H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2011
08/11/2011	WO2010096241A8 Modulation-doped halo in quantum well field-effect transistors, apparatus made therewith, and methods of using same
08/11/2011	WO2010062822A3 Electrodeposition of copper in microelectronics with dipyridyl-based levelers
08/11/2011	WO2010015301A8 Passivation of etched semiconductor structures
08/11/2011	US20110195583 Wavelength converting layer for a light emitting device
08/11/2011	US20110195582 CVD Precursors
08/11/2011	US20110195581 Structure and method to enhance both nfet and pfet performance using different kinds of stressed layers
08/11/2011	US20110195580 Method for forming laminated structure including amorphous carbon film
08/11/2011	US20110195579 Scribe-line draining during wet-bench etch and clean processes
08/11/2011	US20110195578 Planar cell on cut using in-situ polymer deposition and etch
08/11/2011	US20110195577 Semiconductor device manufacturing method and plasma etching apparatus
08/11/2011	US20110195576 Double patterning strategy for contact hole and trench in photolithography
08/11/2011	US20110195575 novel hard mask removal method
08/11/2011	US20110195574 Niobium and vanadium organometallic precursors for thin film deposition
08/11/2011	US20110195573 Cleaning liquid for lithography and method for forming wiring
08/11/2011	US20110195572 Chip-stacked semiconductor device and manufacturing method thereof
08/11/2011	US20110195571 Semiconductor process
08/11/2011	US20110195570 Integration of bottom-up metal film deposition
08/11/2011	US20110195569 Semiconductor Device and Method for Forming the Same
08/11/2011	US20110195568 Semiconductor structure, method for manufacturing semiconductor structure and semiconductor package
08/11/2011	US20110195567 Method for manufacturing semiconductor device
08/11/2011	US20110195566 Method of manufacturing a semiconductor device
08/11/2011	US20110195565 Semiconductor Devices and Methods of Manufacture Thereof
08/11/2011	US20110195564 Memory Cell Layout
08/11/2011	US20110195563 Method of manufacturing silicon carbide semiconductor device
08/11/2011	US20110195562 Sputtering Apparatus, Thin-Film Forming Method, and Manufacturing Method for a Field Effect Transistor
08/11/2011	US20110195561 Adhesive sheet
08/11/2011	US20110195560 Method of producing a silicon-on-sapphire type heterostructure
08/11/2011	US20110195559 Method of forming shallow trench isolation structure
08/11/2011	US20110195558 Non-volatile semiconductor memory device and method of manufacturing the same
08/11/2011	US20110195557 Method for forming low resistance and uniform metal gate
08/11/2011	US20110195556 Power mosfet with a gate structure of different material
08/11/2011	US20110195555 Techniques for FinFET Doping
08/11/2011	US20110195554 Strain Bars in Stressed Layers of MOS Devices
08/11/2011	US20110195553 Method of fabricating semiconductor device
08/11/2011	US20110195552 Method for manufacturing semiconductor device
08/11/2011	US20110195551 Semiconductor devices having bit line interconnections with increased width and reduced distance from corresponding bit line contacts and methods of fabricating such devices
08/11/2011	US20110195550 Method of manufacturing semiconductor device
08/11/2011	US20110195549 Gate stack for high-k/metal gate last process
08/11/2011	US20110195548 Method of fabricating gate electrode using a treated hard mask
08/11/2011	US20110195547 Methods for forming interconnect structures for integration of multi layered integrated circuit devices
08/11/2011	US20110195546 Stacking package structure with chip embedded inside and die having through silicon via and method of the same
08/11/2011	US20110195545 Package process
08/11/2011	US20110195544 Solder bump structure for flip chip semiconductor devices and method of manufacture therefor
08/11/2011	US20110195543 Flip-chip assembly with organic chip carrier having mushroom-plated solder resist opening
08/11/2011	US20110195542 Method of providing solar cell electrode by electroless plating and an activator used therein
08/11/2011	US20110195541 Composition for forming n-type diffusion layer, method for forming n-type diffusion layer, and method for producing photovoltaic cell
08/11/2011	US20110195540 Composition for forming p-type diffusion layer, method for forming p-type diffusion layer, and method for producing photovoltaic cell
08/11/2011	US20110195537 Optical device wafer processing method
08/11/2011	US20110195536 Optical device wafer processing method
08/11/2011	US20110195535 Optical device wafer processing method
08/11/2011	US20110195534 Liquid Crystal Display Device and a Manufacturing Method of the Same
