| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/30/2011 | US20110159645 Methods of forming a memory array with a pair of memory-cell strings to a single conductive pillar |
| 06/30/2011 | US20110159644 Semiconductor device and a method of manufacturing the same |
| 06/30/2011 | US20110159643 Fabrication method of semiconductor package structure |
| 06/30/2011 | US20110159642 Tape for holding chip, method of holding chip-shaped workpiece, method of manufacturing semiconductor device using tape for holding chip, and method of manufacturing tape for holding chip |
| 06/30/2011 | US20110159641 Method of manufacturing semiconductor device |
| 06/30/2011 | US20110159640 Multiple integrated circuit die package with thermal performance |
| 06/30/2011 | US20110159639 Method for Making a Stackable Package |
| 06/30/2011 | US20110159638 Method for Making a Chip Package |
| 06/30/2011 | US20110159636 Edge deletion of thin-layer solar modules by etching |
| 06/30/2011 | US20110159631 Method of fabricating backside illuminated image sensor |
| 06/30/2011 | US20110159627 Method for fabricating a sensor |
| 06/30/2011 | US20110159626 Micro-Electro-Mechanical Device And Method Of Manufacturing The Same |
| 06/30/2011 | US20110159620 Method to form semiconductor laser diode |
| 06/30/2011 | US20110159618 Method for Manufacturing Oxide Thin Film Transistor and Method for Manufacturing Display Device |
| 06/30/2011 | US20110159617 Dual layer color-center patterned light source |
| 06/30/2011 | US20110159616 Method of manufacturing light emitting diode |
| 06/30/2011 | US20110159615 Led units fabrication method |
| 06/30/2011 | US20110159611 Method for manufacturing soi substrate and method for manufacturing semiconductor device |
| 06/30/2011 | US20110159609 Method of manufacturing semiconductor device |
| 06/30/2011 | US20110159443 Method of forming a pattern in a semiconductor device and method of forming a gate using the same |
| 06/30/2011 | US20110159417 Method for manufacturing a photomask |
| 06/30/2011 | US20110159256 Treatment for a microelectronic device and method of resisting damage to a microelectronic device using same |
| 06/30/2011 | US20110158774 Substrate processing apparatus and method |
| 06/30/2011 | US20110158773 Apparatus and methods for transporting and processing substrates |
| 06/30/2011 | US20110158582 Structure of a semiconductor device having a waveguide and method of forming the same |
| 06/30/2011 | US20110158581 Optoelectronic device and method of forming the same |
| 06/30/2011 | US20110158439 Silicon Microphone Transducer |
| 06/30/2011 | US20110158278 Hybrid silicon vertical cavity laser with in-plane coupling |
| 06/30/2011 | US20110158277 Group-iii nitride semiconductor laser device, method of fabricating group-iii nitride semiconductor laser device, and epitaxial substrate |
| 06/30/2011 | US20110158276 Group-iii nitride semiconductor laser device, and method of fabricating group-iii nitride semiconductor laser device |
| 06/30/2011 | US20110158275 Group-iii nitride semiconductor laser device, and method of fabricating group-iii nitride semiconductor laser device |
| 06/30/2011 | US20110157974 Novel cell array for highly-scalable , byte-alterable, two-transistor FLOTOX EEPROM non-volatile memory |
| 06/30/2011 | US20110157959 Semiconductor storage device, memory cell array, and a fabrication method and drive method of a semiconductor storage device |
| 06/30/2011 | US20110157761 Electrostatic chuck |
| 06/30/2011 | US20110157760 Electrostatic chuck with reduced arcing |
| 06/30/2011 | US20110157570 Lithographic apparatus |
| 06/30/2011 | US20110157526 Electrode contact structure, liquid crystal display apparatus including same, and method for manufacturing electrode contact structure |
| 06/30/2011 | US20110157507 Liquid crystal display device and method for fabricating the same |
| 06/30/2011 | US20110157445 Semiconductor device and method of manufacturing the same, and electronic apparatus |
| 06/30/2011 | US20110157039 Liquid crystal display device and method of fabricating the same |
| 06/30/2011 | US20110156995 Thin film transistor array substrate, liquid crystal display device including the same and fabricating methods thereof |
| 06/30/2011 | US20110156810 Integrated dmos and schottky |
| 06/30/2011 | US20110156755 Flexible cmos library architecture for leakage power and variability reduction |
| 06/30/2011 | US20110156736 Semiconductor apparatus and probe test method thereof |
| 06/30/2011 | US20110156682 Voltage converter with integrated schottky device and systems including same |
| 06/30/2011 | US20110156679 Integrated trench guarded schottky diode compatible with powerdie, structure and method |
| 06/30/2011 | US20110156286 Semiconductor device and manufacturing method thereof |
| 06/30/2011 | US20110156285 Integrated alignment and overlay mark, and method for detecting errors of exposed positions thereof |
| 06/30/2011 | US20110156284 Device and method for alignment of vertically stacked wafers and die |
