| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/27/2011 | CN102034737A Making method of metal interconnection layer |
| 04/27/2011 | CN102034736A Photoetching method of contact hole |
| 04/27/2011 | CN102034735A Method for improving uniformity of characteristic dimension of connecting hole |
| 04/27/2011 | CN102034734A Method for manufacturing self-alignment metal interconnection wire |
| 04/27/2011 | CN102034733A Interconnecting structure and forming method thereof |
| 04/27/2011 | CN102034732A Attraction member, and attraction device and charged particle beam apparatus using the same |
| 04/27/2011 | CN102034731A Substrate processing apparatus and substrate transfer method |
| 04/27/2011 | CN102034730A Substrate processing apparatus |
| 04/27/2011 | CN102034729A Adhesive tape joining apparatus |
| 04/27/2011 | CN102034728A Positioning transmission apparatus |
| 04/27/2011 | CN102034727A Substrate processing apparatus |
| 04/27/2011 | CN102034726A Process module, substrate processing apparatus and substrate transfer method |
| 04/27/2011 | CN102034725A Automatic substrate positioning and loading device |
| 04/27/2011 | CN102034724A Method for determining dielectric constant value of fluoride silicon glass in actual process |
| 04/27/2011 | CN102034723A Method and device for wire bonding |
| 04/27/2011 | CN102034722A Mold for PLCC (plastic leaded chip carrier) |
| 04/27/2011 | CN102034721A Method for encapsulating chip |
| 04/27/2011 | CN102034720A Chip packaging method |
| 04/27/2011 | CN102034719A TO-CAN coaxial small-sized packaging method for PIN-FET high-sensitivity detector |
| 04/27/2011 | CN102034718A Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP |
| 04/27/2011 | CN102034717A Packaging method for radio frequency card |
| 04/27/2011 | CN102034716A 芯片接合装置 Chip bonding device |
| 04/27/2011 | CN102034715A Method for producing power MOSFET (metal-oxide-semiconductor field effect transistor) |
| 04/27/2011 | CN102034714A Methods for forming isolated fin structures on bulk semiconductor material |
| 04/27/2011 | CN102034713A Manufacturing method of semiconductor device |
| 04/27/2011 | CN102034712A Direct contact in trench with three-mask shield gate process |
| 04/27/2011 | CN102034711A Method for manufacturing transistor with lightly doped drain structure |
| 04/27/2011 | CN102034710A Gate pre-doping method of semiconductor device |
| 04/27/2011 | CN102034709A Method for amplifying process window of PMOS (P-channel metal oxide semiconductor) core device |
| 04/27/2011 | CN102034708A Manufacturing method of trench DMOS (double-diffused metal oxide semiconductor) transistor |
| 04/27/2011 | CN102034707A Method for manufacturing IGBT |
| 04/27/2011 | CN102034706A Method for controlling growth effect of facet of silicon-germanium (Si-Ge) alloy |
| 04/27/2011 | CN102034705A Processing technology for reducing large-current diode stress |
| 04/27/2011 | CN102034704A Method for improving etching selection ratio of etched hard mask oxidation layer to etched silicon nitride layer |
| 04/27/2011 | CN102034703A Grinding method |
| 04/27/2011 | CN102034702A Method of manufacturing semiconductor device and substrate processing apparatus |
| 04/27/2011 | CN102034701A Method for forming dielectric layer and polishing method |
| 04/27/2011 | CN102034700A Method of recycling silicon component for plasma etching apparatus and silicon component for plasma etching apparatus |
| 04/27/2011 | CN102034699A Polishing method |
| 04/27/2011 | CN102034698A Silicon wafer manufacturing method |
| 04/27/2011 | CN102034697A Method for polishing semiconductor wafers |
| 04/27/2011 | CN102034696A Workpiece dividing method |
| 04/27/2011 | CN102034695A Enhanced method of forming nickel silicide |
| 04/27/2011 | CN102034694A Method for forming integrated circuit |
| 04/27/2011 | CN102034693A Method for preparing stress-free GaN thick film on sapphire patterned substrate |
| 04/27/2011 | CN102034692A Method for transplanting silicon carbide (SiC) thin layer onto other substrates |
| 04/27/2011 | CN102034691A Method for applying deep-UV photoresist to wet etching |
| 04/27/2011 | CN102034690A Pretreatment method for electronic packaging |
| 04/27/2011 | CN102034689A Method of forming integrated circuit structure |
| 04/27/2011 | CN102034688A Method of protecting an integrated circuit chip against spying by laser attacks |
| 04/27/2011 | CN102034687A Process for bonding and transferring layer |
| 04/27/2011 | CN102034686A Capacitor and forming method thereof |
| 04/27/2011 | CN102034685A Method for using post-epitaxial photoetching to align zero-level marks |
