| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 05/12/2011 | US20110108875 Light-emitting device and method for producing same |
| 05/12/2011 | US20110108867 Light-emitting device and method for manufacturing the same |
| 05/12/2011 | US20110108863 Method for manufacturing an electro-optical device |
| 05/12/2011 | US20110108861 Process for anisotropic etching of semiconductors |
| 05/12/2011 | US20110108855 Method of forming vias in silicon carbide and resulting devices and circuits |
| 05/12/2011 | US20110108854 Substantially lattice matched semiconductor materials and associated methods |
| 05/12/2011 | US20110108850 Method of manufacturing an integrated semiconductor substrate structure |
| 05/12/2011 | US20110108849 Tft-lcd pixel unit and method for manufacturing the same |
| 05/12/2011 | US20110108847 Thin film transistor, method of fabricating the same, organic light emitting diode display device having the same, and method of fabricating the same |
| 05/12/2011 | US20110108843 Collections of laterally crystallized semiconductor islands for use in thin film transistors |
| 05/12/2011 | US20110108842 Display device and electronic apparatus |
| 05/12/2011 | US20110108841 Semiconductor device, manufacturing method thereof, and display apparatus using the semiconductor device |
| 05/12/2011 | US20110108839 Thin Film Transistor Substrate and Manufacturing Method Thereof |
| 05/12/2011 | US20110108838 Electro-mechanical transducer, an electro-mechanical converter, and manufacturing methods of the same |
| 05/12/2011 | US20110108837 Semiconductor device and manufacturing method thereof |
| 05/12/2011 | US20110108832 Liquid crystal display device and method for fabricating the same |
| 05/12/2011 | US20110108831 Organic light emitting display device and method of manufacturing the same |
| 05/12/2011 | US20110108829 Switching device and method of manufacturing the same |
| 05/12/2011 | US20110108815 Multi-rate resist method to form organic tft contact and contacts formed by same |
| 05/12/2011 | US20110108802 Metal-Free Integrated Circuits Comprising Graphene and Carbon Nanotubes |
| 05/12/2011 | US20110108801 Single-crystal semiconductor layer with heteroatomic macro-network |
| 05/12/2011 | US20110108799 Nanoparticles |
| 05/12/2011 | US20110108793 Junctions comprising molecular bilayers for the use in electronic devices |
| 05/12/2011 | US20110108792 Single Crystal Phase Change Material |
| 05/12/2011 | US20110108742 System and method for handling multiple workpieces for matrix configuration processing |
| 05/12/2011 | US20110108729 THz WAVE DETECTOR |
| 05/12/2011 | US20110108709 Backside illuminated image sensor |
| 05/12/2011 | US20110108629 Smart card module with flip-chip-mounted semiconductor chip |
| 05/12/2011 | US20110108534 Method and system for high-speed, precise micromachining an array of devices |
| 05/12/2011 | US20110108524 Local plasma confinement and pressure control arrangement and methods thereof |
| 05/12/2011 | US20110108519 Wet etched insulator and electronic circuit component |
| 05/12/2011 | US20110108311 Multilayer printed wiring board |
| 05/12/2011 | US20110108195 Temperature adjusting mechanism and semiconductor manufacturing Appratus using temperature adjusting mechanism |
| 05/12/2011 | US20110108108 Flash light annealing for thin films |
| 05/12/2011 | US20110108099 Method of forming transparent zinc oxide layers for high efficiency photovoltaic cells |
| 05/12/2011 | US20110108097 Methods of manipulating stressed epistructures |
| 05/12/2011 | US20110108095 Mask material composition, method of forming impurity diffusion layer, and solar battery |
| 05/12/2011 | US20110107595 Semiconductor device |
| 05/12/2011 | DE10238444B4 Verfahren zur Herstellung von vereinzelten monolithisch integrierten Halbleiterschaltungen Process for the preparation of isolated monolithic semiconductor integrated circuits |
| 05/12/2011 | DE10238051B4 Integrierte Flip-Chip-Halbleiterschaltung Integrated flip-chip semiconductor circuit |
| 05/12/2011 | DE102010060229A1 Halbleitervorrichtung mit Halbleiterzonen und Herstellungsverfahren hierfür A semiconductor device comprising semiconductor zones and manufacturing method thereof |
| 05/12/2011 | DE102010047806A1 Integrierte Schaltkreise und Verfahren zum Ausbilden der integrierten Schaltkreise Integrated circuits and methods of forming the integrated circuits |
| 05/12/2011 | DE102010037889A1 Halbleitervorrichtungen und -verfahren Semiconductor devices and methods |
| 05/12/2011 | DE102009053574A1 Method for producing printed circuit board and photovoltaic module, involves continuously extracting accumulated foam and/or accumulated foam-containing process solution, and partially removing foam and/or process solution by filter unit |
