Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2011
06/01/2011DE102009047309A1 Deckschichtenentfernung in einer Metallgateelektrodenstruktur mit großem ε durch Verwendung eines Opferfüllmaterials Top layer distance in a metal gate electrode structure with large ε by using a sacrificial filler
06/01/2011DE102009047307A1 Vergrößerung der Stabilität eines Gatedielektrikums mit großem ε in einem Gatestapel mit großem ε durch eine sauerstoffreiche Titannitriddeckschicht Increasing the stability of a gate dielectric with large ε in a gate stack with large ε by an oxygen-rich Titannitriddeckschicht
06/01/2011DE102009047306A1 Metallgateelektrodenstrukturen mit großem ε, die durch getrennte Entfernung von Platzhaltermaterialien unter Anwendung eines Maskierungsschemas vor der Gatestrukturierung hergestellt sind Metal gate electrode structures with large ε, which are made by separate removal of materials using a wildcard masking regime before gate patterning
06/01/2011DE102009047304A1 Leistungssteigerung in PFET-Transistoren mit einem Metallgatestapel mit großem ε durch Verbessern des Dotierstoffeinschlusses Performance improvement in PFET transistors with metal gate stack with large ε by improving the Dotierstoffeinschlusses
06/01/2011DE102008046188B4 Chip-Leiterplatten-Anordnung und Verfahren zum Herstellen einer Chip-Leiterplatten-Anordnung Chip circuit board assembly and method of manufacturing a chip PCB assembly
06/01/2011DE102008035814B4 Verfahren und System zum Reduzieren der Überlagerungsfehler in der Halbleitermassenproduktion unter Anwendung eines Mischanlagenszenarios A method and system for reducing the overlay error in the semiconductor mass production using a mixing scenarios
06/01/2011DE102008016424B4 Verfahren mit einem Bilden einer Kontaktloshöffnung und eines Grabens in einer dielektrischen Schicht mit kleinem ε A process with a forming a Kontaktloshöffnung and a trench in a dielectric layer with a small ε
06/01/2011DE102007063270B4 Verfahren zur Verringerung zur Erzeugung von Ladungseinfangstellen in Gatedielektrika in MOS-Transistoren durch Ausführen einer Wasserstoffbehandlung A method for reducing the production of Ladungseinfangstellen in gate dielectrics in the MOS transistors by performing a hydrogen treatment
06/01/2011DE102006023682B4 Verfahren zum Herstellen eines Transistors in einem nichtflüchtigen Speicher und nichtflüchtiger Speicher A method of manufacturing a transistor in a non-volatile memory and non-volatile memory
06/01/2011DE10061769B4 Halbleiterspeicherbaustein A semiconductor memory device
06/01/2011CN201853729U Cushion for silicon sticks
06/01/2011CN201853707U Silicon-on-insulator N-type semiconductor combined device capable of increasing current density
06/01/2011CN201853687U Strong tool for sucking crystal grains
06/01/2011CN201853686U SMIF (standard mechanical interface) device
06/01/2011CN201853685U Charging and discharging tool for quartz boat
06/01/2011CN201853684U Patching device
06/01/2011CN201853683U In-line diode crystalline grain testing and grading equipment
06/01/2011CN201853682U Working clamp for realizing lead bonding among surfaces in different directions and lead bonding equipment
06/01/2011CN201853681U Feeding cake stand for mould encapsulation feeding
06/01/2011CN201853680U Substrate processing equipment
06/01/2011CN201853679U Self-cleaning device and baseplate treatment device
06/01/2011CN201848764U Locating ring for chemical mechanical polishing
06/01/2011CN1991585B Salt suitable for an acid generator and a chemically amplified corrosion resistant composition containing the same
06/01/2011CN1969231B Method of forming plated product using negative photoresist composition
06/01/2011CN1944203B Auxiliary moving, loading assembly
06/01/2011CN1934686B Field effect transistor and method of manufacturing a field effect transistor
06/01/2011CN1868048B Method and device for encapsulating electronic components using a flexible pressure element
06/01/2011CN1809444B 基片抛光设备和基片抛光方法 A substrate polishing apparatus and a substrate polishing method
06/01/2011CN1808710B Thin film transistor array panel and method for manufacturing the same
06/01/2011CN1773717B Organic electroluminescent display device having OTFT and method of fabricating the same
06/01/2011CN1728916B Ultra high speed uniform plasma processing system
06/01/2011CN1720110B Pollutant removal method optical element, and exposure method and apparatus
06/01/2011CN1646989B Composition for reflecting hardmask layer and method for forming characteristic of patterned material
06/01/2011CN1469193B Objective table apparatus and exposure apparatus
06/01/2011CN102084727A Temperature adjusting mechanism and semiconductor manufacturing apparatus using the same
06/01/2011CN102084726A Clamped showerhead electrode assembly
06/01/2011CN102084512A Switching element
06/01/2011CN102084504A Nitride semiconductor light emitting element and method for manufacturing same
06/01/2011CN102084503A Light emitting device having remotely located light scattering material
06/01/2011CN102084488A Nanostructured MOS capacitor
06/01/2011CN102084485A Organic thin-film transistor
06/01/2011CN102084484A Semiconductor devices with non-punch-through semiconductor channels having enhanced conduction and methods of making
06/01/2011CN102084483A Semiconductor element and manufacturing method therefor
06/01/2011CN102084482A Method of fabricating a semiconductor package or circuit assembly using a fluxing underfill composition applied to solder contact points in a dip process
