187B Semiconductor integrated circuit, semiconductor device, and method of manufacturing semiconductor integrated circuit |
| 05/04/2011 | CN1649181B Self-supported nitride semiconductor substrate and its production method, and light-emitting nitride semiconductor device using it |
| 05/04/2011 | CN1525393B Intelligent label, and cotainer with the same |
| 05/04/2011 | CN102047462A Method to control deposition of organic molecules and organic electronic device |
| 05/04/2011 | CN102047430A Field effect transistor and method for manufacturing the same |
| 05/04/2011 | CN102047426A Semiconductor device and manufacturing method thereof |
| 05/04/2011 | CN102047424A Semiconductor structures |
| 05/04/2011 | CN102047413A Substrate for power module, power module, and method for producing substrate for power module |
| 05/04/2011 | CN102047412A Three-dimensional semiconductor device structures and methods |
| 05/04/2011 | CN102047411A Semiconductor device and method for manufacturing the same |
| 05/04/2011 | CN102047410A Nitrogen-plasma surface treatment in a direct bonding method |
| 05/04/2011 | CN102047409A Methods of providing electrical isolation and semiconductor structures including same |
| 05/04/2011 | CN102047408A Apparatus and method for attaching sheet |
| 05/04/2011 | CN102047407A Processing chamber |
| 05/04/2011 | CN102047406A Vacuum processing apparatus, vacuum processing method, and manufacturing method of an electronic device |
| 05/04/2011 | CN102047405A Method to create three-dimensional images of semiconductor structures using a focused ion beam device and a scanning electron microscope |
| 05/04/2011 | CN102047404A Semiconductor device, flip-chip mounting method and flip-chip mounting apparatus |
| 05/04/2011 | CN102047403A Electronic device and method of manufacturing an electronic device |
| 05/04/2011 | CN102047402A Method for manufacturing an electronic device |
| 05/04/2011 | CN102047401A 粘结膜 Adhesive film |
| 05/04/2011 | CN102047400A Wire payout measurement and calibration techniques for a wire bonding machine |
| 05/04/2011 | CN102047399A Separating device and separating method for electronic component manufacture |
| 05/04/2011 | CN102047398A Bonded structure and bonding method for bonded structure |
| 05/04/2011 | CN102047397A Method for joining substrate and object to be mounted using solder paste |