| 06/30/2011 | US20110156283 Use of die backside films to modulate EOL coplanarity of thin packages while providing thermal capability and laser markability of packages |
| 06/30/2011 | US20110156280 Dicing tape-integrated film for semiconductor back surface |
| 06/30/2011 | US20110156279 Film for flip chip type semiconductor back surface |
| 06/30/2011 | US20110156278 Film for flip chip type semiconductor back surface |
| 06/30/2011 | US20110156277 Dicing tape-integrated film for semiconductor back surface |
| 06/30/2011 | US20110156276 Patch on interposer assembly and structures formed thereby |
| 06/30/2011 | US20110156275 Integrated circuit packaging system having planar interconnect and method for manufacture thereof |
| 06/30/2011 | US20110156270 Contact elements of semiconductor devices formed on the basis of a partially applied activation layer |
| 06/30/2011 | US20110156268 Semiconductor Process, Semiconductor Element and Package Having Semiconductor Element |
| 06/30/2011 | US20110156267 Semiconductor Process, Semiconductor Element and Package Having Semiconductor Element |
| 06/30/2011 | US20110156266 Methods for forming through-substrate conductor filled vias, and electronic assemblies formed using such methods |
| 06/30/2011 | US20110156262 Semiconductor device with buried gate and method for fabricating the same |
| 06/30/2011 | US20110156261 Integrated circuit package and method of making same |
| 06/30/2011 | US20110156258 Semiconductor device having through via and method for fabricating the same |
| 06/30/2011 | US20110156257 Semiconductor device and method for manufacturing the same |
| 06/30/2011 | US20110156256 Electromigration-resistant under-bump metallization of nickel-iron alloys for sn-rich solder bumps of pb-free flip-chip applications |
| 06/30/2011 | US20110156254 Modified chip attach process |
| 06/30/2011 | US20110156252 Semiconductor package having electrical connecting structures and fabrication method thereof |
| 06/30/2011 | US20110156250 Flip-chip fan-out wafer level package for package-on-package applications, and method of manufacture |
| 06/30/2011 | US20110156248 Semiconductor device and method for manufacturing the same |
| 06/30/2011 | US20110156247 Semiconductor Package and Method for Making the Same |
| 06/30/2011 | US20110156246 Semiconductor Package and Method for Making the Same |
| 06/30/2011 | US20110156245 Method and Apparatus for Cooling an Integrated Circuit |
| 06/30/2011 | US20110156242 Semiconductor package and method of manufacturing the same |
| 06/30/2011 | US20110156241 Package substrate and method of fabricating the same |
| 06/30/2011 | US20110156240 Reliable large die fan-out wafer level package and method of manufacture |
| 06/30/2011 | US20110156239 Method for manufacturing a fan-out embedded panel level package |
| 06/30/2011 | US20110156237 Fan-out chip scale package |
| 06/30/2011 | US20110156236 Thermally enhanced expanded wafer level package ball grid array structure and method of making the same |
| 06/30/2011 | US20110156235 Flip chip package having enhanced thermal and mechanical performance |
| 06/30/2011 | US20110156234 Self repairing ic package design |
| 06/30/2011 | US20110156231 Recessed and embedded die coreless package |
| 06/30/2011 | US20110156230 Multi-stacked semiconductor dice scale package structure and method of manufacturing same |
| 06/30/2011 | US20110156229 Semiconductor device and manufacturing method therefor |
| 06/30/2011 | US20110156225 Semiconductor device and method of manufacturing the same |
| 06/30/2011 | US20110156224 Circuit-substrate laminated module and electronic apparatus |
| 06/30/2011 | US20110156223 Structure and method to create stress trench |
| 06/30/2011 | US20110156222 Silicon Wafer and Manufacturing Method Thereof |
| 06/30/2011 | US20110156221 Method For Producing Ceramic Passivation Layers on Silicon For Solar Cell Manufacture |
| 06/30/2011 | US20110156220 Manufacturing method of semiconductor device and semiconductor device |
| 06/30/2011 | US20110156217 Power devices having reduced on-resistance and methods of their manufacture |
| 06/30/2011 | US20110156215 Silicone Wafer and Production Method Therefor |
| 06/30/2011 | US20110156214 Structure of thin nitride film and formation method thereof |
| 06/30/2011 | US20110156213 Method of manufacturing nitride substrate, and nitride substrate |
| 06/30/2011 | US20110156212 Methods of fabricating semiconductor structures or devices using layers of semiconductor material having selected or controlled lattice parameters |
| 06/30/2011 | US20110156207 Mim capacitor with plate having high melting point |
| 06/30/2011 | US20110156204 Semiconductor Package and Method for Making the Same |
| 06/30/2011 | US20110156201 Air gap fabricating method |
| 06/30/2011 | US20110156199 Low leakage and/or low turn-on voltage schottky diode |
| 06/30/2011 | US20110156181 Semiconductor device and manufacturing method of semiconductor device |
| 06/30/2011 | US20110156180 Package structure having micro-electromechanical element and fabrication method thereof |