Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2011
05/05/2011US20110104887 Semiconductor element and method of manufacturing the same
05/05/2011US20110104886 Manufacturing method of semiconductor package
05/05/2011US20110104885 Method for treating a metal oxide layer
05/05/2011US20110104884 Hot edge ring with sloped upper surface
05/05/2011US20110104883 Method of fabricating semiconductor device
05/05/2011US20110104882 Method for processing semiconductor device
05/05/2011US20110104881 Method of reducing wordline shorting
05/05/2011US20110104880 Corner rounding in a replacement gate approach based on a sacrificial fill material applied prior to work function metal deposition
05/05/2011US20110104879 Method of manufacturing semiconductor device and substrate processing apparatus
05/05/2011US20110104878 Semiconductor device comprising nmos and pmos transistors with embedded si/ge material for creating tensile and compressive strain
05/05/2011US20110104877 Compositions and Methods for Forming a Semiconducting and/or Silicon-Containing Film, and Structures Formed Therefrom
05/05/2011US20110104876 Atmospheric pressure chemical vapor deposition method for producing a n-semiconductive metal sulfide thin layer
05/05/2011US20110104875 Selective silicon etch process
05/05/2011US20110104874 Energy Ray-Curable Polymer, an Energy Ray-Curable Adhesive Composition, an Adhesive Sheet and a Processing Method of a Semiconductor Wafer
05/05/2011US20110104873 Dicing/die bonding film
05/05/2011US20110104872 Method of manufacturing a semiconductor device having a heat spreader
05/05/2011US20110104871 Method for manufacturing bonded substrate
05/05/2011US20110104870 Method for manufacturing bonded wafer
05/05/2011US20110104869 Three-dimensional semiconductor memory device and method of fabricating the same
05/05/2011US20110104868 Method of forming semiconductor device
05/05/2011US20110104867 Fabricating vias of different size of a semiconductor device by splitting the via patterning process
05/05/2011US20110104866 Enhanced adhesion of pecvd carbon on dielectric materials by providing an adhesion interface
05/05/2011US20110104865 Method of fabricating a semiconductor device
05/05/2011US20110104864 Method of fabricating semiconductor device
05/05/2011US20110104863 Transistor including a high-k metal gate electrode structure formed prior to drain/source regions on the basis of a sacrificial carbon spacer
05/05/2011US20110104862 Method of forming semiconductor device and semiconductor device
05/05/2011US20110104861 Integrated complementary low voltage rf-ldmos
05/05/2011US20110104860 Semiconductor nanowire with built-in stress
05/05/2011US20110104859 Manufacturing method of semiconductor device
05/05/2011US20110104858 Method of manufacturing semiconductor element mounted wiring board
05/05/2011US20110104857 Packaged microdevices and methods for manufacturing packaged microdevices
05/05/2011US20110104856 Method of making a semiconductor chip assembly with a post/base/post heat spreader
05/05/2011US20110104855 Method of making a semiconductor chip assembly with a post/base heat spreader with an ESD protection layer
05/05/2011US20110104854 Method and leadframe for packaging integrated circuits
05/05/2011US20110104853 Method of forming semiconductor package
05/05/2011US20110104852 Semiconductor memory device and manufacturing method thereof
05/05/2011US20110104851 Semiconductor Device and Manufacturing Method Thereof
05/05/2011US20110104848 Hot wire chemical vapor deposition (cvd) inline coating tool
05/05/2011US20110104846 Thermoelectric 3D Cooling
05/05/2011US20110104845 Production method of mems sensor
05/05/2011US20110104844 Method for fabricating micro-electro-mechanical system (mems) device
05/05/2011US20110104841 Mask level reduction for mofet
05/05/2011US20110104832 Method for producing a field-emitter array with controlled apex sharpness
05/05/2011US20110104831 Deletable nanotube circuit
05/05/2011US20110104830 Apparatus for inspection with electron beam, method for operating same, and method for manufacturing semiconductor device using former
05/05/2011US20110104828 Method for making microstructures by converting porous silicon into porous metal or ceramics
05/05/2011US20110104817 Integrated micro device, a method for detecting biomarkers using the integrated micro device, a method for manufacturing an integrated micro device, and an integrated micro device arrangement
05/05/2011US20110104610 Positive photosensitive composition and pattern forming method using the same
05/05/2011US20110104480 Targets and processes for fabricating same
