| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 05/11/2011 | CN102054854A Organic electroluminescent display device and method of fabricating the same |
| 05/11/2011 | CN102054853A 相变随机存取存储器及制造方法 Phase change random access memory and a method of manufacturing |
| 05/11/2011 | CN102054852A Light-emitting diode and manufacturing method thereof |
| 05/11/2011 | CN102054851A Light-emitting diode (LED) and manufacturing method thereof |
| 05/11/2011 | CN102054848A Photodetector array having electron lens |
| 05/11/2011 | CN102054846A Thin film transistor substrate and method for fabricating the same |
| 05/11/2011 | CN102054845A Radio frequency laterally diffused metal oxide semiconductor (LDMOS) device based on silicon on insulator (SOI) and method for injecting device |
| 05/11/2011 | CN102054844A Nonvolatile memory and manufacturing method thereof |
| 05/11/2011 | CN102054843A Unit structure for OTP (one time programmable) device and manufacturing method thereof |
| 05/11/2011 | CN102054842A SONOS (silicon oxide nitride oxide) flash memory component and manufacturing method thereof |
| 05/11/2011 | CN102054841A NAND gate flash memory and manufacturing method thereof |
| 05/11/2011 | CN102054839A Metal oxide semiconductor (MOS) field effect transistor (FET) structure and preparation method thereof |
| 05/11/2011 | CN102054833A 薄膜晶体管基板及其制造方法 The thin film transistor substrate and a method of manufacturing |
| 05/11/2011 | CN102054827A Light-emitting diode wafer encapsulation body and encapsulation method thereof |
| 05/11/2011 | CN102054821A Packaging structure with internal shield and manufacturing method thereof |
| 05/11/2011 | CN102054820A Semiconductor device with buried bit lines and method for fabricating the same |
| 05/11/2011 | CN102054819A Semiconductor device with buried gates and buried bit lines and method for fabricating the same |
| 05/11/2011 | CN102054818A Interconnection structure and manufacture method thereof |
| 05/11/2011 | CN102054817A Antifuse and method of making the antifuse |
| 05/11/2011 | CN102054816A Fusing method for fuse wire |
| 05/11/2011 | CN102054814A Non-core layer package substrate and manufacturing method thereof |
| 05/11/2011 | CN102054813A Encapsulation substrate unit bodies with plated through holes and manufacturing method thereof |
| 05/11/2011 | CN102054812A Device and manufacturing method |
| 05/11/2011 | CN102054806A Thermal conductive substrate and manufacturing method thereof |
| 05/11/2011 | CN102054804A Cu/Mo/Cu heat sink material and preparation method thereof |
| 05/11/2011 | CN102054795A Flip chip package and method of manufacturing the same |
| 05/11/2011 | CN102054794A Electronic device and fabrication method thereof |
| 05/11/2011 | CN102054793A Substrate member, module, electric equipment, and manufacturing method of modules |
| 05/11/2011 | CN102054792A Carrier tape for tab-package and manufacturing method thereof |
| 05/11/2011 | CN102054791A Electronic device, method of producing the same, and semiconductor device |
| 05/11/2011 | CN102054790A Semiconductor element and method for forming the same |
| 05/11/2011 | CN102054789A Semiconductor device and method of manufacturing semiconductor device |
| 05/11/2011 | CN102054788A Circuitry component |
| 05/11/2011 | CN102054787A Stack type package structure and manufacture method thereof |
| 05/11/2011 | CN102054786A Method for preparing nonepitaxial high-voltage BCD (Binary Coded Decimal) device |
| 05/11/2011 | CN102054785A Manufacturing method of high-voltage BCD semiconductor device |
| 05/11/2011 | CN102054784A Method for forming semiconductor structure |
| 05/11/2011 | CN102054783A Anneal manufacturing method of SONOS (silicon-oxide-nitride-oxide-silicon) flash memory device by using mixture gas of ND3 and N2 |
| 05/11/2011 | CN102054782A Method for etching interpoly dielectric |
| 05/11/2011 | CN102054781A Vertical flash memory structure and manufacturing method thereof |
| 05/11/2011 | CN102054780A Method for improving performance of nonvolatile memory |
| 05/11/2011 | CN102054779A Method for forming shallow trench isolation structure |
| 05/11/2011 | CN102054778A Manufacture method of complementary metal oxide semiconductor structure |
| 05/11/2011 | CN102054777A Method for manufacturing semiconductor device |
| 05/11/2011 | CN102054776A Method for manufacturing stress memorization effect semiconductor device |
| 05/11/2011 | CN102054775A Method for manufacturing semiconductor structure |
| 05/11/2011 | CN102054774A VDMOS (vertical double diffused metal oxide semiconductor) transistor compatible LDMOS (laterally diffused metal oxide semiconductor) transistor and manufacturing method thereof |
| 05/11/2011 | CN102054773A Transflective thin film transistor panel and manufacturing method thereof |