| 05/12/2011 | DE102009053255A1 Verfahren zum Herstellen einer Anordnung A method for manufacturing an array |
| 05/12/2011 | DE102009052744A1 Verfahren zur Herstellung einer Halbleiterscheibe A process for producing a semiconductor wafer |
| 05/12/2011 | DE102009052160A1 Smartcard-Modul mit Flip-Chip montiertem Halbleiterchip Smart card module fitted with flip-chip semiconductor chip |
| 05/12/2011 | DE102009051828A1 Ein Halbleiterbauelement und ein Verfahren zur Herstellung eines Halbleiterbauelements A semiconductor device and a method of manufacturing a semiconductor device |
| 05/12/2011 | DE102009051347A1 Verfahren zur Herstellung von Halbleiterschichten Process for preparing semiconductor layers |
| 05/12/2011 | DE102009051345A1 Anordnung umfassend eine transparente elektrisch leitfähige Schicht, Anordnung umfassend eine photoelektrische Vorrichtung und Verfahren zur Herstellung einer transparenten Elektrode Arrangement comprising a transparent electrically conductive layer assembly comprising a photoelectric device and method for producing a transparent electrode, |
| 05/12/2011 | DE102009049705B3 Prüfvorrichtung für eine Photovoltaikmodulplatte, Prüfmittel sowie Verfahren zur Prüfung Tester for a photovoltaic module plate, test equipment and procedures for the |
| 05/12/2011 | DE102009046596A1 Schottkydiode Schottky |
| 05/12/2011 | DE102009046261A1 Transistor mit Metallgateelektrodenstrukturen mit großem ε, die vor Drain/Source-Gebieten auf der Grundlage eines Opferkohlenstoffabstandshalters hergestellt werden Transistor with metal gate electrode structures with large ε, which are made before the drain / source regions on the basis of a sacrificial carbon spacer |
| 05/12/2011 | DE102009046260A1 Halbleiterbauelement mit Austauschgateelektrodenstrukturen mit einer verbesserten Diffusionsbarriere A semiconductor device with replacement gate electrode structures having an improved diffusion barrier |
| 05/12/2011 | DE102009046250A1 Kantenverrundung in einem Austauschgateverfahren auf der Grundlage eines Opferfüllmaterials, das vor der Abscheidung des Austrittsarbeitsmetalls aufgebracht wird Rounding of edges in an exchange gate process on the basis of a sacrificial filler material is applied prior to the deposition of the metal work function |
| 05/12/2011 | DE102009046248A1 Halbleitersicherungen in einem Halbleiterbauelement mit Metallgates Semiconductor fuses in a semiconductor device with metal gates |
| 05/12/2011 | DE102009046245A1 Metallgateelektrodenstrukturen mit großem ε, die durch eine separate Abtragung von Platzhaltermaterialien in Transistoren unterschiedlicher Leitfähigkeitsart hergestellt sind Metal gate electrode structures with large ε, which are produced by a separate ablation wildcard materials in transistors of different conductivity |
| 05/12/2011 | DE102009046242A1 Herstellung von Kontaktdurchführungen mit unterschiedlicher Größe eines Halbleiterbauelements durch Aufteilen des Kontaktlochstrukturierungsprozesses Production of vias with different size of a semiconductor device by dividing the contact hole patterning process |
| 05/12/2011 | DE102009046241A1 Verformungsverstärkung in Transistoren, die eine eingebettete verformungsinduzierende Halbleiterlegierung besitzen, durch Kantenverrundung an der Oberseite der Gateelektrode Deformation amplification in transistors having an embedded strain-inducing semiconductor alloy, by rounding of the edges at the top of the gate electrode |
| 05/12/2011 | DE102009046081A1 Method for manufacturing semiconductor component e.g. pressure sensor, involves connecting partial region of rear side of semiconductor chip with bond pad on carrier substrate, where region is coated with through-contact filling material |
| 05/12/2011 | DE102008052595B4 Verfahren zur Herstellung eines Halbleiterbauelements als High-Electron-Mobility-Transistorhalbleiterbauelement (HEMT) mit feldabschwächender Platte und Halbleiterbauelement A method for manufacturing a semiconductor device as a high-electron-mobility transistor semiconductor device (HEMT) with field-weakening board and semiconductor device |
| 05/12/2011 | DE102006055618B4 Mobiler elektrostatischer Trägerwafer mit elektrisch isoliertem Ladungsspeicher, Anordnung zur Halterung und Verfahren zum Halten und Lösen eines scheibenförmigen Bauteils Mobile electrostatic wafer carrier with an electrically isolated charge storage, arrangement for holding and method for holding and releasing a disc-shaped part |