05/05/2011US20110104034 Hydride compounds
05/05/2011US20110103923 Substrate processing apparatus
05/05/2011US20110103418 Superluminescent diodes by crystallographic etching
05/05/2011US20110103148 Normally off gallium nitride field effect transistors (FET)
05/05/2011US20110103146 Memory device of the electrically erasable and programmable type, having two cells per bit
05/05/2011US20110103136 Semiconductor memory device
05/05/2011US20110103133 Memory cell array, nonvolatile storage device, memory cell, and method of manufacturing memory cell array
05/05/2011US20110103129 Variable-resistance material memories, processes of forming same, and methods of using same
05/05/2011US20110103125 Memory cells having a folded digit line architecture
05/05/2011US20110103030 Packages and Methods for Mitigating Plating Stub Effects
05/05/2011US20110102965 Bipolar electrostatic chuck
05/05/2011US20110102947 Magnetoresistance device
05/05/2011US20110102755 Method of manufacturing semiconductor devices and exposure apparatus
05/05/2011US20110102715 Liquid crystal display device and method of fabricating the same
05/05/2011US20110102694 Mother substrate for liquid crystal display and manufacturing method thereof
05/05/2011US20110102402 Organic light emitting display and method of manufacturing the same
05/05/2011US20110102019 Semiconductor device formed on a soi substrate
05/05/2011US20110101852 Light-emitting device and method of manufacturing the same
05/05/2011US20110101545 Integrated circuit packaging system with bond pad and method of manufacture thereof
05/05/2011US20110101544 Semiconductor device and method for manufacturing the same
05/05/2011US20110101542 Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof
05/05/2011US20110101539 Semiconductor device and manufacturing method of semiconductor device
05/05/2011US20110101538 Creation of vias and trenches with different depths
05/05/2011US20110101537 Hybrid bonding interface for 3-dimensional chip integration
05/05/2011US20110101534 Automated short length wire shape strapping and methods of fabricting the same
05/05/2011US20110101533 Integrated (multilayer) circuits and process of producing the same
05/05/2011US20110101528 Semiconductor device and method of fabricating the same
05/05/2011US20110101527 Mechanisms for forming copper pillar bumps
05/05/2011US20110101525 Semiconductor device with trench-like feed-throughs
05/05/2011US20110101522 Multichip semiconductor device, chip therefor and method of formation thereof
05/05/2011US20110101520 Semiconductor Die Contact Structure and Method
05/05/2011US20110101518 Semiconductor Device and Method of Forming Column Interconnect Structure to Reduce Wafer Stress
05/05/2011US20110101517 Molded semiconductor package having a filler material
05/05/2011US20110101516 Microelectronic package and method of manufacturing same
05/05/2011US20110101512 Semiconductor Package and Method of Mounting Semiconductor Die to Opposite Sides of TSV Substrate
05/05/2011US20110101511 Power semiconductor package
05/05/2011US20110101510 Board on chip package substrate and manufacturing method thereof
05/05/2011US20110101508 Resist pattern thickening material, semiconductor device, and production method thereof
05/05/2011US20110101507 Method and structure for reworking antireflective coating over semiconductor substrate
05/05/2011US20110101506 Stress Memorization Technique Using Silicon Spacer
05/05/2011US20110101503 Hyperbranched polymer synthesizing method, hyperbranched polymer, resist composition, semiconductor integrated circuit, and semiconductor integrated circuit fabrication method
05/05/2011US20110101501 Semiconductor device including semiconductor zones and manufacturing method
05/05/2011US20110101500 Junction field effect transistor
05/05/2011US20110101499 Semiconductor device and method for fabricating the same
05/05/2011US20110101497 Method for fabricating a flip-bonded dual-substrate inductor, flip-bonded dual-substrate inductor, and integrated passive device including a flip-bonded dual-substrate inductor
05/05/2011US20110101496 Four-terminal antifuse structure having integrated heating elements for a programmable circuit
05/05/2011US20110101490 Contoured insulator layer of silicon-on-insulator wafers and process of manufacture
05/05/2011US20110101488 Semiconductor device and fabrication method thereof
05/05/2011US20110101487 Crack resistant circuit under pad structure and method of manufacturing the same
05/05/2011US20110101486 Bipolar transistor
05/05/2011US20110101485 Detector for Plastic Optical Fiber Networks