08/11/2011	US20110195531 Apparatus and method for evaluating optical properties of led and method for manufacturing led device
08/11/2011	US20110195530 Semiconductor device and a method of manufacturing the same
08/11/2011	US20110195529 Rule-Based Semiconductor Die Stacking And Bonding Within A Multi-Die Package
08/11/2011	US20110195528 Polishing system with in-line and in-situ metrology
08/11/2011	US20110195257 Semiconductor device and fabricating method thereof
08/11/2011	US20110194924 Method for transporting object to be processed in semiconductor manufacturing apparatus
08/11/2011	US20110194751 Pattern verification method, pattern generating method, device fabrication method, pattern verification program, and pattern verification system
08/11/2011	US20110194356 Methods of forming and operating semiconductor device
08/11/2011	US20110194341 Spin-torque based memory device with read and write current paths modulated with a non-linear shunt resistor
08/11/2011	US20110194112 Semiconductor wafer alignment markers, and associated systems and methods
08/11/2011	US20110194095 Exposure apparatus and photomask
08/11/2011	US20110194045 Electro-optic displays, and components for use therein
08/11/2011	US20110194041 Array substrate of liquid crystal display device and repair method thereof
08/11/2011	US20110193657 Resonance Filter Having Low Loss
08/11/2011	US20110193638 Terahertz oscillators and methods of manufacturing electron emitters
08/11/2011	US20110193362 Electroadhesive gripping
08/11/2011	US20110193361 Robot arm plate
08/11/2011	US20110193244 Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device
08/11/2011	US20110193243 Unique Package Structure
08/11/2011	US20110193241 Chip package and method for forming the same
08/11/2011	US20110193237 Method for making semiconductor package
08/11/2011	US20110193236 Semiconductor substrate, semiconductor device, and manufacturing methods thereof
08/11/2011	US20110193232 Conductive pillar structure for semiconductor substrate and method of manufacture
08/11/2011	US20110193231 Electronic device package and method for fabricating the same
08/11/2011	US20110193230 Formation of air gap with protection of metal lines
08/11/2011	US20110193227 Methods and Apparatus for Robust Flip Chip Interconnections
08/11/2011	US20110193226 Microelectronic devices with through-substrate interconnects and associated methods of manufacturing
08/11/2011	US20110193225 Electronic device package and fabrication method thereof
08/11/2011	US20110193223 Semiconductor device, chip-on-chip mounting structure, method of manufacturing the semiconductor device, and method of forming the chip-on-chip mounting structure
08/11/2011	US20110193222 Semiconductor module, method for fabricating the semiconductor module, and mobile apparatus
08/11/2011	US20110193221 3DIC Architecture with Interposer for Bonding Dies
08/11/2011	US20110193220 Pillar Structure having a Non-Planar Surface for Semiconductor Devices
08/11/2011	US20110193219 Semiconductor device and semiconductor assembly with lead-free solder
08/11/2011	US20110193218 Solder Interconnect with Non-Wettable Sidewall Pillars and Methods of Manufacture
08/11/2011	US20110193217 Manufacturing of a Device Including a Semiconductor Chip
08/11/2011	US20110193212 Systems and Methods Providing Arrangements of Vias
08/11/2011	US20110193211 Surface Preparation of Die for Improved Bonding Strength
08/11/2011	US20110193210 Image sensor package with trench insulator and fabrication method thereof
08/11/2011	US20110193208 Semiconductor package of a flipped mosfet and its manufacturing method
08/11/2011	US20110193203 Semiconductor device and method of manufacturing the same
08/11/2011	US20110193201 Method to fabricate and treat a structure of semiconductor-on-insulator type, enabling displacement of dislocations, and corresponding structure
08/11/2011	US20110193200 Semiconductor wafer chip scale package test flow and dicing process
08/11/2011	US20110193199 Electromigration immune through-substrate vias
08/11/2011	US20110193197 Structure and method for making crack stop for 3d integrated circuits
08/11/2011	US20110193195 Virtual substrates for epitaxial growth and methods of making the same
08/11/2011	US20110193194 Thin film mim capacitors and manufacturing method therefor
08/11/2011	US20110193193 Structure and method for forming isolation and buried plate for trench capacitor
08/11/2011	US20110193192 Stacked-Die Electronics Package with Planar and Three-Dimensional Inductor Elements
08/11/2011	US20110193190 Semiconductor material manufacture

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