| 05/12/2011 | DE102006055151B4 Halbleiterbauelement mit Halbleiterzone sowie Verfahren zu dessen Herstellung A semiconductor device with semiconductor region and to processes for the preparation thereof |
| 05/12/2011 | DE102006023257B4 Vorrichtung zum Heissproben von integrierten Halbleiterschaltkreisen auf Wafern An apparatus for hot samples of semiconductor integrated circuits on wafers |
| 05/12/2011 | DE102006019835B4 Transistor mit einem Kanal mit Zugverformung, der entlang einer kristallographischen Orientierung mit erhöhter Ladungsträgerbeweglichkeit orientiert ist Transistor having a channel with a tensile strain, which is oriented along a crystallographic orientation with increased charge carrier mobility |
| 05/12/2011 | DE102005037029B4 Verfahren zur Herstellung eines Halbleiterprodukts und Halbleiterprodukt A method of manufacturing a semiconductor product and semiconductor product |
| 05/12/2011 | DE102005014513B4 Vorrichtung und Verfahren zum Temperieren eines Substrats, sowie Verfahren zur Herstellung der Vorrichtung Apparatus and method for controlling the temperature of a substrate, and to processes for producing the device |
| 05/12/2011 | DE102004060446B4 Verfahren zum Bilden einer Gate-Elektrode in einem nicht volatilen Speicherbauelement A method of forming a gate electrode in a non-volatile memory device |
| 05/12/2011 | DE102004055463B4 Integrierte Schaltungsvorrichtung mit Kondensatorelektroden mit darauf befindlichen Isolier-Spacern und Verfahren zur Herstellung derselben An integrated circuit device comprising capacitor electrodes thereon insulating spacers and method of manufacturing the same |
| 05/12/2011 | CA2779275A1 Resin bonded abrasive |
| 05/12/2011 | CA2778209A1 Method for the self-assembly of electrical, electronic or micromechanical components on a substrate |
| 05/11/2011 | EP2320482A2 Highly efficient gallium nitride based light emitting diodes via surface roughening |
| 05/11/2011 | EP2320468A1 Semiconductor device, method for manufacturing semiconductor device, transistor substrate, light emitting device and display device |
| 05/11/2011 | EP2320465A1 Schottky barrier diode and method for manufacturing schottky barrier diode |
| 05/11/2011 | EP2320461A2 Method for manufacturing cmos image sensor |
| 05/11/2011 | EP2320456A1 Complementary logical gate device |
| 05/11/2011 | EP2320455A1 Method of planarizing for flash memory device fabrication |
| 05/11/2011 | EP2320454A1 Substrate holder and clipping device |
| 05/11/2011 | EP2320453A1 Sensor packaging |
| 05/11/2011 | EP2320452A1 Fast recovery diode and its manufacturing method |
| 05/11/2011 | EP2320451A1 Fast recovery Diode |
| 05/11/2011 | EP2320450A1 Method for manufacturing soi wafer, and soi wafer |
| 05/11/2011 | EP2320426A1 Non-volatile memory memory arrays and methods of operating thereof |
| 05/11/2011 | EP2320338A2 Semiconductor integrated circuit, and method of manufacturing therefor |
| 05/11/2011 | EP2320273A1 Exposure apparatus, exposure method, and method for producing a device |
| 05/11/2011 | EP2319893A1 Photosensitive adhesive composition, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer and semiconductor device using the photosensitive adhesive composition |
| 05/11/2011 | EP2319892A1 Photosensitive adhesive composition, photosensitive film adhesive, adhesive pattern, semiconductor wafer with adhesive, semiconductor device and electronic component |
| 05/11/2011 | EP2319821A1 Stabilization of bicycloheptadiene |
| 05/11/2011 | EP2319815A1 Board holding device, board holding method, and method of manufacturing laminated glass |
| 05/11/2011 | EP2319617A1 Arrays of microparticles and methods of preparation thereof |
| 05/11/2011 | EP2319093A1 Method and arrangement for producing a functional layer on a semiconductor component |
| 05/11/2011 | EP2319083A2 Semiconductor devices with non-punch-through semiconductor channels having enhanced conduction and methods of making |
| 05/11/2011 | EP2319080A1 Three-dimensional cmos circuit on two offset substrates and method for making same |
| 05/11/2011 | EP2319077A1 Body contact for sram cell comprising double-channel transistors |
| 05/11/2011 | EP2319076A1 Substrate for an electronic or electromechanical component and nano-elements |
| 05/11/2011 | EP2319075A1 Through silicon via and method of fabricating same |
| 05/11/2011 | EP2319074A1 A method of initiating molecular bonding |
| 05/11/2011 | EP2319073A1 Thin film imaging method and apparatus |
| 05/11/2011 | EP2319072A1 Method for preparing a self-supporting crystallized silicon thin film |
| 05/11/2011 | EP2319071A1 Method for producing ceramic passivation layers on silicon for solar cell manufacture |