| 04/27/2011 | CN102034684A Device and method for introducing multi-gradient temperature field in laser annealing process of silicon wafer |
| 04/27/2011 | CN102034683A Laser repairing stand |
| 04/27/2011 | CN102034682A Laser irradiation system and laser irradiation method |
| 04/27/2011 | CN102034681A Method for repairing surface scratches of wafer |
| 04/27/2011 | CN102034680A Drying method of wafer |
| 04/27/2011 | CN102034679A Wafer cleaning method |
| 04/27/2011 | CN102034678A Vaccum processing apparatus |
| 04/27/2011 | CN102034665A An ion implantation device and a method of semiconductor manufacturing by the implantation of boron hydride cluster ions |
| 04/27/2011 | CN102034538A Charge trapping memory and manufacturing method thereof |
| 04/27/2011 | CN102033979A Optimizing bias points for a semiconductor device |
| 04/27/2011 | CN102033971A Design method of circuit patterns and rapid thermal annealing method of semiconductor device |
| 04/27/2011 | CN102033423A Device and method for calibrating photoetching tool |
| 04/27/2011 | CN102033420A Photomask, photomask manufacturing method, pattern transfer method and method for manufacturing liquid crystal display device |
| 04/27/2011 | CN102033379A 液晶显示器与其制造方法 LCD monitors its manufacturing method |
| 04/27/2011 | CN102033376A Fringe field switching mode liquid crystal display device and method of fabricating the same |
| 04/27/2011 | CN102033374A Thin film transistor-liquid crystal display (TFT-LCD) array substrate, manufacturing method and disconnection maintenance method |
| 04/27/2011 | CN102033372A TFT-LCD array substrate and manufacturing, detecting and driving methods thereof |
| 04/27/2011 | CN102033371A Array substrate and manufacturing method thereof |
| 04/27/2011 | CN102033370A Liquid crystal display substrate and manufacturing method thereof |
| 04/27/2011 | CN102033367A Display substrate and manufacturing method thereof |
| 04/27/2011 | CN102033365A Fringe field switching mode liquid crystal display device and method of fabricating the same |
| 04/27/2011 | CN102033345A Manufacture method of liquid crystal display and array baseplate |
| 04/27/2011 | CN102033343A Array substrate and manufacturing method thereof |
| 04/27/2011 | CN102033332A Optical modulator utilizing wafer bonding technology |
| 04/27/2011 | CN102033076A Inspection device and inspection method |
| 04/27/2011 | CN102033071A Application state inspecting method |
| 04/27/2011 | CN102031567A Heat processing apparatus and cooling method |
| 04/27/2011 | CN102031557A Epitaxial wafer and production method thereof |
| 04/27/2011 | CN102031554A Online monitoring method for electroplating process stability |
| 04/27/2011 | CN102031525A Method for etching deep through silicon via (TSV) |
| 04/27/2011 | CN102031501A Method for selectively depositing thin film on substrate by utilizing atomic layer deposition |
| 04/27/2011 | CN102031498A Substrate support seat for III-V group thin film growth reaction chamber, reaction chamber thereof and process treatment method |
| 04/27/2011 | CN102031204A Cleaning composition, cleaning process, and process for producing semiconductor device |
| 04/27/2011 | CN102031072A Pressure-sensitive adhesive sheet for retaining elements and method of producing elements |
| 04/27/2011 | CN102031070A Thin sheet adhesive agent and adhesive tape for processing wafer |
| 04/27/2011 | CN102030471A Low-temperature cofiring glass and ceramic multilayer microcircuit substrate and preparation method thereof |
| 04/27/2011 | CN102029655A Film for semiconductor apparatus |
| 04/27/2011 | CN102029573A Method for grinding semiconductor wafer |
| 04/27/2011 | CN102029572A Control method of CMP (chemical mechanical polishing) time |
| 04/27/2011 | CN102029571A Polishing pad and application and manufacturing method thereof |
| 04/27/2011 | CN101814430B Method for preparing composite trapping layer of floating gate type nonvolatile memory |
| 04/27/2011 | CN101740502B Light sensitive component array forming method of mercury cadmium telluride micro-table-board infrared detection chip |
| 04/27/2011 | CN101740448B Plasma processing equipment and substrate support plate thereof |
| 04/27/2011 | CN101719464B Method for preparing ultra-shallow junction on surface of semiconductor chip through laser |
| 04/27/2011 | CN101685801B Method for making storage electrode with stacked capacitor |
| 04/27/2011 | CN101685781B Method for manufacturing packaging substrate |
| 04/27/2011 | CN101675504B Method for etching glass or metal substrates using negative photoresist and method for fabricating cliche using the same |