| 05/11/2011 | CN102054772A Preparation method for monolithic integration light detector array with multiple wavelength processing function |
| 05/11/2011 | CN102054771A Method for manufacturing complementary metal-oxide semiconductor (CMOS) image sensor |
| 05/11/2011 | CN102054770A Method for manufacturing complementary metal-oxide semiconductor (CMOS) image sensor |
| 05/11/2011 | CN102054769A Forming method of complementary metal oxide semiconductor (CMOS) structure |
| 05/11/2011 | CN102054768A Manufacturing method of pixel structure and manufacturing method of contact window opening |
| 05/11/2011 | CN102054767A Method of laser lift-off for light-emitting diode |
| 05/11/2011 | CN102054766A Semiconductor device and method for manufacturing the same |
| 05/11/2011 | CN102054765A Method for forming fuse structure |
| 05/11/2011 | CN102054764A Method for manufacturing rectangular hole of semiconductor device by using KrF process and other processes |
| 05/11/2011 | CN102054763A Method for manufacturing semiconductor device |
| 05/11/2011 | CN102054762A Semiconductor structure and method for forming dual-damascene structure |
| 05/11/2011 | CN102054761A Semiconductor structure and method for forming dual-damascene structure |
| 05/11/2011 | CN102054760A Method for forming copper interconnection structure |
| 05/11/2011 | CN102054759A Method for forming copper interconnection structure |
| 05/11/2011 | CN102054758A Method for forming tungsten plug |
| 05/11/2011 | CN102054757A Manufacture method of integrated circuit copper interconnection structure |
| 05/11/2011 | CN102054756A Copper interconnection structure and formation method thereof |
| 05/11/2011 | CN102054755A Interconnecting structure and formation method thereof |
| 05/11/2011 | CN102054754A Manufacturing method for metal interconnection line |
| 05/11/2011 | CN102054753A Manufacturing method for dual-inlay structure |
| 05/11/2011 | CN102054752A Method for manufacturing silicon through hole |
| 05/11/2011 | CN102054751A Dual-inlay structure and forming method thereof |
| 05/11/2011 | CN102054750A Method for forming interconnecting structure |
| 05/11/2011 | CN102054749A Semiconductor device and manufacturing method thereof |
| 05/11/2011 | CN102054748A Formation method of copper interconnection and processing method of dielectric layer |
| 05/11/2011 | CN102054747A Metal layer treatment method |
| 05/11/2011 | CN102054746A Forming method of silicon through hole interconnection structure |
| 05/11/2011 | CN102054745A Method for forming contact hole |
| 05/11/2011 | CN102054744A Method for manufacturing electric conduction plug |
| 05/11/2011 | CN102054743A Method for forming contact hole in semiconductor device |
| 05/11/2011 | CN102054742A Semiconductor porefilling method for three-step power deposition aluminum |
| 05/11/2011 | CN102054741A Method of forming integrated circuit structure |
| 05/11/2011 | CN102054740A Semiconductor device and fabrication method thereof |
| 05/11/2011 | CN102054739A Method for forming shallow groove isolation |
| 05/11/2011 | CN102054738A Control method for shallow groove isolation step height |
| 05/11/2011 | CN102054737A Method for manufacturing wide and deep trenches by medium filling |
| 05/11/2011 | CN102054736A Filling method of high aspect ratio groove isolation area |
| 05/11/2011 | CN102054735A Method for filling high-aspect ratio groove isolation area |
| 05/11/2011 | CN102054734A Method for improving filling capacity of wafer channel |
| 05/11/2011 | CN102054733A Method for forming shallow trench isolation (STI) structure |
| 05/11/2011 | CN102054732A Substrate for wafer arrangement before grain cutting |
| 05/11/2011 | CN102054731A Turntable positioning mechanism for copper feet turning mechanism of automatic pipe core welding device |
| 05/11/2011 | CN102054730A Lead frame transporting device of and method for adhering chip |
| 05/11/2011 | CN102054729A Five tube-type silicon chip conveying device |
| 05/11/2011 | CN102054728A Substrate adsorption unit and substrate adsorption assembly |
| 05/11/2011 | CN102054727A Die for arranging crystal grains |
| 05/11/2011 | CN102054726A System and method of flexibly transmitting semiconductor component in high speed |
| 05/11/2011 | CN102054725A System and method for overhead cross-system transportation |
| 05/11/2011 | CN102054724A Method and device for detecting wafer surface defects |
| 05/11/2011 | CN102054723A Method for detecting doping defects of MOS (Metal Oxide Semiconductor) device |
| 05/11/2011 | CN102054722A Method for detecting defects of curve metal wire |
| 05/11/2011 | CN102054721A Method and device for detecting coating condition of semiconductor wafer surface coating |