06/01/2011CN102084479A Wafer level integration module with interconnects
06/01/2011CN102084478A Method for making a structure comprising a step for implanting ions in order to stabilize the adhesive bonding interface
06/01/2011CN102084477A Contacting device
06/01/2011CN102084476A Support body and substrate storage container
06/01/2011CN102084475A Plasma-facing probe arrangement including vacuum gap for use in a plasma processing chamber
06/01/2011CN102084474A Capacitively-coupled electrostatic (CCE) probe arrangement for detecting dechucking in a plasma processing chamber and methods thereof
06/01/2011CN102084473A Capacitively-coupled electrostatic (CCE) probe arrangement for detecting strike step in a plasma processing chamber and methods thereof
06/01/2011CN102084472A RF-biased capacitively-coupled electrostatic (RFB-CCE) probe arrangement for characterizing a film in a plasma processing chamber
06/01/2011CN102084471A Passive capacitively-coupled electrostatic (CCE) probe arrangement for detecting plasma instabilities in a plasma processing chamber
06/01/2011CN102084470A Capping layers for metal oxynitride tfts
06/01/2011CN102084469A 等离子体处理装置 The plasma processing apparatus
06/01/2011CN102084468A Adjustable gap capacitively coupled RF plasma reactor including lateral bellows and non-contact particle seal
06/01/2011CN102084467A Process for fabricating nanowire arrays
06/01/2011CN102084466A Modular base-plate semiconductor polisher architecture
06/01/2011CN102084465A Polishing composition and polishing method using the same
06/01/2011CN102084464A Epitaxial lift off stacks and methods
06/01/2011CN102084463A Dielectric cap above floating gate
06/01/2011CN102084462A Method for reducing tungsten roughness and improving reflectivity
06/01/2011CN102084461A Apparatuses for atomic layer deposition
06/01/2011CN102084460A Method and apparatus for chemical vapor deposition reactor
06/01/2011CN102084459A Multi-junction silicon thin film solar cell using plasma inside vapor deposition
06/01/2011CN102084458A Device and process for wet treating a peripheral area of a wafer-shaped article
06/01/2011CN102084301A Coating composition and pattern-forming method
06/01/2011CN102084300A Fine pattern mask, method for producing the same, and method for forming fine pattern using the mask
06/01/2011CN102084027A Surface treatment method for treating surface of substrate to be highly hydrophobic
06/01/2011CN102084023A Magnetron sputtering method, and magnetron sputtering device
06/01/2011CN102083921A Method of preparing an electrical insulation film and application for the metallization of through-vias
06/01/2011CN102083720A Swirl flow forming body and non-contact conveying device
06/01/2011CN102083598A Fret bar for ingot slicing, ingot to which fret bar is stuck, and ingot cutting method using fret bar
06/01/2011CN102083278A Method of manufacturing printed circuit board
06/01/2011CN102082220A LED and manufacturing process thereof
06/01/2011CN102082219A Method for manufacturing encapsulation of light emitting diode
06/01/2011CN102082182A Polycrystalline diode applying germanium-silicon process and manufacturing method thereof
06/01/2011CN102082180A Thin film transistor, display device, and electronic device
06/01/2011CN102082178A Vertical thin film transistor (TFT) and manufacturing method thereof as well as display device and manufacturing method thereof
06/01/2011CN102082176A Gallium nitride (GaN) enhancement type metal insulator semiconductor field effect transistor (MISFET) device and manufacturing method thereof
06/01/2011CN102082174A High voltage devices and methods for forming the high voltage devices
06/01/2011CN102082173A Raceway-shaped N-type laterally diffused metal oxide semiconductor (NLDMOS) transistor and manufacturing method thereof
06/01/2011CN102082172A Polycrystalline triode manufactured by applying germanium silicon technology and manufacture method thereof
06/01/2011CN102082171A Electrode of semiconductor device and method for fabricating capacitor
06/01/2011CN102082168A Staggered column superjunction
06/01/2011CN102082160A Resistive random access memory and manufacturing method thereof
06/01/2011CN102082150A Flexible display and method for manufacturing the same
06/01/2011CN102082148A ESD (electrostatic discharge) protection circuit and manufacturing method thereof
06/01/2011CN102082147A Multiple layer barrier metal for device component formed in contact trench
06/01/2011CN102082145A Wafer and method for forming the same
06/01/2011CN102082144A Electro-static discharge (ESD) protection structure in silicon-on-insulator (SOI) circuit and manufacturing method thereof
06/01/2011CN102082131A Chip package and fabrication method thereof
06/01/2011CN102082130A Semiconductor package piece and manufacturing method thereof
06/01/2011CN102082129A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
06/01/2011CN102082128A Semiconductor package and method of mounting semiconductor die to opposite sides of tsv substrate
06/01/2011CN102082127A Method for manufacturing semiconductor device
06/01/2011CN102082126A Method for manufacturing semiconductor device
06/01/2011CN102082125A Manufacture method of power MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor)
06/01/2011CN102082124A Method for manufacturing gate gap wall in multiple device integrating process
06/01/2011CN102082123A Semiconductor element and manufacturing method thereof